Abstract: A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

Abstract: A circuit board includes an insulating layer; a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.

Abstract: A capacitor-embedded substrate includes a first conductor layer that is a power-supply layer and divided into a first and second regions, a second conductor layer that is a ground layer, a dielectric layer between the first and second conductor layers, and a third conductor layer that is a power-supply layer and displaced from the dielectric layer along a thickness direction of the substrate, a first via by which the first region and the third conductor layer are coupled, the first via being not coupled to the second conductor layer, and a second via by which the second region and the third conductor layer are coupled, the second via being not coupled to the second conductor layer, wherein the third conductor layer includes a narrowed portion narrower than other portions in the third conductor layer, between a coupled portion to the first via and a coupled portion to the second via.

Abstract: A substrate includes: a signal line via, a ground line via, and a power supply line via; a first group of first conductor layers formed at a first wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a second conductor layer formed at a second wiring layer level and coupled to the power supply line via; a second group of third conductor layers formed at a third wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a first insulating layer; and a second insulating layer, wherein the second insulating layer has an opening with a third insulating layer, a relative dielectric constant of the second insulating layer is higher than the first insulating layer and the third insulating layer, and the opening reaches a conductor pattern.

Abstract: A circuit board includes an insulator layer, an electronic component built into the insulator layer, a first via penetrating the insulator layer, a second via extending from one surface of the insulator layer and coupled to the electronic component, and a metal layer formed over the one surface of the insulator layer, wherein a via pad is formed over the second via, an opening is formed between the metal layer and a first via side of the via pad, and the opposite side of the via pad to the first via side is coupled to the metal layer.

Abstract: A circuit substrate includes a first insulating layer, a capacitor disposed over the first insulating layer, the capacitor including a dielectric layer, a first conductor layer disposed on a first face of the dielectric layer, and a second conductor layer disposed on a second face opposite to the first face of the dielectric layer and having an electric resistivity higher than that of the first conductor layer, a third conductor layer disposed on a surface of the second conductor layer, the third conductor layer having an electric resistivity lower than that of the second conductor layer, a second insulating layer covering the capacitor, and a conductor via disposed in the second insulating layer, the conductor via being coupled to a portion of the third conductor layer.

Abstract: A substrate includes: a signal line via, a ground line via, and a power supply line via; a first group of first conductor layers formed at a first wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a second conductor layer formed at a second wiring layer level and coupled to the power supply line via; a second group of third conductor layers formed at a third wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a first insulating layer; and a second insulating layer, wherein the second insulating layer has an opening with a third insulating layer, a relative dielectric constant of the second insulating layer is higher than the first insulating layer and the third insulating layer, and the opening reaches a conductor pattern.

Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Abstract: A substrate includes: a signal line via, a ground line via, and a power supply line via; a first group of first conductor layers formed at a first wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a second conductor layer formed at a second wiring layer level and coupled to the power supply line via; a second group of third conductor layers formed at a third wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a first insulating layer; and a second insulating layer, wherein the second insulating layer has an opening with a third insulating layer, a relative dielectric constant of the second insulating layer is higher than the first insulating layer and the third insulating layer, and the opening reaches a conductor pattern.

Abstract: A circuit board includes a first capacitor that includes a first dielectric layer, a first conductor layer disposed on a first surface of the first dielectric layer, and a second conductor layer disposed on a second surface of the first dielectric layer opposite to the first surface, a first insulating layer that is bonded to the first surface side with a first adhesive layer and has a higher elastic modulus than the first adhesive layer, and a second insulating layer that is bonded to the second surface side with a second adhesive layer and has a higher elastic modulus than the second adhesive layer.

Abstract: A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

Abstract: A circuit board includes an insulating layer, a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.

Abstract: A substrate includes: a signal line via, a ground line via, and a power supply line via; a first group of first conductor layers formed at a first wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a second conductor layer formed at a second wiring layer level and coupled to the power supply line via; a second group of third conductor layers formed at a third wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a first insulating layer; and a second insulating layer, wherein the second insulating layer has an opening with a third insulating layer, a relative dielectric constant of the second insulating layer is higher than the first insulating layer and the third insulating layer, and the opening reaches a conductor pattern.

Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Abstract: A wiring board includes a first insulating layer; a first wire that is provided at a first surface of the first insulating layer and transmits a first signal; and a second wire that is provided at a second surface of the first insulating layer that is opposite to the first surface, includes a first portion that is parallel to at least a portion of the first wire, and transmits a first component of the first signal that is transmitted through the first wire.

Abstract: A wiring board includes a first wiring line and a second wiring line formed on a substrate, a first land and a second land respectively formed at a connection portion of the first wiring line and the second wiring line. A second wiring line has a longer wiring length than the first wiring line. The land is structured with a wiring pattern of a single wiring line. The wiring board also includes a first pad electrode and a second pad electrode respectively formed on the first land and a second land through an insulating film, a first interlayer connection via and a interlayer connection via embedded in the insulating film and electrically connecting the land to the pad electrode. And a wiring length of the wiring pattern of the first land is longer than the wiring length of the wiring pattern of the second land.

Abstract: A semiconductor device includes: a semiconductor substrate; a plurality of metal terminals that are formed on a surface of the semiconductor substrate on the opposite side to a circuit-forming surface; and a resin that is formed on the surface of the semiconductor substrate on the opposite side to the circuit-forming surface, and covers at least part of side surfaces of the metal terminals, wherein upper surfaces of the metal terminals are exposed from the resin.

Abstract: A wiring board includes a conductor formed on an inner wall of a through hole made in a core board, resin formed inside the conductor in the through hole, and, for example, a land formed over the conductor and the resin. Vias are formed over the land. The vias are connected to a plurality of connection regions of the land extending over the conductor and the resin in the through hole. The land is held by the vias connected to the plurality of connection regions. This controls the thermal expansion of the resin to a land side and therefore prevents a fracture of the land.

Abstract: A wiring board includes a first insulating layer; a first wire that is provided at a first surface of the first insulating layer and transmits a first signal; and a second wire that is provided at a second surface of the first insulating layer that is opposite to the first surface, includes a first portion that is parallel to at least a portion of the first wire, and transmits a first component of the first signal that is transmitted through the first wire.

Abstract: A wiring board includes a first wiring line and a second wiring line formed on a substrate, a first land and a second land respectively formed at a connection portion of the first wiring line and the second wiring line. A second wiring line has a longer wiring length than the first wiring line. The land is structured with a wiring pattern of a single wiring line. The wiring board also includes a first pad electrode and a second pad electrode respectively formed on the first land and a second land through an insulating film, a first interlayer connection via and a interlayer connection via embedded in the insulating film and electrically connecting the land to the pad electrode. And a wiring length of the wiring pattern of the first land is longer than the wiring length of the wiring pattern of the second land.