Abstract: A vibrator device includes a vibrator element, a container in which the vibrator element is housed, a circuit which is disposed in the container, and which overlaps the vibrator element in a plan view, and an inductor which is disposed in the container, which fails to overlap the vibrator element in the plan view, and which is electrically coupled to the circuit. The container includes at least a first member and a second member, and a bonding area configured to bond the first member and the second member to each other, and the inductor is disposed in the bonding area.

Abstract: A method for manufacturing a semiconductor device includes: forming a first through hole penetrating from a first surface to a second surface of a semiconductor substrate; forming a second insulating film at the first surface of the semiconductor substrate and a side surface of the first through hole; disposing a resist at a surface of the second insulating film from the first surface of the semiconductor substrate to an end portion of the side surface of the first through hole on a first surface side of the semiconductor substrate; wet-etching the second insulating film by using the resist as a mask; covering the first surface of the semiconductor substrate and the side surface of the first through hole with an organic insulating film; and forming a second conductive film at a surface of the organic insulating film.

Abstract: A manufacturing method for three-dimensional structure has a layer forming step of supplying a flowable composition containing a powder and an organic material to form a unit layer, an organic material removing step of performing a treatment of removing the organic material on the unit layer, and an energy applying step of applying energy to the unit layer after the organic material removing step to form a molten layer or sintered layer, wherein the layer forming step, the organic material removing step, and the energy applying step are repeated with respect to the molten layer or sintered layer in a stacking direction as appropriate.

Abstract: A resonator device includes: a base having a first surface and a second surface that are in front-back relation; a resonator element that is located at a first surface with respect to the base and that includes a resonation substrate and an electrode disposed at a surface of the resonation substrate on a base side; a conductive layer that is disposed at the first surface and that includes a joint portion joined to the electrode; and a stress relaxation layer that is interposed between the base and the conductive layer and that at least partially overlaps with the joint portion in a plan view of the base. The stress relaxation layer includes an exposed portion exposed from the conductive layer.

Abstract: A resonator device includes: a base having a first surface and a second surface that are in front-back relation; a resonator element that is located at a first surface with respect to the base and that includes a resonation substrate and an electrode disposed at a surface of the resonation substrate on a base side; a conductive layer that is disposed at the first surface and that includes a joint portion joined to the electrode; and a stress relaxation layer that is interposed between the base and the conductive layer and that at least partially overlaps with the joint portion in a plan view of the base. The stress relaxation layer includes an exposed portion exposed from the conductive layer.

Abstract: A resonator device includes: a resonator element that has a first surface on which a first mount electrode and a second mount electrode are disposed, and a second surface; a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed; a lid that has a fourth surface which faces the second surface of the resonator element; a first metal bump by which the first mount electrode and the first base electrode are bonded; a second metal bump by which the second mount electrode and the second base electrode are bonded; and a bonding member by which the second surface and the fourth surface are bonded. A loss tangent of the bonding member is larger than a loss tangent of the first metal bump and the second metal bump.

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

Abstract: A vibrator device includes a vibrator element, a container in which the vibrator element is housed, a circuit which is disposed in the container, and which overlaps the vibrator element in a plan view, and an inductor which is disposed in the container, which fails to overlap the vibrator element in the plan view, and which is electrically coupled to the circuit. The container includes at least a first member and a second member, and a bonding area configured to bond the first member and the second member to each other, and the inductor is disposed in the bonding area.

Abstract: A manufacturing method for three-dimensional structure has a layer forming step of supplying a flowable composition containing a powder and an organic material to form a unit layer, an organic material removing step of performing a treatment of removing the organic material on the unit layer, and an energy applying step of applying energy to the unit layer after the organic material removing step to form a molten layer or sintered layer, wherein the layer forming step, the organic material removing step, and the energy applying step are repeated with respect to the molten layer or sintered layer in a stacking direction as appropriate.

Abstract: A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.

