Abstract: A power source apparatus provided with battery blocks (2) that have a plurality of battery cells (1) connected together, an outer case (3) that houses the battery blocks and/or electrical components connected to the battery blocks, a socket (4) connected in series with the battery blocks and disposed on the outer case, and a service plug (5) that connects with the socket in a removable manner. The service plug connects with the socket to connect the service plug in series with the batteries via the socket. The outer case is provided with a socket and service plug thermal isolation region (8) sectioned-off by a heat-shielding plate (7), and the socket and service plug are disposed in the thermal isolation region.

Abstract: A battery pack includes battery cells, bus bars, and a wire harness. The battery cells include terminals on the upper surfaces of the battery cells. The bus bars connect the terminals of the battery cells to each other with the plurality of battery cells being arranged side by side. The wire harness is connected to the terminals. An electrically insulating separation wall is arranged between the terminal and the wire harness.

Abstract: The power source apparatus of the present invention is provided with battery blocks 2 that have a plurality of battery cells 1 connected together, an outer case 3 that houses the battery blocks 2 and/or electrical components 10 connected to the battery blocks 2, a socket 4 connected in series with the battery blocks 2 and disposed on the outer case 3, and a service plug 5 that connects with the socket 4 in a removable manner. The service plug 5 connects with the socket 4 to connect the service plug 5 in series with the batteries via the socket 4. The outer case 3 is provided with a socket 4 and service plug 5 thermal isolation region 8 sectioned-off by a heat-shielding plate 7, and the socket 4 and service plug 5 are disposed in the thermal isolation region 8.

Abstract: A battery pack device includes a plurality of battery cells 1, a bind bar 4, and a regulation member 31. The plurality of battery cells 1 has a rectangular box exterior shape. The bind bar 4 couples the plurality of battery cells 1 to each other with the battery cells 1 being arranged side by side. When the battery pack 10 is secured onto a horizontal surface, the regulation member 31 regulates upward deviation of at least one of the battery cells 1, which is located in a central part of the battery pack in the side-by-side arrangement direction of the battery cells 1.

Abstract: A battery system has a battery block with a plurality of battery cells that are rectangular batteries stacked with intervening insulating separators, and that battery block is held by fastening components. The fastening components are provided with a pair of endplates disposed at the ends of the stacked battery cells, and metal bands on both sides of the battery block connected at both ends to the endplates. An insulating separator has an insulating plate section, which intervenes between adjacent battery cells, and insulating walls, which cover both battery cell side-walls, formed from plastic as a single-piece. In this battery system, insulating plate sections are sandwiched between battery cells, and the insulating walls are disposed between battery cell outer side-walls and metal bands to insulate the battery cells from the metal bands.

Abstract: A power supply device includes a battery block 2, a hollow exhaust duct 20 and an exterior case 30. The battery block 2 includes rectangular battery cells 1A that are arranged side by side and have gas relief ports 12 of gas relief valves 11. The gas relief ports 12 are aligned in substantially the same plane. The exhaust duct 20 extends along the gas relief ports 12, and exhausts gas relieved from the gas relief ports 12. The exterior case 30 accommodates the battery block 2 with the exhaust duct 2 arranged on the battery block 2. The exhaust duct 20 includes interlocking portions 40 that are arranged on different positions from a pair of guide portions 26, and protrude downward. The battery block 2 includes interlock reception portions 45 that interlock with the interlocking portions 40 and are arranged at positions corresponding to the interlocking portions 40.

Abstract: The battery system has a battery block 2 with a plurality of battery cells 1 that are rectangular batteries stacked with intervening insulating separators 15, and that battery block 2 is held by fastening components 3. The fastening components 3 are provided with a pair of endplates 4 disposed at the ends of the stacked battery cells 1, and metal bands 5 on both sides of the battery block 2 connected at both ends to the endplates 4. An insulating separator 15 has an insulating plate section 15X, which intervenes between adjacent battery cells 1, and insulating walls 15C, which cover both battery cell 1 side-walls, formed from plastic as a single-piece. In this battery system, insulating plate sections 15X are sandwiched between battery cells 1, and the insulating walls 15C are disposed between battery cell outer side-walls and metal bands to insulate the battery cells from the metal bands.

Abstract: In an electromagnetic fuel injection valve including a resin molded part of a synthetic resin which integrally has a coupler to which a connecting terminal connecting to a coil of a coil assembly is faced, and in which at least part of the solenoid housing is embedded, the resin molded part (7) is formed by a first resin molded layer (7a) which is formed of a synthetic resin with mixture of glass fibers to cover at least part of the solenoid housing (25) and form at least part of a coupler (40), and a second resin molded layer (7b) which is formed of thermoplastic polyester elastomer with mixture of glass fibers excluded to cover the first resin molded layer (7a). This makes it possible to effectively suppress occurrence of operation sound while securing sufficient strength for obtaining reliability of an electrical connecting portion and to make the fuel injection valve compact.

Abstract: This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the

Abstract: The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.

Abstract: This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the

Abstract: A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the circuit board is cooled or

Abstract: The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.

Abstract: This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the

Abstract: An electric connector which can prevent soiling to terminals thereof without the necessity of provision of an additional part such as a cap. The electric connector comprises a pair of female and male housings formed for fitting engagement with each other in one direction, a locking arm extending from the male housing in parallel to and resiliently displaceable in a direction perpendicular to the fitting direction, and a first engaging projection formed on the locking arm for fitting in an opening formed in the female housing. A first arresting element is provided on the female housing for engaging with the first engaging projection in a fully fitted position of the female and male housings to lock the housings in the position.