Patents by Inventor Tomotsugu Aoyama
Tomotsugu Aoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11876030Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.Type: GrantFiled: December 3, 2018Date of Patent: January 16, 2024Assignees: DOWA HOLDINGS CO., LTD., THE GOODSYSTEM CORPORATIONInventors: Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho
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Publication number: 20220162734Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.Type: ApplicationFiled: January 30, 2020Publication date: May 26, 2022Applicant: DOWA METALTECH CO., LTD.Inventors: Kazuki Yoshida, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
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Patent number: 11293084Abstract: An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900° C. to 400° C.; cooling the hot-rolled copper alloy at 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600° C.Type: GrantFiled: October 24, 2017Date of Patent: April 5, 2022Assignee: Dowa Metaltech Co., Ltd.Inventors: Naota Higami, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
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Patent number: 11285701Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.Type: GrantFiled: February 25, 2020Date of Patent: March 29, 2022Assignees: THEGOODSYSTEM CORP., DOWA METALTECH CO., LTD.Inventors: Meoung-whan Cho, Il-ho Kim, Seog-woo Lee, Young-suk Kim, Hiroto Narieda, Tomotsugu Aoyama
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Publication number: 20210175147Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.Type: ApplicationFiled: December 3, 2018Publication date: June 10, 2021Applicants: Dowa Holdings Co., Ltd., The Goodsystem CorporationInventors: Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho
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Patent number: 10844468Abstract: A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.Type: GrantFiled: August 26, 2014Date of Patent: November 24, 2020Assignee: DOWA METALTECH CO., LTD.Inventors: Kuniaki Miyagi, Takashi Suga, Tomotsugu Aoyama, Hiroto Narieda, Hideki Endo, Akira Sugawara
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Publication number: 20200290316Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.Type: ApplicationFiled: February 25, 2020Publication date: September 17, 2020Inventors: Meoung-whan CHO, Il-ho KIM, Seog-woo LEE, Young-suk KIM, Hiroto NARIEDA, Tomotsugu AOYAMA
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Patent number: 10745787Abstract: A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NA Of fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mm2 or more and a ratio NB/NA of a number density NB (per 0.012 mm2) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the NA of 0.50 or less.Type: GrantFiled: August 29, 2016Date of Patent: August 18, 2020Assignee: DOWA METALTECH CO., LTD.Inventors: Tsuyoshi Ito, Kuniaki Miyagi, Hiroto Narieda, Tomotsugu Aoyama, Akira Sugawara
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Publication number: 20190264313Abstract: There are provided an inexpensive sheet material of a copper alloy having an excellent bending workability and an excellent stress corrosion cracking resistance while maintaining a high strength, and a method for producing the same. The sheet material of the copper alloy is produced by a method comprising the steps of: melting and casting raw materials of a copper alloy which has a chemical composition comprising 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.01 to 2.0% by weight of silicon, 0.01 to 5.0% by weight of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy in a temperature range of from 900° C. to 400° C.; cooling the hot-rolled copper alloy at a cooling rate of 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at a temperature of 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at a temperature of 300 to 600° C.Type: ApplicationFiled: October 24, 2017Publication date: August 29, 2019Applicant: Dowa Metaltech Co., Ltd.Inventors: Naota Higami, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
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Patent number: 10180293Abstract: A method for producing a heat radiating plate, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler to obtain a strip; causing the strip to pass through a gap between the rolls of a leveler to correct the shape thereof; progressively feeding the corrected strip to a progressive die via a feeder to progressively press-working the strip to produce a heat radiating plate.Type: GrantFiled: September 28, 2016Date of Patent: January 15, 2019Assignee: DOWA METALTECH CO., LTD.Inventors: Tomotsugu Aoyama, Akira Sugawara
