Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of ?2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is ?2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a group represented by General Formula (1) and a compound that generates an acid upon irradiation with actinic rays or radiation.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound that generates an acid upon irradiation with actinic rays or radiation and a resin whose polarity increases by the action of an acid, in which the compound is represented by a specific General Formula (X).

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound that generates an acid upon irradiation with actinic rays or radiation and a resin whose polarity increases by the action of an acid, in which the compound is represented by a specific General Formula (X).

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of ?2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is ?2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition is an actinic ray-sensitive or radiation-sensitive resin composition including a compound that generates an acid upon irradiation with actinic rays or radiation and a resin capable of increasing polarity by the action of an acid, in which the resin includes a repeating unit represented by General Formula (B-1) and at least one halogen atom selected from the group consisting of a fluorine atom and an iodine atom.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a group represented by General Formula (1) and a compound that generates an acid upon irradiation with actinic rays or radiation.

Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127)??Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.

Abstract: Provide are a pattern forming method including a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin having an acid-decomposable repeating unit capable of decomposing by the action of an acid to generate an acid having a pKa of 3.0 or less, a step (2) of exposing the film using actinic rays or radiation, and a step (3) of carrying out development using a developer including an organic solvent after the exposure to form a negative tone pattern; and a method for manufacturing an electronic device, including the pattern forming method.

Abstract: There is provided an active light sensitive or radiation sensitive resin composition which contains (A) an alkali soluble resin and (C) a cross-linking agent represented by the following General Formula (1-0).

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).

Abstract: A chemical amplification resist composition according to the present invention includes (A) a compound including a triarylsulfonium cation having one or more fluorine atoms and capable of generating an acid with a volume of 240 ?3 or higher by irradiation of active rays or radiation; and (B) a compound including a phenolic hydroxyl group.

Abstract: The pattern forming method includes (1) a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, (2) a step of exposing the film with actinic rays or radiation, and (3) a step of developing the exposed film using a developer containing an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin (1) having a repeating unit (a) having an aromatic ring and a repeating unit (b) represented by a specific general formula, and the content of the repeating unit (a) is 55% by mole or more with respect to all the repeating units of the acid-decomposable resin (1). The method for manufacturing an electronic device includes the pattern forming method.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) having a phenolic hydroxyl group, and a crosslinking agent (C) having two or more hydroxymethyl groups or alkoxymethyl groups in total within the molecule, wherein the composition contains a crosslinking agent (C1) having a molecular weight of 420 or more and also having two to four hydroxymethyl groups or alkoxymethyl groups in total within the molecule in a proportion of 60 mol % to 100 mol % based on the total amount of the crosslinking agent (C) including the crosslinking agent (C1), and in which the total concentration of the hydroxymethyl groups or the alkoxymethyl groups of the crosslinking agent (C) relative to 1 g of the solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 0.30 mmol/g or more.

Abstract: Provided are a pattern forming method for obtaining a pattern which is excellent in etching resistance and in which occurrence of pattern collapse can be suppressed, and a method for manufacturing an electronic device including the pattern forming method. The pattern forming method includes a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin A having a repeating unit represented by General Formula (I) and a repeating unit represented by General Formula (BII), a step of exposing the film, and a step of developing the exposed film using a developer containing an organic solvent, to form a pattern.