Patents by Inventor Tomoyuki Kikuchi

Tomoyuki Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157489
    Abstract: This positioner comprises: a first member; a rotating table supported to rotate about an axis relative to the first member; a motor that is parallel to and offset from the axis and drives the rotating table; a reducer disposed between the first member and the rotating table, reducing the rotation of the motor and transmitting the reduced rotation to the rotating table; and a power cable for supplying power to the rotating table. The first member and the reducer are provided with a hollow section passing therethrough. A current collector brush is attachable to and detachable from one end of the power cable. The power cable extends, from the first member in a direction away from the rotating table. After being bent into a U-shape, the power cable passes through the hollow section along the axis, and one end of the power cable is detachably secured to the rotating table.
    Type: Application
    Filed: June 28, 2021
    Publication date: May 16, 2024
    Applicant: FANUC CORPORATION
    Inventors: Kaname KIKUCHI, Tomoyuki MOTOKADO, Akihiro OIKAWA, Toshihiko INOUE
  • Patent number: 11917899
    Abstract: An arylamine-fluorene alternating copolymer having a structural unit (A) is represented by Chemical Formula (1): wherein Chemical Formula (1) is the same as described in the detailed description.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Masashi Tsuji, Takahiro Fujiyama, Yusaku Konishi, Dae Young Chung, Fumiaki Kato, Jaejun Chang, Keigo Furuta, Takao Motoyama, Eun Joo Jang, Hyo Sook Jang, Tae Ho Kim, Tomoyuki Kikuchi, Yuho Won
  • Patent number: 11851529
    Abstract: A triazine ring-containing polymer including a structural unit represented by General Formula 1: *-[A-B-]-*??General Formula 1 wherein, in General Formula 1, A is represented by General Formula 2, B is represented by General Formula 3, and * indicates a point linked to another group or structural unit: wherein, in General Formula 2 and General Formula 3, L, R1 to R6, m1, n1, and * are the same as defined in the detailed description.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: December 26, 2023
    Assignees: SAMSUNG ELECTRONICS CO., LTD., NATIONAL UNIVERSITY CORPORATION IWATE UNIVERSITY
    Inventors: Yoshiyuki Oishi, Eigo Miyazaki, Tomoyuki Kikuchi, Yukika Yamada
  • Patent number: 11830845
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: November 28, 2023
    Assignee: TESSERA LLC
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
  • Patent number: 11814482
    Abstract: Disclosed are a triazine ring-containing polymer having a repeating unit that comprises a structural unit derived from a triazinedithiol compound, the triazine ring-containing polymer having a yellowness index of less than 3 and comprising terminal SH groups, wherein at least a portion of the SH groups are capped with a hydrocarbon group, and a number of the SH groups in the triazine ring-containing polymer is less than about 1×1018 per gram of the polymer, and a thermoplastic article and optical part including the polymer.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eigo Miyazaki, Masashi Tsuji, Tomoyuki Kikuchi, Yukika Yamada
  • Publication number: 20230287231
    Abstract: A quantum dot ink composition including a plurality of quantum dots, and a mixed solvent including a Solvent a and a Solvent b, a quantum dot electroluminescent device including a light emitting layer formed from the quantum dot composition, and a method of making the quantum dot electroluminescent device are provided, where Solvent a is a cycloalkane compound with at least one ring carbon having a linear C4 to C16 alkyl group, an aromatic hydrocarbon compound having a linear C2 to C12 alkyl group, or a combination thereof, and Solvent b is a fluorinated alcohol.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 14, 2023
    Inventors: Hiroko ENDO, Keigo FURUTA, Takao MOTOYAMA, Yukika YAMADA, Tomoyuki KIKUCHI, Eun Joo JANG, Hyo Sook JANG, Jun-Mo YOO, Tae Ho KIM, Yuho WON
  • Publication number: 20230257607
    Abstract: A quantum dot ink composition including a plurality of quantum dots, and a mixed solvent including a Solvent a and a Solvent b, the ink composition having a surface tension of about 30 mN/m to about 40 mN/m, where Solvent a is a cycloalkane compound with at least one ring carbon having a linear C4 to C16 alkyl group, and Solvent b is an aromatic hydrocarbon compound having a linear C2 to C12 alkyl group. A quantum dot electroluminescent device including a light emitting layer formed from the quantum dot composition.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 17, 2023
    Inventors: Keigo FURUTA, Hiroko ENDO, Takao MOTOYAMA, Yukika YAMADA, Tomoyuki KIKUCHI, Eun Joo JANG, Hyo Sook JANG, Jun-Mo YOO, Tae Ho KIM, Yuho WON
  • Publication number: 20220375891
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 24, 2022
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
  • Patent number: 11424211
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 23, 2022
    Assignee: TESSERA LLC
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
  • Publication number: 20220213022
    Abstract: Provided is a compound represented by Chemical Formula 1 capable of manufacturing an EL device by inkjet printing. In Chemical Formula 1, n is an integer of greater than or equal to 3 and less than or equal to 10, X is a group represented by Chemical Formula 2 and a plurality of X's may be the same or different from each other, and Y is a group represented by Chemical Formula 3 and a plurality of Y's may be the same or different from each other.
