Abstract: A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4?-diphenylmethane diisocyanate, a modified product of 4,4?-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

Abstract: A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

Abstract: A film capacitor that includes a dielectric resin film made of a thermosetting urethane resin; and a metal layer on at least one surface of the dielectric resin film, wherein the dielectric resin film contains at least an isocyanate group and a carbonyl group, and a ratio of a first absorption peak intensity of the isocyanate group in a wave number range of 2200 cm?1 to 2350 cm?1 to a second absorption peak intensity of the carbonyl group in a wave number range of 1650 cm?1 to 1800 cm?1 is 0.08 to 1.15.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150° C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

Abstract: A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4?-diphenylmethane diisocyanate, a modified product of 4,4?-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

Abstract: A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cm2 is 3 m or less, and an average depth of the linear recess is 0.01 ?m to 1.3 ?m.

Abstract: A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.

Abstract: A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150° C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

Abstract: A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cm2 is 3 m or less, and an average depth of the linear recess is 0.01 ?m to 1.3 ?m.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

Abstract: A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan ? of 0.3% or less at a temperature of 125° C. The mixture has a glass transition temperature of 130° C. or higher and preferably 280° C. or lower.

Abstract: To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.

Abstract: To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130° C. or higher and a breakdown voltage of 350 V/?m or more.