Patents by Inventor Tomoya Yamada

Tomoya Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7909908
    Abstract: A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 ?m and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: March 22, 2011
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Tomoya Yamada, Koji Hirata
  • Patent number: 7816338
    Abstract: The present invention provides short interfering ribonucleic acid (siRNA), compositions and methods for inhibiting the CAR gene expression simply and rapidly, which can be used for evaluating toxicity of a chemical substance.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: October 19, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Tomoya Yamada, Yukihiro Hirose
  • Publication number: 20100131950
    Abstract: Identifiers of a plurality of physical HBAs disposed in a real host are grouped into a virtual HBA(s) for each work application executed in the real host. A storage device of a management server manages a virtual HBA ID which is an identifier of the virtual HBA and physical HBA IDs which are identifiers of the grouped physical HBAs, which are associated with each other. A display device of the management server displays information on a virtual host in which the virtual HBA is virtually disposed.
    Type: Application
    Filed: January 26, 2009
    Publication date: May 27, 2010
    Inventors: Tomoya Yamada, Manabu Obana
  • Publication number: 20100086869
    Abstract: To provide a carrier for two-component electrophotographic developer not only having excellent fluidity but also having proper surface irregularities necessary for imparting electric charge, without generating cracks/chipping of particles even under an influence of stirring stress over a long period of time. A particle surface has raised parts of striped pattern extending almost continuously in a plurality of directions while being superposed on one another, with a surface formed with raised parts of striped pattern occupying 80% or more of the whole surface of a particle. Depths of grooves between the adjacent raised parts are 0.05 ?m or more and 0.2 ?m or less, average surface roughness Ra is 0.1 ?m or more and 0.3 ?m or less, roundness is 0.90 or more, and average particle size is 151 ?m or more and 100 ?m or less, and a carrier core material thus constituted is coated with resin. Thus, the carrier for two-component electrophotographic developer is prepared.
    Type: Application
    Filed: March 26, 2008
    Publication date: April 8, 2010
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Tomoya Yamada, Isao Fujita, Yoshiaki Aiki
  • Publication number: 20100075244
    Abstract: To provide a carrier for electrophotographic developer, capable of realizing a high image quality and full colorization and reducing carrier scattering, and a manufacturing method of the same, and an electrophotographic developer containing the carrier. A carrier core material for electrophotographic developer, with a general formula expressed by MgxMn(1-x)FeyO4 (where 0<x<1, and 1.6?y?2.4), wherein a half-value width B of a peak having a maximum intensity in a powder XRD pattern satisfies B?0.180 (degree), is manufactured and from this carrier core material for electrophotographic developer, the carrier for electrophotographic developer and the electrophotographic developer are manufactured.
    Type: Application
    Filed: April 9, 2008
    Publication date: March 25, 2010
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Tomoya Yamada, Takashi Fujiwara, Ryusuke Nakao, Yukihiro Matuda, Tomokazu Mouri
  • Publication number: 20100035174
    Abstract: To provide a carrier for an electrophotographic developer in which high image quality and full colorization are possible while carrier scattering is reduced, and a method for producing the carrier, and an electrophotographic developer including the carrier. A carrier core material for an electrophotographic developer is produced so that the half-value width B of a peak having a maximum intensity in an XRD pattern satisfies B?0.160 (degree). A carrier for an electrophotographic developer and an electrophotographic developer are produced from the carrier core material for an electrophotographic developer.
    Type: Application
    Filed: March 21, 2008
    Publication date: February 11, 2010
    Applicants: Dowa Electronics Materials Co., Ltd., Dowa IP Creation Co., Ltd.
    Inventors: Tomoya Yamada, Takashi Fujiwara, Ryusuke Nakao, Yukihiro Matuda, Tomokazu Mouri
  • Publication number: 20090267485
    Abstract: To provide a phosphor for manufacturing an one chip type LED illumination, etc, by combining a near ultraviolet/ultraviolet LED and a blue LED, and having an excellent emission efficiency including luminance. The phosphor is given as a general composition formula expressed by MmAaBbOoNn:Z, (where element M is one or more kinds of elements having bivalent valency, element A is one or more kinds of elements having tervalent valency, element B is one or more kinds of elements having tetravalent valency, O is oxygen, N is nitrogen, and element Z is one or more kinds of elements acting as an activator.), satisfying a=(1+x)×m, b=(4?x)×m, o=x×m, n=(7?x)×m, 0?x?1, wherein when excited by light in a wavelength range from 300 nm to 500 nm, the phosphor has an emission spectrum with a peak wavelength in a range from 500 nm to 620 nm.
