Patents by Inventor Tomoyuki Goi
Tomoyuki Goi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230307810Abstract: A filter includes a first port, a second port, a path, a circuit part, and at least one cavity resonator. The path connects the first port and the second port. The circuit part is provided in the path. Each of the at least one cavity resonator is coupled with the path from an outside of the path in a circuit configuration. The first cavity resonator is coupled with the path between the first port and the circuit part. The second cavity resonator is coupled with the path between the second port and the circuit part.Type: ApplicationFiled: March 24, 2023Publication date: September 28, 2023Applicant: TDK CORPORATIONInventors: Yuta ASHIDA, Masahiro TATEMATSU, Shuhei SAWAGUCHI, Kenichi TEZUKA, Aozora KAWASAKI, Tetsuzo GOTO, Tomoyuki GOI
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Patent number: 11688946Abstract: An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.Type: GrantFiled: September 10, 2021Date of Patent: June 27, 2023Assignee: TDK CORPORATIONInventors: Hisashi Kobuke, Yasumasa Harihara, Kenichi Tezuka, Tomoyuki Goi
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Publication number: 20230065767Abstract: Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.Type: ApplicationFiled: August 31, 2022Publication date: March 2, 2023Applicant: TDK CorporationInventors: Yasuyuki HARA, Tomoyuki GOI
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Publication number: 20220320752Abstract: Disclosed herein is an antenna module that includes an antenna component including a plurality of antenna elements and a ground conductor surrounding each of the plurality of antenna elements; and a metal member disposed adjacent to the ground conductors surrounding outermost ones of the plurality of antenna elements.Type: ApplicationFiled: March 14, 2022Publication date: October 6, 2022Applicant: TDK CORPORATIONInventors: Yasuyuki HARA, Tomoyuki Goi
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Publication number: 20220085508Abstract: An antenna device according to the present disclosure includes two wiring layers and an antenna layer. One of the two wiring layers is divided in the x-direction by a first slit extending in the y-direction, and the antenna layer is divided in the x-direction into first and second antenna areas by a second slit extending in the y-direction. The first and second slits overlap each other in the z-direction. One of the first and second slits is larger in width than the other one thereof. The antenna layer includes an antenna conductor formed in the first antenna area and another antenna conductor formed in the second antenna area.Type: ApplicationFiled: September 10, 2021Publication date: March 17, 2022Inventors: Hisashi KOBUKE, Yasumasa HARIHARA, Kenichi TEZUKA, Tomoyuki GOI
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Patent number: 7978031Abstract: The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.Type: GrantFiled: January 14, 2009Date of Patent: July 12, 2011Assignee: TDK CorporationInventors: Tomoyuki Goi, Takuya Adachi, Atsuhi Ajioka, Hitoshi Hachiga
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Patent number: 7663455Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.Type: GrantFiled: April 11, 2007Date of Patent: February 16, 2010Assignee: TDK CorporationInventors: Tomoyuki Goi, Hideaki Fujioka, Masami Itakura, Hideya Matsubara
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Publication number: 20090195334Abstract: The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.Type: ApplicationFiled: January 14, 2009Publication date: August 6, 2009Applicant: TDK CorporationInventors: Tomoyuki GOI, Takuya Adachi, Atsuhi Ajioka, Hitoshi Hachiga
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Publication number: 20090128254Abstract: A high frequency electronic component includes a switch and a balun. The switch performs switching between a first transmission signal in the form of an unbalanced signal received at a first input port and a second transmission signal in the form of an unbalanced signal received at a second input port, and outputs one of the first and second transmission signals from an output port. The balun converts the transmission signal in the form of an unbalanced signal outputted form the output port of the switch to a transmission signal in the form of a balanced signal, and outputs this signal to a balanced input power amplifier.Type: ApplicationFiled: October 28, 2008Publication date: May 21, 2009Applicant: TDK CORPORATIONInventors: Tomoyuki Goi, Kenta Nagai, Nobumi Harada, Mitsuru Miura, Shuichi Yoshida
