Abstract: Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Abstract: Disclosed is a method of manufacturing a wiring board, which allows a desmearing process to be carried out appropriately without roughening a surface of an insulating layer. The method of manufacturing a wiring board includes a light irradiation step for irradiating a wiring board material with ultraviolet light in an atmosphere containing oxygen. The wiring board material has an insulating layer laminated on a conductive layer, a protective layer formed on the insulating layer, and a through hole (viahole) that penetrates the insulating layer and the protective layer. The method also includes a plating step for forming a plating layer, which is made from a conductive material, on the surface of the wiring board material from which the protective layer has been removed. The surface of the wiring board material includes a bottom of the through hole.

Abstract: Disclosed is a method of manufacturing a wiring board, which allows a desmearing process to be carried out appropriately without roughening a surface of an insulating layer. The method of manufacturing a wiring board includes a light irradiation step for irradiating a wiring board material with ultraviolet light in an atmosphere containing oxygen. The wiring board material has an insulating layer laminated on a conductive layer, a protective layer formed on the insulating layer, and a through hole (viahole) that penetrates the insulating layer and the protective layer. The method also includes a plating step for forming a plating layer, which is made from a conductive material, on the surface of the wiring board material from which the protective layer has been removed. The surface of the wiring board material includes a bottom of the through hole.

Abstract: Disclosed herein is an optical processing device and an optical processing method. The optical processing device comprises: a light source unit configured to emit light; and a processing unit configured to expose an object to be processed to the light emitted from the light source unit. The processing unit includes: a processing region in which the object to be processed is held and exposed to the light in an atmosphere of a processing gas; and a preparatory region through which the processing gas passes, while being exposed to the light, to move toward the processing region, the preparatory region being configured to prevent the object to be processed from being arranged thereon.

Abstract: A semiconductor device includes a first MOS transistor and a second MOS transistor of a second conductivity type. The first MOS transistor includes a first main electrode connected to a first potential and a second main electrode connected to a second potential. The second MOS transistor includes a first main electrode connected to a control electrode of the first MOS transistor and a second main electrode connected to the second potential. The control electrodes of the first and second MOS transistors are connected in common. The first and second MOS transistors are formed on a common wide bandgap semiconductor substrate. In the first MOS transistor, a main current flows in a direction perpendicular to a main surface of the wide bandgap semiconductor substrate. In the second MOS transistor, a main current flows in a direction parallel to the main surface of the wide bandgap semiconductor substrate.

Abstract: The present invention has as its object the provision of a desmear treatment device and a desmear treatment method capable of reliably performing a desmear treatment with high treatment efficiency. In the desmear treatment method of the present invention, when irradiating a to-be-treated object disposed in a treatment space with vacuum ultraviolet rays via an ultraviolet transmitting window member to remove smear in the to-be-treated object, a treatment gas containing active species to be activated by the irradiation of the vacuum ultraviolet rays and having contained moisture is supplied into the treatment space. The desmear treatment device includes treatment gas supply means having a humidifying mechanism for causing a treatment gas containing active species to be activated by vacuum ultraviolet rays from an ultraviolet light source to contain moisture.

Abstract: The present invention has as its object the provision of a desmear treatment device and a desmear treatment method capable of sufficiently removing smear remaining in a to-be-treated object in a short amount of time. The desmear treatment device of the present invention includes: a treatment chamber in which a to-be-treated object is disposed; a light source unit in which an ultraviolet lamp for irradiating the to-be-treated object with ultraviolet rays is housed; a light transmissive window that is disposed between the treatment chamber and the light source unit and that transmits the ultraviolet rays from the ultraviolet lamps; and treatment gas supply means for supplying a treatment gas containing a source of active species to the treatment chamber. The treatment gas supply means includes a treatment gas supply source and a control unit for controlling a supplied amount of the treatment gas from the treatment gas supply source.