    Type: Application
    Filed: July 14, 2006
    Publication date: October 29, 2009
    Applicant: Dowa Electronics Materials Co., Ltd
    Inventors: Akira Nagatomi, Kenji Sakane, Tomoya Yamada
  • Patent number: 7534283
    Abstract: A method of producing copper powder is provided that uses electrolytic cuprous oxide as the starting material for the production of copper powder suitable for a conductive filler whose particles have an average particle diameter of not greater than 1 ?m or even not greater than 0.5 ?m and are of uniform size. In one aspect, the method comprises a step of mixing cuprous oxide with a reducing agent in a liquor in which a protective colloid is present and to which a water-soluble copper salt has been added and in another aspect comprises a step of reducing a water-soluble copper salt in a liquor in which a protective colloid is present, thereby forming a slurry, and a step of reducing cuprous oxide in the presence of the slurry. As the water-soluble copper salt can be used, for example, 0.1-20 moles of a monovalent copper salt such as cuprous chloride per 100 moles of the cuprous oxide. As the protective colloid can be used 1-40 parts by mass of a water-soluble polymer per 100 parts by mass of the cuprous oxide.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: May 19, 2009
    Assignee: Dowa Electronics Materials., Ltd.
    Inventors: Tomoya Yamada, Koji Hirata
  • Publication number: 20090053298
    Abstract: The present invention provides short interfering ribonucleic acid (siRNA), compositions and methods for inhibiting the CAR gene expression simply and rapidly, which can be used for evaluating toxicity of a chemical substance.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 26, 2009
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tomoya YAMADA, Yukihiro HIROSE
  • Publication number: 20090050857
    Abstract: A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 ?m and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
    Type: Application
    Filed: October 17, 2008
    Publication date: February 26, 2009
    Inventors: Tomoya Yamada, Koji Hirata
  • Publication number: 20060213328
    Abstract: A method of producing copper powder is provided that uses electrolytic cuprous oxide as the starting material for the production of copper powder suitable for a conductive filler whose particles have an average particle diameter of not greater than 1 ?m or even not greater than 0.5 ?m and are of uniform size. In one aspect, the method comprises a step of mixing cuprous oxide with a reducing agent in a liquor in which a protective colloid is present and to which a water-soluble copper salt has been added and in another aspect comprises a step of reducing a water-soluble copper salt in a liquor in which a protective colloid is present, thereby forming a slurry, and a step of reducing cuprous oxide in the presence of the slurry. As the water-soluble copper salt can be used, for example, 0.1-20 moles of a monovalent copper salt such as cuprous chloride per 100 moles of the cuprous oxide. As the protective colloid can be used 1-40 parts by mass of a water-soluble polymer per 100 parts by mass of the cuprous oxide.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 28, 2006
    Inventors: Tomoya Yamada, Koji Hirata
  • Publication number: 20060185474
    Abstract: A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 ?m and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 24, 2006
    Inventors: Tomoya Yamada, Koji Hirata
  • Patent number: 5380572
    Abstract: A transparent pressure sensitive adhesive label sheet comprises a label film comprising a polyethylene resin of a density of 0.925 to 0.950 g/cm.sup.3 as the main component thereof, having an average of the tensile strength to the MD direction and the tensile strength to the TD direction of 250 kg/cm.sup.2 or more, a 1% secant modulus to the MD direction of 2500 to 5000 kg/cm.sup.2, a haze of 3 to 15% and a gloss of 80% or more and provided with the property suitable for printing by a surface treatment and a release paper laminated with the label film through a layer of a pressure sensitive adhesive material. An opaque pressure sensitive adhesive label sheet is about the same as the above except that it comprises a label film having a total light transmission of 40% or less in place of the haze and the gloss described above.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: January 10, 1995
    Assignee: Lintec Corporation
    Inventors: Terumitsu Kotani, Atusi Saitoh, Tomoya Yamada, Kohei Tachikawa, Yasuyuki Amano, Takeshi Ikeda