Patents by Inventor Tomozo Ogawa

Tomozo Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7811653
    Abstract: An extrusion molded article for automobiles, having a body portion (1) and a hollow sealing portion (11), where the body portion (1) comprises a core (2) made of a resin having a U-shaped cross-section extending in a longitudinal direction and a covering layer (3) surrounding and covering the core partly or entirely, and the hollow sealing portion (11) is bonded integrally with an outer surface (4) of the body portion, characterized in that the covering layer (3) is made of a thermoplastic elastomer composition having a tensile elongation at break of at least 350%, as determined according to JIS K6251, and a change in 100% modulus of at most 40%, wherein the change in 100% modulus=[(100% modulus at 23° C.-100% modulus at 80° C.)/100% modulus at 23° C.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: October 12, 2010
    Assignee: Riken Technos Corporation
    Inventors: Naohisa Miyakawa, Hiromasa Sanada, Naoyuki Ono, Tomozo Ogawa
  • Publication number: 20070237922
    Abstract: An extrusion molded article for automobiles, having a body portion (1) and a hollow sealing portion (11), where the body portion (1) comprises a core (2) made of a resin having a U-shaped cross-section extending in a longitudinal direction and a covering layer (3) surrounding and covering the core partly or entirely, and the hollow sealing portion (11) is bonded integrally with an outer surface (4) of the body portion, characterized in that the covering layer (3) is made of a thermoplastic elastomer composition having a tensile elongation at break of at least 350%, as determined according to JIS K6251, and a change in 100% modulus of at most 40%, wherein the change in 100% modulus=[(100% modulus at 23° C.?100% modulus at 80° C.)/100% modulus at 23° C.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 11, 2007
    Applicant: RIKEN TECHNOS CORPORATION
    Inventors: Naohisa Miyakawa, Hiromasa Sanada, Naoyuki Ono, Tomozo Ogawa