Abstract: The present invention is a curable silicone resin composition, the composition containing a linear organopolysiloxane, where the linear organopolysiloxane consists solely of a linear organopolysiloxane that has a less than 70% change rate of a contact angle of the linear organopolysiloxane to an Au substrate, the change rate being shown by the following expression (I): [{(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)?(contact angle of the linear organopolysiloxane to the Au substrate 60 seconds after dropping the linear organopolysiloxane)}/(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)]*100(%) (I). This provides a curable silicone resin composition that causes little contamination of surrounding members, and in which bleed-out hardly occurs.

Abstract: A curable silicone resin composition contains the following components (A) to (D): (A) an organopolysiloxane having two or more and less than six alkenyl groups per molecule each having 2 to 10 carbon atoms; (B) an organopolysiloxane shown by the following formula (1); (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and contained such that the component (C) has a hydrosilyl group in an amount of 0.1 to 4.0 mol per mol of all alkenyl groups bonded to silicon atoms in the curable silicone resin composition; and (D) a platinum group metal-based catalyst. The component (B) is in an amount of 0.1 to 50 mass % relative to a total mass of the components (A) and (B). This invention provides a curable silicone resin composition for forming a silicone resin cured product excellent in mechanical properties, shock absorption, and transparency.

Abstract: A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa·s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

Abstract: The present invention provides a silylated isocyanurate compound shown by the following general formula (1), where R's each independently represent a hydrogen atom, or a substituent selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and a group shown by a general formula (2-a) or (2-b). At least one R is shown by the general formula (2-b). The silylated isocyanurate compound can serve as a metal corrosion inhibitor excellent in heat resistance and sulfurization resistance.

Abstract: An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from R1R2SiO2/2 and R1R22SiO1/2 units, and at least one unit selected from R2?2SiO2/2, R2?3SiO1/2 and R2?SiO3/2 units, wherein a percentage of a total number of the R1R2SiO2/2 and R1R22SiO1/2 units, relative to a total number of all siloxane units, is from 0.

Abstract: A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R1SiO3/2, 10 to 70 mol % of (R1)2SiO2/2 and 0 to 30 mol % of (R1)3SiO1/2 units, having Mw of 5,000-100,000, and containing at least a part of the (R1)2SiO2/2 unit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

Abstract: The present invention provides a curable organosilicon resin composition showing excellent optical transparency, curability, heat resistance and light resistance. The present invention also provides a semiconductor device encapsulated with a cured product of such a composition.

Abstract: Resin composition of (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom, and 0.1 to 30 mol % of R2R3SiO2/2 units based on the total mole of siloxane units and an SiO4/2 unit and a R1SiO3/2 unit, wherein the total mole of the SiO4/2 unit and the R1SiO3/2 unit is 50 mol % or more based on the total mole of the siloxane units, wherein a hydroxyl group is bonded to a silicon atom in an amount of at least 0.001 mol/100 g of the organopolysiloxane; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom and at least one aromatic hydrocarbon groups each bonded to a silicon atom at a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.1 to 4.0; and (C) a platinum group metal catalyst.

Abstract: One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance.

Abstract: Provided is an addition-curable organopolysiloxane resin composition capable of forming a cured product having a superior transparency, heat resistance and light resistance. The addition-curable organopolysiloxane resin composition contains: (A) an organopolysiloxane having in one molecule at least two silicon-atom-bonded alkenyl groups each having 2 to 10 carbon atoms; (B) an organohydrogenpolysiloxane having in one molecule at least two silicon-atom-bonded hydrogen atoms; (C) a platinum group metal-based catalyst; and (D) a barium compound represented by the following formula (1) Ba(OR)2??(1) wherein R represents a monovalent hydrocarbon group having 1 to 10 carbon atoms; or an acyl group having 2 to 15 carbon atoms.

Abstract: An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from R1R2SiO2/2 and R1R22SiO1/2 units, and at least one unit selected from R2?2SiO2/2, R2?3SiO1/2 and R2?SiO3/2 units, wherein a percentage of a total number of the R1R2SiO2/2 and R1R22SiO1/2 units, relative to a total number of all siloxane units, is from 0.

Abstract: A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R1SiO3/2, 10 to 70 mol % of (R1)2SiO2/2 and 0 to 30 mol % of (R1)3SiO1/2 units, having Mw of 5,000-100,000, and containing at least a part of the (R1)2SiO2/2 unit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

Abstract: A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

Abstract: The present invention provides a curable organosilicon resin composition showing excellent optical transparency, curability, heat resistance and light resistance. The present invention also provides a semiconductor device encapsulated with a cured product of such a composition.

Abstract: A curable silicone resin composition including: (A) an organopolysiloxane having at least two alkenyl groups per molecule, each bonded to a silicone atom and showing a viscosity of 10 to 1,000,000 mPa·s at 25 degrees C., and (B) an organopolysiloxane having a resin structure composed of 10 to 80 mol % of SiO4/2 unit, 0.1 to 80 mol % of (R1)2SiO2/2 unit and 1 to 60 mol % of (R2)3SiO1/2 unit and having a weight average molecular weight of 1,000 to 10,000. R1 represents an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, and R2 represents, independently of each other, an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, provided that at least one among all of R2 is an alkenyl group.

Abstract: Provided is an addition-curable organopolysiloxane resin composition capable of forming a cured product having a superior transparency, heat resistance and light resistance. The addition-curable organopolysiloxane resin composition contains: (A) an organopolysiloxane having in one molecule at least two silicon-atom-bonded alkenyl groups each having 2 to 10 carbon atoms; (B) an organohydrogenpolysiloxane having in one molecule at least two silicon-atom-bonded hydrogen atoms; (C) a platinum group metal-based catalyst; and (D) a barium compound represented by the following formula (1) Ba(OR)2 ??(1) wherein R represents a monovalent hydrocarbon group having 1 to 10 carbon atoms; or an acyl group having 2 to 15 carbon atoms.

Abstract: The present invention provides an adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition, the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule. There can be provided an adhesion promoter which can make a cured product of an addition curable organopolysiloxane resin composition excellent in heat resistance, workability, adhesiveness, and gas barrier property by adding it to the composition.

Abstract: One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance.

Abstract: An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Abstract: A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.