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Publication number: 20180274074Abstract: A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NA Of fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mm2 or more and a ratio NB/NA of a number density NB (per 0.012 mm2) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the NA of 0.50 or less.Type: ApplicationFiled: August 29, 2016Publication date: September 27, 2018Inventors: Tsuyoshi ITO, Kuniaki MIYAGI, Hiroto NARIEDA, Tomotsugu AOYAMA, Akira SUGAWARA
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Patent number: 9994933Abstract: A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I0{200}?1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I0{200}, and which satisfies I{200}/I{422}?15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.Type: GrantFiled: April 26, 2010Date of Patent: June 12, 2018Assignee: DOWA METAL TECH CO., LTD.Inventors: Weilin Gao, Tomotsugu Aoyama, Hisashi Suda, Hiroto Narieda, Akira Sugawara, Akifumi Onodera
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Publication number: 20170122681Abstract: In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1?L0) is 0.5 to 2.Type: ApplicationFiled: September 28, 2016Publication date: May 4, 2017Applicant: DOWA METALTECH CO., LTD.Inventors: Tomotsugu Aoyama, Akira Sugawara
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Publication number: 20160201179Abstract: A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %)’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.Type: ApplicationFiled: August 26, 2014Publication date: July 14, 2016Inventors: Kuniaki MIYAGI, Takashi SUGA, Tomotsugu AOYAMA, Hiroto NARIEDA, Hideki ENDO, Akira SUGAWARA
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Patent number: 9284628Abstract: A copper alloy sheet has a chemical composition containing 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9?(f{220}+f{311)+f{420})/(0.27·f{220}+0.49·f{311}+0.49·f{420}) 4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f{hkl}.Type: GrantFiled: May 21, 2009Date of Patent: March 15, 2016Assignee: DOWA METALTECH CO., LTD.Inventors: Tomotsugu Aoyama, Akira Sugawara
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Publication number: 20120049130Abstract: A copper alloy sheet has a chemical composition comprising 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9?(f{220}+f{311}+f{420})/(0.27·f{220}+0.49·f{311}+0.49·f{420})?4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f{hkl}.Type: ApplicationFiled: May 21, 2009Publication date: March 1, 2012Applicant: DOWA METALTECH CO., LTD.Inventors: Tomotsugu Aoyama, Akira Sugawara
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Publication number: 20100269959Abstract: A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I0{200}?1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I0{200}, and which satisfies I{200}/I{422}?15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.Type: ApplicationFiled: April 26, 2010Publication date: October 28, 2010Applicant: DOWA METALTECH CO., LTD.Inventors: Weilin Gao, Tomotsugu Aoyama, Hisashi Suda, Hiroto Narieda, Akira Sugawara, Akifumi Onodera
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Patent number: 6607593Abstract: When a crystalline nucleus generated from an under-cooled silicon droplet is grown up to a mono-crystalline silicon ball, a critical under-cooling &Dgr;Tcr is determined in response to a diameter d of the silicon droplet so as to satisfy the relationships of (d=5 mm, &Dgr;Tcr=100K), (d=3 mm, &Dgr;Tcr=120K) and (d=1 mm, &Dgr;Tcr=150K). A crystal grown up from the crystalline nucleus at an under-cooling &Dgr;T less than the critical under-cooling &Dgr;Tcr is a mono-crystalline silicon ball with high quality free from cracks or twins.Type: GrantFiled: July 27, 2001Date of Patent: August 19, 2003Assignee: Agency of Industrial Science and TechnologyInventors: Kazuhiko Kuribayashi, Tomotsugu Aoyama
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Publication number: 20020182875Abstract: When a crystalline nucleus generated from an under-cooled silicon droplet is grown up to a mono-crystalline silicon ball, a critical under-cooling &Dgr;Tcr is determined in response to a diameter d of the silicon droplet so as to satisfy the relationships of (d=5 mm, &Dgr;Tcr=100K), (d=3 mm, &Dgr;Tcr=120K) and (d=1 mm, &Dgr;Tcr=150K). A crystal grown up from the crystalline nucleus at an under-cooling &Dgr;T less than the critical under-cooling &Dgr;Tcr is a mono-crystalline silicon ball with high quality free from cracks or twins.Type: ApplicationFiled: July 27, 2001Publication date: December 5, 2002Applicant: The Director-General of the Institute of space and Space and Astronautical Science, a Japanese GoverInventors: Kazuhiko Kuribayashi, Tomotsugu Aoyama