Patents by Inventor Tomoyo KAWAMURA

Tomoyo KAWAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927232
    Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: February 23, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Patent number: 10113054
    Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: October 30, 2018
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Patent number: 9902843
    Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: February 27, 2018
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo Kawamura, Masashi Okamoto, Yasukazu Shikano, Katsushi Watanabe
  • Publication number: 20180030236
    Abstract: The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid.
    Type: Application
    Filed: January 26, 2016
    Publication date: February 1, 2018
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Patent number: 9783677
    Abstract: The polyamide resin composition of the present invention contains (A) a polyamide resin, (B) a glass fiber including a compound having a carboxylic anhydride-containing unsaturated vinyl monomer, the compound being on at least a part of a surface of the glass fiber, and (C) a copolymer including a carboxylic anhydride-containing unsaturated vinyl monomer and having a glass transition temperature Tg of higher than 0° C.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: October 10, 2017
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo Kawamura, Teruaki Sakuma, Kazunori Terada
  • Publication number: 20170009050
    Abstract: The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an aluminic acid metal salt, and (C) an organic acid, wherein the content of the aluminic acid metal salt (B) is larger than 0.6 parts by mass based on 100 parts by mass of the polyamide resin (A).
    Type: Application
    Filed: February 19, 2015
    Publication date: January 12, 2017
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20160222196
    Abstract: A polyamide resin composition includes: (A) a polyamide resin; (B) an aluminic acid metal salt; and (C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and wherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).
    Type: Application
    Filed: September 24, 2014
    Publication date: August 4, 2016
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20160215109
    Abstract: The present invention provides a molded article comprising a polyamide resin composition, wherein (the average concentration of alkali metal and/or alkaline earth metal elements in a region within a depth of 3 ?m from the surface of the molded article)/(the average concentration of alkali metal and/or alkaline earth metal elements in a region except for the region within a depth of 3 ?m from the surface of the molded article)>2.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 28, 2016
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo KAWAMURA, Masashi OKAMOTO, Yasukazu SHIKANO, Katsushi WATANABE
  • Publication number: 20160152826
    Abstract: The polyamide resin composition of the present invention contains (A) a polyamide resin, (B) a glass fiber including a compound having a carboxylic anhydride-containing unsaturated vinyl monomer, the compound being on at least a part of a surface of the glass fiber, and (C) a copolymer including a carboxylic anhydride-containing unsaturated vinyl monomer and having a glass transition temperature Tg of higher than 0° C.
    Type: Application
    Filed: April 16, 2014
    Publication date: June 2, 2016
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Tomoyo KAWAMURA, Teruaki SAKUMA, Kazunori TERADA