Patents by Inventor Tomoyoshi Yamaguchi

Tomoyoshi Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091835
    Abstract: A meandering amount arithmetically operating device of a meandering amount measurement device calculates the meandering amount of a steel sheet using a drive side edge site zds(N) and a work side edge sites zws(N) at a current time when a measurement reliability determination unit determines that both the drive side edge site zds(N) and the work side edge sites zws(N) at the current time have high reliability. When only one of the drive side edge site zds(N) and the work side edge site zws(N) at the current time is determined to have high reliability, the other edge site is calculated by interpolation using the number of pixels W from a sheet width updating unit with the drive side edge sites zds(N) or the work side edge site zws(N) at the current time having high reliability as a reference.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 21, 2024
    Inventors: Tomoyoshi Ogasahara, Hiroto Goto, Hideto Yamaguchi, Yukihiro Matsubara, Mitsutoshi Kemmochi
  • Patent number: 6720783
    Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: April 13, 2004
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Publication number: 20030132771
    Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing means 54 and the bump 21 of the IC 10 flexibly deforms the spring means S via the insulative resin film 3, a contact pressure due to the elastic force of the spring means S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Application
    Filed: November 29, 2002
    Publication date: July 17, 2003
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Patent number: 6512388
    Abstract: An IC socket with good durability that permits electrical tests on IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: January 28, 2003
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Patent number: 4969223
    Abstract: A pad cover of a size capable of containing two pads in parallel, wherein a partitioning wall is provided in said cover to traverse the center thereof, short side walls of cover are formed to which the ends of said partitioning wall are fastened, and openings are formed starting from both sides of said short side walls running through the ends of the two sides.Owing to the presence of the partitioning walls, the two pads can be easily pulled out or inserted through the openings.
    Type: Grant
    Filed: March 29, 1989
    Date of Patent: November 13, 1990
    Assignee: Japan Life Co., Ltd.
    Inventor: Tomoyoshi Yamaguchi
  • Patent number: 4924542
    Abstract: The present invention provides a sleeping mattress comprising:an upper cushion member provided with a plurality of undulated projections and a plurality of through-holes;a core member which is disposed under said upper cushion member while provided with a plurality of concave portions serving as reinforcing ribs together with a plurality of semi-spherical elements received in said through-holes of said upper cushion member, said semi-spherical elements being provided in an upper surface of said core member; anda lower cushion member a peripheral edge portion of which is fixed to a peripheral edge portion of said upper cushion member so that said core member is interposed between said upper cushion member and said lower cushion member.The reinforcing ribs are formed in the core member when the core member is produce through a compression molding process. The ribs serve to hold the shape of the sleeping mattress.
    Type: Grant
    Filed: May 5, 1989
    Date of Patent: May 15, 1990
    Assignee: Japan Life Company, Ltd.
    Inventor: Tomoyoshi Yamaguchi
  • Patent number: 4921560
    Abstract: A method for fixing a plurality of permanent magnets to an inner cover of bedclothing such as a comforter filled with down and the like comprises the steps of: providing a patch assuming a suitable shape such as a circular shape and the like; applying a bonding-agent sheet to the patch; fixing temporarily a permanent magnet to a center of the bonding-agent sheet to prepare an assembly consisting of the patch, the bonding-agent sheet and the permanent magnet; placing the assembly on a cover of bedclothing in a condition in which the permanent magnet of the assembly abuts on the cover of bedclothing; placing a platen having a hole for receiving the permanent magnet of the assembly therein on the assembly; heating the platen to melt the bonding-agent sheet of the assembly so as to bond the path of the assembly to the cover of bedclothing.
    Type: Grant
    Filed: October 6, 1987
    Date of Patent: May 1, 1990
    Assignee: J. L. S. Corp.
    Inventor: Tomoyoshi Yamaguchi
  • Patent number: 4691975
    Abstract: In order to construct an IC-tester socket as a whole into a compact size and to make the mounting and removal of an IC package easy and further to enable stable and positive contact between the lead terminals of the IC package and contact pins, the IC-tester socket is comprised of a socket body capable of accomodating an IC package; a plurality of contact pins provided within the socket body and each having resilient first and second arms capable, in their normal state, of nipping each said lead terminal; and releasers mounted vertically movably on the socket body for being able to release the nipping of the lead terminals done by these first and second arms.
    Type: Grant
    Filed: October 21, 1986
    Date of Patent: September 8, 1987
    Assignee: Dai-Ichi Seiko Kabushiki Kaisha
    Inventors: Masami Fukunaga, Tomoyoshi Yamaguchi