    Type: Application
    Filed: December 23, 2021
    Publication date: July 7, 2022
    Inventors: Fumiaki KATO, Tomoyuki KIKUCHI, Hiroko ENDO, Keigo FURUTA, Keisuke KORAI, Mitsunori ITO, Naotoshi SUGANUMA, Takao MOTOYAMA, Dae Young CHUNG, Eun Joo JANG, Ha Il KWON, Hyo Sook JANG, Soonmin CHA, Tae Ho KIM
  • Publication number: 20220204673
    Abstract: Disclosed is a copolymer including a structural unit represented by Chemical Formula 1 capable of improving performance (particularly durability) of an electroluminescent device.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 30, 2022
    Inventors: Takahiro FUJIYAMA, Tomoyuki KIKUCHI, Fumiaki KATO, Masashi TSUJI, Naotoshi SUGANUMA, Norihito ISHII, Dae Young CHUNG, Ha Il KWON, Soonmin CHA, Tae Ho KIM
  • Patent number: 11312840
    Abstract: An organic-inorganic hybrid composition including a polymer having a triazine ring structure in a main chain of the polymer (A); an inorganic particulate (B); and a surface-treating agent having a triazine ring structure represented by Formula (1)(C): wherein, in Formula (1), R1 is a carboxyl group, a phosphoric acid group, a sulfo group, or a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, or a substituted or unsubstituted amino group, wherein a number median diameter (Dn50) of the inorganic particulate (B) is greater than or equal to about 1 nm and less than or equal to about 20 nm.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tomoyuki Kikuchi, Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada
  • Patent number: 11180612
    Abstract: A triazine ring-containing polymer including a repeating unit represented by Formula (1) and having a number average molecular weight of greater than about 20000 g/mol and less than or equal to about 50000 g/mol: wherein, in Formula (1), R1 is each independently a C1 to C5 alkyl group and R2 is each independently a divalent group having at least one aromatic hydrocarbon group.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoshiyuki Oishi, Ryosuke Kamitani, Tomoyuki Kikuchi, Yukika Yamada
  • Publication number: 20210288258
    Abstract: The present disclosure provides a technique capable of improving durability (particularly luminescence life-span) of an electroluminescence. In order to solve the above problems, the present disclosure provides an arylamine-fluorene alternating copolymer having a structural unit (A) represented by Chemical Formula (1).
    Type: Application
    Filed: March 5, 2021
    Publication date: September 16, 2021
    Inventors: Masashi TSUJI, Takahiro FUJIYAMA, Yusaku KONISHI, Dae Young CHUNG, Fumiaki KATO, Jaejun CHANG, Keigo FURUTA, Takao MOTOYAMA, Eun Joo JANG, Hyo Sook JANG, Tae Ho KIM, Tomoyuki KIKUCHI, Yuho WON
  • Publication number: 20210163682
    Abstract: Disclosed are a triazine ring-containing polymer having a repeating unit that comprises a structural unit derived from a triazinedithiol compound, the triazine ring-containing polymer having a yellowness index of less than 3 and comprising terminal SH groups, wherein at least a portion of the SH groups are capped with a hydrocarbon group, and a number of the SH groups in the triazine ring-containing polymer is less than about 1×1018 per gram of the polymer, and a thermoplastic article and optical part including the polymer.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 3, 2021
    Inventors: Eigo MIYAZAKI, Masashi TSUJI, Tomoyuki KIKUCHI, Yukika YAMADA
  • Publication number: 20210050322
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Applicant: Tessera, Inc.
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
  • Publication number: 20200362112
    Abstract: A triazine ring-containing polymer including a structural unit represented by General Formula 1: *-[A-B-]-*??General Formula 1 wherein, in General Formula 1, A is represented by General Formula 2, B is represented by General Formula 3, and * indicates a point linked to another group or structural unit: wherein, in General Formula 2 and General Formula 3, L, R1 to R6, m1, n1, and * are the same as defined in the detailed description.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 19, 2020
    Inventors: Yoshiyuki OISHI, Eigo MIYAZAKI, Tomoyuki KIKUCHI, Yukika YAMADA
  • Patent number: 10833044
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 10, 2020
    Assignee: Tessera, Inc.
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi
  • Patent number: 10717866
    Abstract: Disclosed an organic-inorganic hybrid composition including a polymer (A) including a triazine ring structure represented by General Formula (1) in a polymer main chain structure; wherein, in the formula, R1 is a substituted or unsubstituted alkyl group, aryl group, aralkyl group, amino group, arylamino group, alkylthio group, or arylthio group, an inorganic particulate (B); and a surface-treatment agent (C) including an acidic functional group wherein the polymer (A) is a thermoplastic polymer having a glass transition temperature (Tg) and a number median diameter (Dn50) of the inorganic particulate (B) is greater than or equal to about 1 nm and less than or equal to about 20 nm, and an article and an optical component including the organic-inorganic hybrid composition.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: July 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoshiyuki Oishi, Hiroshi Miyao, Tomoyuki Kikuchi, Yukika Yamada, Ryosuke Kamitani
  • Publication number: 20200208011
    Abstract: A barrier film comprising: a substrate; a first layer disposed on the substrate and comprising an oxidation product of polysilazane; and a second layer disposed directly on the first layer and comprising a thiol-ene polymer, wherein the polysilazane comprises a repeating unit represented by Chemical Formula 1, wherein R1 and R2 are each independently hydrogen, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an alkylsilyl group, an alkylamino group, an alkoxy group, or an aromatic hydrocarbon group, and wherein the thiol-ene polymer is a polymerization product of a monomer combination including a first monomer having at least two thiol groups at its terminal end and a second monomer having at least two carbon-carbon unsaturated bond-containing groups at its terminal end.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Inventors: Tomoyuki KIKUCHI, EunJoo JANG, Hyun A KANG, Nayoun WON, Oul CHO