Abstract: A display may have an array of pixels controlled by display driver circuitry. The pixels may have pixel circuits. In liquid crystal display configurations, each pixel circuit may have an electrode that applies electric fields to an associated portion of a liquid crystal layer. In organic light-emitting diode displays, each pixel circuit may have a drive transistor that applies current to an organic light-emitting diode in the pixel circuit. The pixel circuits and display driver circuitry may have thin-film transistor circuitry that includes transistor such as silicon transistors and semiconducting-oxide transistors. Semiconducting-oxide transistors and silicon transistors may be formed on a common substrate. Semiconducting-oxide transistors may have polysilicon layers with doped regions that serve as gates. Semiconducting-oxide channel regions overlap the gates.

Abstract: A display may have a layer of liquid crystal material between a color filter layer and a thin-film transistor layer. Column spacer structures may be formed between the color filter layer and the thin-film transistor layer to maintain a desired separation between the color filter and thin-film transistor layers. Column spacers may be deposited in column spacer regions of the color filter layer. The color filter layer may include rows of red, green, and blue color filter elements. Blue color filter material that forms blue color filter elements in the color filter layer may also be used to form a planar surface over red and green color filter elements in the column spacer regions. Using the blue color filter material to planarize the surface on which column spacers are formed ensures that the column spacers provide sufficient support for the display without requiring an additional planarization layer.

Abstract: A display may have an array of pixels controlled by display driver circuitry. The pixels may have pixel circuits. In liquid crystal display configurations, each pixel circuit may have an electrode that applies electric fields to an associated portion of a liquid crystal layer. In organic light-emitting diode displays, each pixel circuit may have a drive transistor that applies current to an organic light-emitting diode in the pixel circuit. The pixel circuits and display driver circuitry may have thin-film transistor circuitry that includes transistor such as silicon transistors and semiconducting-oxide transistors. Semiconducting-oxide transistors and silicon transistors may be formed on a common substrate. Semiconducting-oxide transistors may have polysilicon layers with doped regions that serve as gates. Semiconducting-oxide channel regions overlap the gates.

Abstract: A display may have a layer of liquid crystal material between a color filter layer and a thin-film transistor layer. Column spacer structures may be formed between the color filter layer and the thin-film transistor layer to maintain a desired separation between the color filter and thin-film transistor layers. Column spacers may be deposited in column spacer regions of the color filter layer. The color filter layer may include rows of red, green, and blue color filter elements. Blue color filter material that forms blue color filter elements in the color filter layer may also be used to form a planar surface over red and green color filter elements in the column spacer regions. Using the blue color filter material to planarize the surface on which column spacers are formed ensures that the column spacers provide sufficient support for the display without requiring an additional planarization layer.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.