Patents by Inventor Tomoya Yamazaki
Tomoya Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240154164Abstract: Provided is a nonaqueous electrolyte solution for a lithium secondary battery, the nonaqueous electrolyte solution containing a compound (I) represented by Formula (I) and a compound (II) represented by Formula (II). In Formula (I), each of R1 and R2 independently represents a substituent such as an alkyl group having from 1 to 7 carbon atoms. In Formula (II), R3 represents an oxygen atom or the like; R4 represents a group represented by Formula (ii-1), a group represented by Formula (ii-2), or the like; and * represents a binding position. In Formula (ii-1), R41 represents an oxymethylene group or the like and, in Formula (ii-2), R42 represents an alkyl group having from 1 to 6 carbon atoms, or the like.Type: ApplicationFiled: January 17, 2022Publication date: May 9, 2024Applicants: MITSUI CHEMICALS, INC., DAIKIN INDUSTRIES, LTD.Inventors: Yusuke SHIMIZU, Hidenobu NOGI, Masahiro SUGURO, Yoshiko KUWAJIMA, Tomoya HIDAKA, Kae FUJIWARA, Shigeaki YAMAZAKI
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Publication number: 20240145780Abstract: An electrolyte solution capable of reducing the initial resistance of an electrochemical device, and an electrochemical device including the electrolyte solution. The electrolyte solution contains a compound represented by formula (I-1): wherein R111 to R113 are each individually a C1-C4 linear alkyl group, and wherein the compound (1-1) is present in an amount of 0.01-1000 mass ppm relative to the electrolyte solution.Type: ApplicationFiled: November 30, 2023Publication date: May 2, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Tomoya HIDAKA, Masakazu KINOSHITA, Yoshiko KUWAJIMA, Takaya YAMADA, Shigeaki YAMAZAKI, Yuuki SUZUKI, Kenzou TAKAHASHI
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Patent number: 11916195Abstract: An electrolyte solution containing a compound (1) represented by the formula (1), (wherein R101 and R102 are each individually a substituent such as a C1-C7 alkyl group, and the substituent optionally contains at least one divalent to hexavalent hetero atom in a structure or optionally has a structure obtained by replacing at least one hydrogen atom by a fluorine atom or a C0-C7 functional group) and at least one compound (11) selected from compounds such as a compound represented by formula (11-1) (wherein R111 and R112 are the same as or different from each other and are each a hydrogen atom or the like, and R113 is an alkyl group free from a fluorine atom or the like):Type: GrantFiled: March 11, 2019Date of Patent: February 27, 2024Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Masakazu Kinoshita, Tomoya Hidaka, Toshiharu Shimooka, Shigeaki Yamazaki, Hisako Nakamura, Takaya Yamada, Yuuki Suzuki, Yoshiko Kuwajima, Kenzou Takahashi, Akiyoshi Yamauchi, Kotaro Hayashi
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Publication number: 20230302537Abstract: The method for manufacturing an additively manufactured object includes: forming a precursor having an opening portion that communicates with an internal space, by jetting a liquid binder onto a powder layer to form solidified layers and stacking the formed solidified layers; forming a plug configured to be assembled with the opening portion; removing unsolidified powder remaining in the internal space from the opening portion; applying the liquid binder to an outer peripheral wall of the plug after removing the unsolidified powder; assembling the plug with the opening portion such that the outer peripheral wall of the plug comes into contact with an inner peripheral wall of the opening portion; and sintering the precursor having the plug assembled with the opening portion.Type: ApplicationFiled: March 23, 2023Publication date: September 28, 2023Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, ExOne KKInventors: Soichiro Yahagi, Tomoya Yamazaki, Kenji Yokoyama
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Patent number: 11072038Abstract: A method of manufacturing a mold includes the processes of: arranging a channel member in a recessed groove formed on a surface of a mold body; irradiating an opening part of the recessed groove with a first laser, thereby performing a first build-up welding on a part in the vicinity of the opening part of the recessed groove; and irradiating a region on a surface of the mold body including a region where the first build-up welding has been performed with a second laser, thereby performing a second build-up welding on a region on the surface of the mold body including the region where the first build-up welding has been performed.Type: GrantFiled: January 24, 2019Date of Patent: July 27, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Tomoya Yamazaki
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Publication number: 20190354533Abstract: An information processing device according to the application concerned includes a generating unit and a providing unit. The generating unit generates a rating function for each node of a second-type graph which is generated from a first-type graph in which predetermined elements are treated as nodes and the relationships among the elements are treated as links, and which indicates a futuristic state of the first-type graph. The providing unit provides the information related to the second-type graph based on the rating function for the each node as generated by the generating unit.Type: ApplicationFiled: February 25, 2019Publication date: November 21, 2019Applicant: YAHOO JAPAN CORPORATIONInventors: Tasuku MIYAZAKI, Hayato KOBAYASHI, Kohei SUGAWARA, Masaki NOGUCHI, Tomoya YAMAZAKI, Kazuki YAMAUCHI