Abstract: A manufacturing method for three-dimensional structure has a layer forming step of supplying a flowable composition containing a powder and an organic material to form a unit layer, an organic material removing step of performing a treatment of removing the organic material on the unit layer, and an energy applying step of applying energy to the unit layer after the organic material removing step to form a molten layer or sintered layer, wherein the layer forming step, the organic material removing step, and the energy applying step are repeated with respect to the molten layer or sintered layer in a stacking direction as appropriate.

Abstract: A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.

Abstract: A three-dimensional production method for a functional element structure body according to the invention is a three-dimensional production method for a functional element structure body, which includes an electrical functional element section having a terminal and an insulating member provided on the periphery of the functional element section in a state where at least the terminal is exposed to the outside, and includes a layer formation step of forming one layer in a layer forming region by supplying a first flowable composition containing first particles for the functional element section from a first supply section, and supplying a second flowable composition containing second particles for the insulating member from a second supply section, a shaping step of shaping the functional element structure body by repeating the layer formation step, and a solidification step of performing solidification by applying energy to the first particles and the second particles in the layer.

Abstract: A sensor includes a stretchable substrate having a stretching property, and a plurality of wires provided to the stretchable substrate, and the plurality of wires includes a first wire, and a second wire larger in resistance value variation due to extension of the stretchable substrate than the first wire. Further, the sensor includes a detection section adapted to correct a resistance value of the second wire in accordance with a resistance value of the first wire, and detect the extension of the stretchable substrate based on the resistance value of the second wire which has been corrected. Further, the detection section detects deterioration of the plurality of wires in accordance with the resistance value of the first wire.

Abstract: A three-dimensional forming apparatus includes: a stage; a material supply unit that supplies the stage with a sintered material including metal powder and a binder; a head unit that includes an energy radiation unit supplying energy capable of sintering the sintered material to the sintered material supplied by the material supply unit; a head base that holds a plurality of the head units; and a driving unit that is capable of three-dimensionally moving the head base relative to the stage.

Abstract: A three-dimensional forming apparatus includes: a stage; a material supply unit that supplies the stage with a sintered material including metal powder and a binder, a head unit that includes an energy radiation unit supplying energy capable of sintering the sintered material to the sintered material supplied by the material supply unit, a head base that holds a plurality of the head units, and a driving unit that is capable of three-dimensionally moving the head base relative to the stage.

Abstract: A three-dimensional forming apparatus includes: a stage; a material supply mechanism that supplies a sinterable material in which metal powder and a binder are contained to a stage; an energy radiation mechanism that supplies energy capable of sintering the dry sinterable material; and a driving mechanism that is able to three-dimensionally move the material supply mechanism and the energy radiation mechanism relative to the stage. The material supply mechanism includes a material ejection unit supplying a predetermined amount of the sinterable material to the stage. The energy radiation mechanism includes an energy radiation unit outputting the energy. The material ejection unit and the energy radiation unit are held in one holding mechanism.

Abstract: An electronic apparatus includes: a base; a functional element; and a first member and a second member which connect the base and the functional element to each other. The first member and the second member have different elastic moduli from each other. The elastic modulus of the first member is higher than the elastic modulus of the second member. At least a part of the first member is situated more closely to a center of the functional element than the second member, as viewed in a plan view taken from a direction in which the base and the functional element are arrayed.

Abstract: A three-dimensional forming apparatus includes: a stage; a material supply mechanism that supplies a sintered material in which metal powder and a binder are contained to a stage; an energy radiation mechanism that supplies energy capable of sintering the dry sintered material; and a driving mechanism that is able to three-dimensionally move the material supply mechanism and the energy radiation mechanism relative to the stage. The material supply mechanism includes a material ejection unit supplying a predetermined amount of the sintered material to the stage. The energy radiation mechanism includes an energy radiation unit outputting the energy. The material ejection unit and the energy radiation unit are held in one holding mechanism.

Abstract: A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.