Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: A display device with improved viewing angle characteristics is provided. A display device with suppressed mixture of colors between adjacent pixels is provided. The display device includes a first coloring layer, a second coloring layer, and a structure body therebetween. The structure body has a portion closer to a display surface side than a bottom surface of the first coloring layer or a bottom surface of the second coloring layer.

Abstract: A lighting device is provided with a structure body which has an inner surface including a region with a negative Fresnel lens shape and a high refractive index material layer which is closely in contact with the inner surface. The high refractive index material layer has a Fresnel lens shape in a region closely in contact with the inner surface, and a plane light-emitting body is provided over the structure body with the high refractive index material layer interposed therebetween. The high refractive index material layer is provided so as to fill at least the negative Fresnel lens shape of the structure body and thus has a surface including the region with the Fresnel lens shape at the interface with the structure body.

Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.

Abstract: The present invention relates to a donor substrate and a method of manufacturing a light-emitting device. The donor substrate includes a reflective layer including an opening portion, a light absorption layer covering the opening portion of the reflective layer over the reflective layer, a heat insulating layer including an opening portion in a position overlapped with the opening portion of the reflective layer over the light absorption layer, and a material layer including a light-emitting material covering the opening portion of the heat insulating layer over the heat insulating layer. A target substrate and the donor substrate are disposed to face each other, and an EL layer is formed over the target substrate by performing light irradiation from a rear surface of the donor substrate.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.

Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.

Abstract: The present invention provides a light-emitting element, a light-emitting device and an electronic device in which an optical path length through which generated light goes can be changed easily. The present invention provides a light-emitting element including a light-emitting layer between a first electrode and a second electrode, and a mixed layer in contact with the first electrode; in which the light-emitting layer includes a light-emitting substance; the mixed layer includes a hole transporting substance and a metal oxide showing an electron accepting property to the hole transporting substance, and has a thickness of 120 to 180 nm, and when a voltage is applied between the first electrode and the second electrode such that a potential of the first electrode is higher than that of the second electrode, the light-emitting substance emits light.

Abstract: A method for manufacturing a circuit board includes a first process, a second process, a third process, and a fourth process. The first process includes a step of providing a circuit and an electrode over a first surface of a first substrate. The second process includes a step of providing a reflective layer on the first surface side of the first substrate or a second surface side of a second substrate. The third process includes a step of attaching the first surface and the second surface to each other with a bonding layer therebetween to face each other so that the reflective layer overlaps with the electrode and the reflective layer surrounds part of the electrode. The fourth process includes a step of irradiating at least part of the reflective layer with laser light from a side opposite to the electrode.

Abstract: An object of the present invention is to provide a light-emitting element with high luminous efficiency, and a light-emitting element of low-voltage driving. Another object is to provide a light-emitting device with low power consumption by using the light-emitting element. Another object is to provide an electronic appliance with low power consumption by using the light-emitting device in a display portion. A light-emitting element includes, between a pair of electrodes, a layer containing a composite material of a first organic compound and an inorganic compound and a layer containing a second organic compound being in contact with the layer containing the composite material, wherein the second organic compound does not have a peak of an absorption spectrum in a wavelength region of 450 to 800 nm if the second organic compound is compounded with the inorganic compound.

Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

Abstract: An evaporation donor substrate that makes it possible to evaporate only a desired evaporation material in the case of performing deposition by an evaporation method. Thus, the use efficiency of an evaporation material can be increased resulting in reduction in production cost, and further a film with high uniformity can be deposited. The evaporation donor substrate can be obtained by forming a reflective layer having an opening over a substrate, forming a thermal insulation layer having a light-transmitting property separately over the substrate and the reflective layer, forming a light absorption layer over the thermal insulation layer, and forming a material layer over the light absorption layer.

Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.

Abstract: Provided is a light-emitting device having a light-emitting portion having a light-emitting element in a space surrounded by a support substrate, a metal substrate, and a sealing material, in which the sealing material is provided to surround the periphery of the light-emitting portion, the light-emitting element has a first electrode, a layer having a light-emitting organic compound, and a second electrode, the support substrate and the first electrode are each capable of transmitting light emitted from the light-emitting organic compound, and the space contains gas inert to the light-emitting element or is in a vacuum. The light-emitting device has, over the second electrode, a first high-emissivity layer that has higher emissivity than the second electrode and is thermally connected to the second electrode, and a low-reflectivity layer with which a metal substrate surface facing the support substrate is provided and which has lower reflectivity than the metal substrate.

Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.

Abstract: A lighting device with high emission efficiency and directivity is provided with the use of an organic EL element and a light-emitting diode. The lighting device includes a light-emitting diode whose emission wavelength peak is greater than or equal to 400 nm and less than or equal to 500 nm, a planar organic EL light-emitting body which emits light having a complementary color of that of light from the light-emitting diode, and a planar reflector. The organic EL light-emitting body and the reflector face each other to form a cone having an open end to which light is emitted. The light-emitting diode is provided in a space between a plane including a light-emitting surface of the organic EL light-emitting body and a plane including a reflecting surface of the reflector.