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Publication number: 20190270163Abstract: A method of manufacturing a mold includes the processes of: arranging a channel member in a recessed groove formed on a surface of a mold body; irradiating an opening part of the recessed groove with a first laser, thereby performing a first build-up welding on a part in the vicinity of the opening part of the recessed groove; and irradiating a region on a surface of the mold body including a region where the first build-up welding has been performed with a second laser, thereby performing a second build-up welding on a region on the surface of the mold body including the region where the first build-up welding has been performed.Type: ApplicationFiled: January 24, 2019Publication date: September 5, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Tomoya YAMAZAKI
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Patent number: 8348321Abstract: A vehicle body structure for fitting a pillar garnish and a fender panel is provided which surely prevents a space formed in the surface of a vehicle body from being viewed as black. The vehicle body structure includes a resin-made pillar garnish on a front surface side of a pillar of a vehicle body, a steel-made fender panel having an end on an end of the pillar garnish, and a seal member sealing a space between respective ends of the pillar garnish and the fender panel. The pillar garnish has an extending portion which extends in a direction from the end of the pillar garnish to the end of the fender panel. The fender panel has a flange which extends in a direction from the end of the fender panel to the end of the pillar garnish. The seal member is mounted on the extending portion and the flange.Type: GrantFiled: October 18, 2010Date of Patent: January 8, 2013Assignee: Honda Motor Co., Ltd.Inventors: Tomoya Yamazaki, Toshihiko Hatakeyama
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Publication number: 20110089719Abstract: A vehicle body structure for fitting a pillar garnish and a fender panel is provided which surely prevents a space formed yin the surface of a vehicle body from being viewed as black. The vehicle body structure includes a resin-made pillar garnish on a front surface side of a pillar of a vehicle body, a steel-made fender panel having an end on an end of the pillar garnish, and a seal member sealing a space between respective ends of the pillar garnish and the fender panel. The pillar garnish has an extending portion which extends in a direction from the end of the pillar garnish to the end of the fender panel. The fender panel has a flange which extends in a direction from the end of the fender panel to the end of the pillar garnish. The seal member is mounted on the extending portion and the flange.Type: ApplicationFiled: October 18, 2010Publication date: April 21, 2011Applicant: HONDA MOTOR CO., LTD.Inventors: Tomoya Yamazaki, Toshihiko Hatakeyama
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Publication number: 20070245359Abstract: The present invention has been made to provide a communication control apparatus, a communication control program, and a communication driver registration method allowing communication between an application supporting a predetermined connection method and a peripheral device supporting a different connection method from that of the application. An information processing apparatus 310 includes a pseudo VCOM port driver 371 that supplies a first handle that an application 153 running on the information processing apparatus 310 uses for communication with a peripheral device 230; and a pseudo PnP filter 371 that acquires a second handle used for operation of a VCOM port driver 261 when receiving notification indicating that the peripheral device 230 is connected to a USB interface 212 of the information processing apparatus 310 and, when receiving a request made using the first handle from the application 153, uses the second handle to send the request to the VCOM port driver 261.Type: ApplicationFiled: August 28, 2006Publication date: October 18, 2007Applicants: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Tomoya Yamazaki, Tatsuya Takasugi
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Patent number: 5289116Abstract: An apparatus 1 for testing mixed signal electronic devices (i.e., devices, such as LSI devices, whose input/output signals include direct current signals, digital signals and analog signals, where the time relationship between the various input and output signals may be either synchronous or asynchronous) includes a master clock subsystem (MCLK-SS) 11, a subsystem group comprised of a digital master subsystem (DM-SS) 12, a digital slave subsystem (DS-SS) 13, a waveform generator subsystem (WG-SS) 14, a waveform digitizer subsystem (WD-SS) 15, a time measuring module (TMM) 16, and a direct current subsystem (DC-SS) 17, and an interfacing test head 18. The MCLK-SS 11 receives a master clock from a timing generator 21 or DSP 23 of the device under test (DUT) 186 and generates a first master clock MCLK1 and a second master clock MCLK2, each of which is synchronized with the master clock from the DUT.Type: GrantFiled: September 28, 1992Date of Patent: February 22, 1994Assignee: Hewlett Packard CompanyInventors: Jun Kurita, Kiyoyasu Hiwada, Nobuyuki Kasuga, Yoichiro Yamada, Shigeru Kuwano, Keita Gunji, Tomoya Yamazaki