Patents by Inventor Tomoya YAMAZAWA

Tomoya YAMAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
    Publication number: 20240132714
    Abstract: To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.
    Type: Application
    Filed: June 22, 2022
    Publication date: April 25, 2024
    Applicant: NAMICS CORPORATION
    Inventors: Yuki MATSUURA, Ayako SATO, Tomoya YAMAZAWA
  • Liquid sealing material for copper bump, and resin composition for use as same
    Patent number: 10941280
    Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: March 9, 2021
    Assignee: NAMICS CORPORATION
    Inventors: Tomoya Yamazawa, Haruyuki Yoshii
  • Epoxy resin composition, semiconductor sealing agent, and semiconductor device
    Patent number: 10196513
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: February 5, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Tomoya Yamazawa, Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe
  • Epoxy resin composition, semiconductor sealing agent, and semiconductor device
    Patent number: 9947604
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: April 17, 2018
    Assignee: NAMICS CORPORATION
    Inventors: Kazuyuki Kohara, Tomoya Yamazawa, Kodai Okoshi, Nobuyuki Abe
  • LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR USE AS SAME
    Publication number: 20170335090
    Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).
    Type: Application
    Filed: September 1, 2015
    Publication date: November 23, 2017
    Inventors: Tomoya YAMAZAWA, Haruyuki YOSHII
  • EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
    Publication number: 20170022356
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 26, 2017
    Inventors: Tomoya YAMAZAWA, Kazuyuki KOHARA, Kodai OKOSHI, Nobuyuki ABE
  • EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
    Publication number: 20170005021
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 5, 2017
    Inventors: Kazuyuki KOHARA, Tomoya YAMAZAWA, Kodai OKOSHI, Nobuyuki ABE