Abstract: An aluminum alloy sheet has a composition comprising 0.5% or less by mass of Si, 0.7% or less by mass of Fe, 0.3% or less by mass of Cu, 0.4 to 1.5% by mass of Mn, 0.7 to 1.5% by mass of Mg and an balance comprising Al and inevitable impurities. A degree of integration in the Goss orientation is 1.5 or more. A degree of integration in the Cu orientation is 6.2 or less. A tensile strength is 200 to 310 MPa. An areal ratio of an ?-Al—Fe—Mn—Si based intermetallic compound with an equivalent circle diameter of 0.5 ?m or more is preferably 2.6% or more.

Abstract: The present disclosure shows a superplastic-forming aluminum alloy plate that has excellent properties for superplastic-forming, such as blow forming, and that has excellent surface properties after forming. Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 0.5 to 1.8 mass % Mn and 0.40 mass % or less Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 ?m at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2.

Abstract: The present disclosure shows a superplastic-forming aluminum alloy plate that has excellent properties for superplastic-forming, such as blow forming, and that has excellent surface properties after forming. Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 0.5 to 1.8 mass % Mn and 0.40 mass % or less Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 ?m at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2.

Abstract: Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 1.2 to 1.5 mass % Mn and 0.001 to 0.05 mass % Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 ?m at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2, and a frequency of Kernel Average Misorientation of 15° or less at the RD-TD plane which extends along the center of the plate cross-section is 0.34 or less.

Abstract: An aluminum alloy sheet has a composition comprising 0.5% or less by mass of Si, 0.7% or less by mass of Fe, 0.3% or less by mass of Cu, 0.4 to 1.5% by mass of Mn, 0.7 to 1.5% by mass of Mg and an balance comprising Al and inevitable impurities. A degree of integration in the Goss orientation is 1.5 or more. A degree of integration in the Cu orientation is 6.2 or less. A tensile strength is 200 to 310 MPa. An areal ratio of an ?-Al—Fe—Mn—Si based intermetallic compound with an equivalent circle diameter of 0.5 ?m or more is preferably 2.6% or more.

Abstract: Provided is an aluminum alloy plate for blow molding comprising: 0.3% by mass or more and 1.8% by mass or less of Mg; 0.6% by mass or more and 1.6% by mass or less of Si; and 0.2% by mass or more and 1.2% by mass or less of Mn; wherein, in at least one surface of the aluminum alloy plate for blow molding, X and Y satisfy the following relations: 0.10?X, and, Y??8.0X+10.8; wherein X represents the ratio of regions whose valley depth in a roughness curve is 0.3 ?m or more; and Y represents the yield stress upon deformation of the aluminum alloy plate for blow molding under predetermined conditions.

Abstract: The present invention provides an Al—Mg—Si-based hot forming aluminum alloy plate which has not only high age-hardening property but also a high m value in a high strain rate range and excellent surface properties after forming and which is suitable for hot forming. The hot forming aluminum alloy plate comprises an aluminum alloy comprising 0.3 to 1.8 mass % Mg, 0.6 to 2.0 mass % Si and 0.04 to 0.20 mass % Fe. In the aluminum alloy, Mn content is restricted to 0.030 mass % or less, and Cr content is restricted to 0.030 mass % or less, and a balance comprises Al and unavoidable impurities. The hot forming aluminum alloy plate has an electrical conductivity of 60% or less according to IACS %. A production method of the hot forming aluminum alloy plate is also provided.

Abstract: The present disclosure shows a superplastic-forming aluminum alloy plate that has excellent properties for superplastic-forming, such as blow forming, and that has excellent surface properties after forming. Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 0.5 to 1.8 mass % Mn and 0.40 mass % or less Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 ?m at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2.