Abstract: The present invention has as its object the provision of a desmear treatment device and a desmear treatment method capable of reliably performing a desmear treatment with high treatment efficiency. In the desmear treatment method of the present invention, when irradiating a to-be-treated object disposed in a treatment space with vacuum ultraviolet rays via an ultraviolet transmitting window member to remove smear in the to-be-treated object, a treatment gas containing active species to be activated by the irradiation of the vacuum ultraviolet rays and having contained moisture is supplied into the treatment space. The desmear treatment device includes treatment gas supply means having a humidifying mechanism for causing a treatment gas containing active species to be activated by vacuum ultraviolet rays from an ultraviolet light source to contain moisture.

Abstract: A light irradiation device includes a workpiece support onto which a workpiece (object to be processed) is placed, an ultraviolet lamp for emitting a vacuum ultraviolet beam to a target surface (surface to be processed) of the workpiece, and a light transmitting window member disposed between the workpiece and the ultraviolet lamp and configured to pass the vacuum ultraviolet beam from the ultraviolet lamp therethrough. A gap defined between the target surface of the workpiece and the light transmitting window member is no greater than 1 mm. A gas supply unit is provided for supplying a processing gas into the gap such that the gas travels along the target surface in one direction. A gas blocking member is provided on the workpiece support in a region where the workpiece is not present. The region extends along a supply direction of the processing gas.

Abstract: Disclosed is a desmear treatment device that can treat a wiring board material uniformly with high treatment efficiency even when a separation distance between ultraviolet lamps adjacent to each other in a plurality of ultraviolet lamps arranged side by side is large. According to the present invention, there is provided a desmear treatment device including: a plurality of ultraviolet lamps arranged side by side along a to-be-treated surface; a plate-shaped light transmissive window member; and a treating gas supply mechanism. The wiring board material is disposed at a position between a gas supply port and a gas discharge port of the treating gas supply mechanism, and a treating gas flows in a direction along which the plurality of ultraviolet lamps are arranged side by side and a laminar flow of the treating gas is formed in a space formed between the wiring board material and the light transmissive window member.

Abstract: A light irradiation device includes a workpiece support onto which a workpiece (object to be processed) is placed, an ultraviolet lamp for emitting a vacuum ultraviolet beam to a target surface (surface to be processed) of the workpiece, and a light transmitting window member disposed between the workpiece and the ultraviolet lamp and configured to pass the vacuum ultraviolet beam from the ultraviolet lamp therethrough. A gap defined between the target surface of the workpiece and the light transmitting window member is no greater than 1 mm. A gas supply unit is provided for supplying a processing gas into the gap such that the gas travels along the target surface in one direction. A gas blocking member is provided on the workpiece support in a region where the workpiece is not present. The region extends along a supply direction of the processing gas.

Abstract: Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Abstract: Provided is a low-dielectric constant material curing process including irradiating a low-dielectric constant material on a semiconductor substrate with ultraviolet rays. In the low-dielectric constant material curing process, the ultraviolet light source is a fluorescent lamp including: a light-emitting tube sealed and filled with a discharge gas containing xenon gas; a pair of electrodes for inducing a discharge in the interior space of the light-emitting tube; a dielectric material being interposed between the interior space and at least one of the pair of electrodes; and a phosphor layer formed on a surface of the light-emitting tube and containing a phosphor that is excited by light generated from the discharge gas by a discharge in the interior space. The phosphor emits ultraviolet rays having a wavelength within a range of 180 to 300 nm.

Abstract: This invention discloses a high pressure sodium vapor lamp having unsaturated vapor pressure type characteristics with sodium and mercury contained in an arc tube. The sodium is enclosed in an amount sufficient to exhibit unsaturated vapor pressure type characteristics while the mercury is enclosed in an amount M.sub.Hg calculated by the following formula: ##EQU1## where M.sub.Hg : the amount of mercury enclosed (mg)D: the internal diameter of the arc tube (cm)L: the electrode-to-electrode distance (cm)V.sub.olume : the volume of the arc tube (cc)V.sub.n : the rated lamp voltage (Volt).