Abstract: The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

Abstract: The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

Abstract: To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output. The gas heated by the heating units or the gas cooled down by the cooling units is sent to the blowing nozzles 2 by a fan. Then, the blowing nozzles 2 blow the gas sent by the fan through their outlets. Each of the outlets has a non-circular planar shape with a projection portion thereof being projected inwardly. This allows a shape of the gas in cross section perpendicular to a direction where the gas is blown through the outlet of each of the blowing nozzles 2 to be changed by the projection portion with time (switching phenomenon). Such a switching phenomenon enables to be increased the heat exchanger effectiveness (heat transfer rate) on the printed board even if any output of the fan motor for rotating the fan does not increase.

Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients ? plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient ? in the evacuation control property.

Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients ? plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient ? in the evacuation control property.

Abstract: To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output. The gas heated by the heating units or the gas cooled down by the cooling units is sent to the blowing nozzles 2 by a fan. Then, the blowing nozzles 2 blow the gas sent by the fan through their outlets. Each of the outlets has a non-circular planar shape with a projection portion thereof being projected inwardly. This allows a shape of the gas in cross section perpendicular to a direction where the gas is blown through the outlet of each of the blowing nozzles 2 to be changed by the projection portion with time (switching phenomenon). Such a switching phenomenon enables to be increased the heat exchanger effectiveness (heat transfer rate) on the printed board even if any output of the fan motor for rotating the fan does not increase.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).

Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).