Abstract: The present invention provides an Al—Mg—Si-based hot forming aluminum alloy plate which has not only high age-hardening property but also a high m value in a high strain rate range and excellent surface properties after forming and which is suitable for hot forming. The hot forming aluminum alloy plate comprises an aluminum alloy comprising 0.3 to 1.8 mass % Mg, 0.6 to 2.0 mass % Si and 0.04 to 0.20 mass % Fe. In the aluminum alloy, Mn content is restricted to 0.030 mass % or less, and Cr content is restricted to 0.030 mass % or less, and a balance comprises Al and unavoidable impurities. The hot forming aluminum alloy plate has an electrical conductivity of 60% or less according to IACS %. A production method of the hot forming aluminum alloy plate is also provided.

Abstract: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase percentage in the member to be bonded (3) is from 5 to 35%.

Abstract: Provided is an aluminum alloy plate for blow molding comprising: 0.3% by mass or more and 1.8% by mass or less of Mg; 0.6% by mass or more and 1.6% by mass or less of Si; and 0.2% by mass or more and 1.2% by mass or less of Mn; wherein, in at least one surface of the aluminum alloy plate for blow molding, X and Y satisfy the following relations: 0.10?X, and, Y??8.0X+10.8; wherein X represents the ratio of regions whose valley depth in a roughness curve is 0.3 ?m or more; and Y represents the yield stress upon deformation of the aluminum alloy plate for blow molding under predetermined conditions.

Abstract: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase ratio in the member to be bonded (3) is from 5 to 35%.

Abstract: A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.

Abstract: A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.

Abstract: A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.

Abstract: A light amount adjusting apparatus for an image pickup which is capable of reducing the force with which a plate member and a blade member are held in close contact with each other and driving the blade member smoothly even in a high-humidity condition. The apparatus includes a base plate 5 having an opening 5a, a blade member 1 movable within a range including a position where the blade member overlaps the opening 5a in a light axis direction and restricting the amount of light passing through the opening 5a by overlapping the opening 5a, and a plate member 2 adjacent to the blade member 1 and having a cut portion 2a at a position where the plate member overlaps the blade member 1 in the light axis direction in a state in which the blade member 1 is at a predetermined position.

Abstract: Disclosed is a light amount adjusting apparatus for an image pickup apparatus which is capable of reducing the force with which a plate member and a blade member are held in close contact with each other and driving the blade member smoothly even in a high-humidity condition. The light amount adjusting apparatus includes a base plate 5 having an opening 5a, a blade member 1 movable within a range including a position where the blade member overlaps the opening 5a in a light axis direction and restricting the amount of light passing through the opening 5a by overlapping the opening 5a, and a plate member 2 adjacent to the blade member 1 and having a cut portion 2a at a position where the plate member overlaps the blade member 1 in the light axis direction in a state in which the blade member 1 is at a predetermined position.

Abstract: Disclosed is a light amount adjusting apparatus for an image pickup apparatus which is capable of reducing the force with which a plate member and a blade member are held in close contact with each other and driving the blade member smoothly even in a high-humidity condition. The light amount adjusting apparatus includes a base plate 5 having an opening 5a, a blade member 1 movable within a range including a position where the blade member overlaps the opening 5a in a light axis direction and restricting the amount of light passing through the opening 5a by overlapping the opening 5a, and a plate member 2 adjacent to the blade member 1 and having a cut portion 2a at a position where the plate member overlaps the blade member 1 in the light axis direction in a state in which the blade member 1 is at a predetermined position.

Abstract: A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.

Abstract: Disclosed is a light amount adjusting apparatus for an image pickup apparatus which is capable of reducing the force with which a plate member and a blade member are held in close contact with each other and driving the blade member smoothly even in a high-humidity condition. The light amount adjusting apparatus includes a base plate 5 having an opening 5a, a blade member 1 movable within a range including a position where the blade member overlaps the opening 5a in a light axis direction and restricting the amount of light passing through the opening 5a by overlapping the opening 5a, and a plate member 2 adjacent to the blade member 1 and having a cut portion 2a at a position where the plate member overlaps the blade member 1 in the light axis direction in a state in which the blade member 1 is at a predetermined position.