Abstract: A light emitting device includes a board 112 and a light-emitting element 110 fixed onto the board and having a light emission region facing upward. The board includes a plurality of projections 125 and 126 spaced from one another and each surrounding the light-emitting element 110. A side surface of each of the projections facing the light-emitting element is a reflective surface 125A, 126A that reflects light emitted sideways from the light emission region. The reflective surfaces are concentric about the light-emitting element. Upper ends of the reflective surfaces are located higher with increasing distance from the light-emitting element.

Abstract: A light emitting device includes: a light-emitting element 110 fixed onto a board 112 and having a light emission region that faces upward; and a light-control lens 114 located above the light-emitting element 110 and having an optical axis L that coincides with an optical axis of the light emission region. The light-control lens 114 includes a recess 141a located around the optical axis L, a first reflective surface that is located in the recess 141a and totally reflects light incident from the light emission region in a direction away from the optical axis L, and a first refractive surface that is located outside the first reflective surface in the recess 141a and refracts light incident from the light emission region at an emission angle larger than an incident angle of the light.

Abstract: The present invention provides a surface mounted semiconductor device 1 formed by cutting an assembly board together with cathode wiring patterns 8 and anode wiring patterns 10 arranged on the assembly board on which light-emitting elements are mounted. When the surface mounted semiconductor device 1 is mounted on a mounting board with the cutting plane (bonding surface) facing the mounting board, the cathode wiring patterns 8 serve as cathode connection electrodes 15 and the anode wiring patterns 10 serve as anode connection electrodes 12. A substantially semi-elliptical notch 16 is formed in each of the anode connection electrodes 12. A substantially fan-shaped notch 14 is formed in the corner of each of the cathode connection electrodes 15. Thus, it is possible to provide a surface mounted semiconductor device that can prevent a poor connection and ensure the bond strength by forming a solder fillet reliably, even if burrs are produced on the connection electrodes formed by cutting the assembly board.