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Publication number: 20090128253Abstract: A high frequency electronic component includes: a first input terminal that receives a first transmission signal in the form of an unbalanced signal; a second input terminal that receives a second transmission signal in the form of a balanced signal; a balun that converts the second transmission signal in the form of a balanced signal received at the second input terminal to a second transmission signal in the form of an unbalanced signal and outputs this signal; and a switch. The switch performs switching between a signal received at a first input port and a signal received at a second input port, and outputs one of the signals from an output port. The first input port receives the first transmission signal received at the first input terminal. The second input port receives the second transmission signal in the form of an unbalanced signal outputted from the balun. The output port is connected to a power amplifier.Type: ApplicationFiled: October 27, 2008Publication date: May 21, 2009Applicant: TDK CORPORATIONInventors: Tomoyuki Goi, Kenta Nagai, Nobumi Harada, Mitsuru Miura
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Publication number: 20070262833Abstract: A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.Type: ApplicationFiled: April 11, 2007Publication date: November 15, 2007Applicant: TDK CORPORATIONInventors: Tomoyuki Goi, Hideaki Fujioka, Masami Itakura, Hideya Matsubara
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Patent number: 7206551Abstract: A high frequency switch module comprises an antenna port, a plurality of transmission signal ports, a plurality of reception signal ports, a high frequency switch, a plurality of LPFs and a plurality of phase adjusting lines. The high frequency switch allows one signal port among the transmission signal ports and the reception signal ports to be selectively connected to the antenna port. The high frequency switch includes a field-effect transistor made of a GaAs compound semiconductor. Each of the phase adjusting lines connects the high frequency switch to each of the LPFs. Each of the phase adjusting lines adjusts a phase difference between a progressive wave of a harmonic resulting from a transmission signal and produced at the high frequency switch and a reflected wave resulting from reflection of the progressive wave from each of the LPFs such that the power of a composite wave made up of the progressive wave and the reflected wave is made lower at the point of the high frequency switch.Type: GrantFiled: August 6, 2004Date of Patent: April 17, 2007Assignee: TDK CorporationInventors: Masami Itakura, Tomoyuki Goi, Takuya Adachi
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Publication number: 20050032484Abstract: A high frequency switch module comprises an antenna port, a plurality of transmission signal ports, a plurality of reception signal ports, a high frequency switch, a plurality of LPFs and a plurality of phase adjusting lines. The high frequency switch allows one signal port among the transmission signal ports and the reception signal ports to be selectively connected to the antenna port. The high frequency switch includes a field-effect transistor made of a GaAs compound semiconductor. Each of the phase adjusting lines connects the high frequency switch to each of the LPFs. Each of the phase adjusting lines adjusts a phase difference between a progressive wave of a harmonic resulting from a transmission signal and produced at the high frequency switch and a reflected wave resulting from reflection of the progressive wave from each of the LPFs such that the power of a composite wave made up of the progressive wave and the reflected wave is made lower at the point of the high frequency switch.Type: ApplicationFiled: August 6, 2004Publication date: February 10, 2005Applicant: TDK CORPORATIONInventors: Masami Itakura, Tomoyuki Goi, Takuya Adachi
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Patent number: 6623842Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes. Further, at least the lowermost layer is made of a sintered silver conductor which is partly buried in the ceramic multi-layer substrate, a nickel or a nickel alloy layer being contained as an intermediate layer, and the topmost layer being a gold layer. Thus, a surface electrode structure on a ceramic multi-layer substrate is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.Type: GrantFiled: September 20, 2001Date of Patent: September 23, 2003Assignee: TDK CorporationInventors: Fumio Uchikoba, Tomoyuki Goi
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Publication number: 20020058151Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips 30 as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes, at least the lowermost layer is made of a sintered silver conductor 51 which is partly buried in the ceramic multi-layer substrate 40, a nickel or a nickel alloy layer 52 being contained as an intermediate layer, and the topmost layer being a gold layer 53. Thus, it is provided a surface electrode structure on a ceramic multi-layer substrate that is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.Type: ApplicationFiled: September 20, 2001Publication date: May 16, 2002Applicant: TDK CORPORATIONInventors: Fumio Uchikoba, Tomoyuki Goi