Patents by Inventor Tong Cheng Tsai

Tong Cheng Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11800895
    Abstract: A vaporizer comprises an absorber and a heating element. The absorber is configured to absorb the material to be vaporized and comprises a plurality of first pores of a 100-500 nm diameter and a plurality of second pores of a 20-100 nm diameter. A ratio of the number of the second pores N2 to the number of the first pores N1 in a unit area, i.e., N2/N1, is 10-50%. The heating element heats and vaporizes the material to be vaporized in the absorber.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: October 31, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Po-Chih Shen, Tong-Cheng Tsai, David Shau-Chew Wang, Yu-Sian Jhuo
  • Publication number: 20220104549
    Abstract: A vaporizer comprises an absorber, a heating element, and a porous cover layer. The absorber is configured to absorb a material to be vaporized. The heating element is configured to heat and vaporize the material to be vaporized in the absorber, and includes a first electrode portion, a second electrode portion, and an electrically conductive connecting member connected between the first electrode portion and the second electrode portion. The porous cover layer covers at least a portion of the heating element without covering the first and second electrode portions. A ratio of an area of the porous cover layer to an area of the electrically conductive connecting member is defined as a covering ratio, which is at least 50%. A porosity of the porous cover layer ranges from 30% to 75%.
    Type: Application
    Filed: January 8, 2021
    Publication date: April 7, 2022
    Inventors: Po-Chih SHEN, Tong Cheng TSAI, Yu Sian JHOU
  • Publication number: 20210195953
    Abstract: A vaporizer comprises an absorber and a heating element. The absorber is configured to absorb the material to be vaporized and comprises a plurality of first pores of a 100-500 nm diameter and a plurality of second pores of a 20-100 nm diameter. A ratio of the number of the second pores N2 to the number of the first pores N1 in a unit area, i.e., N2/N1, is 10-50%. The heating element heats and vaporizes the material to be vaporized in the absorber.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 1, 2021
    Inventors: Po-Chih SHEN, Tong-Cheng TSAI, David Shau-Chew WANG, Yu-Sian JHUO
  • Patent number: 9653192
    Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: May 16, 2017
    Assignee: Polytronics Technology Corp.
    Inventors: Chien Cheng Ho, Tong Cheng Tsai, Kuo Chang Lo, Yi An Sha
  • Publication number: 20160093414
    Abstract: A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.
    Type: Application
    Filed: July 22, 2015
    Publication date: March 31, 2016
    Inventors: CHIEN CHENG HO, TONG CHENG TSAI, KUO CHANG LO, YI AN SHA
  • Patent number: 9224525
    Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: December 29, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tong Cheng Tsai, Wen Feng Lee, Chun Teng Tseng, Chi Jen Su, Yi An Sha
  • Patent number: 9147509
    Abstract: A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 ?-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 ?-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3A/mm2. Each electrode lead has a cross-sectional area of at least 0.16 mm2.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: September 29, 2015
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Fu Hua Chu, Yi An Sha, En Tien Yang, Tong Cheng Tsai
  • Publication number: 20150155080
    Abstract: A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 ?-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 ?-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3 A/mm2. Each electrode lead has a cross-sectional area of at least 0.16 mm2.
    Type: Application
    Filed: May 19, 2014
    Publication date: June 4, 2015
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Fu Hua CHU, Yi An SHA, En Tien YANG, Tong Cheng TSAI
  • Publication number: 20140209365
    Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.
    Type: Application
    Filed: September 4, 2013
    Publication date: July 31, 2014
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tong Cheng TSAI, Wen Feng LEE, Chun Teng TSENG, Chi Jen SU, Yi An SHA
  • Patent number: 8421584
    Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: April 16, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
  • Publication number: 20120182118
    Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 19, 2012
    Applicant: Polytronics Technology Corp.
    Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
  • Patent number: 7965479
    Abstract: An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: June 21, 2011
    Assignee: Polytronics Technology Corporation
    Inventors: Pao Hsuan Chen, Ching Han Yu, Tong Cheng Tsai
  • Patent number: 7708912
    Abstract: A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: May 4, 2010
    Assignee: Polytronics Technology Corporation
    Inventors: Pao Hsuan Chen, David Shau Chew Wang, Tong Cheng Tsai
  • Publication number: 20090309074
    Abstract: A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data.
    Type: Application
    Filed: June 16, 2008
    Publication date: December 17, 2009
    Applicant: POLYTRONICS TECHNOLOGY CORPORATION
    Inventors: Pao Hsuan Chen, David Shau Chew Wang, Tong Cheng Tsai
  • Publication number: 20090231763
    Abstract: An over-voltage protection device comprises a substrate having a first surface and a second surface, a first nonrectangular conductor having a first protrusion positioned on the first surface of the substrate, a second nonrectangular conductor having a second protrusion positioned on the first surface of substrate, at least one alignment block positioned on the second surface, and a variable impedance material positioned between the first protrusion and the second protrusion. Preferably, the second protrusion faces the first protrusion to form an arcing path from the first protrusion to the second protrusion.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Applicant: POLYTRONICS TECHNOLOGY CORPORATION
    Inventors: Pao Hsuan Chen, David Shau Chew Wang, Ching Han Yu, Tong Cheng Tsai
  • Publication number: 20090224213
    Abstract: A variable impedance composition according to this aspect of the present invention comprises a conductive powder in an amount from 10% to 30% of the weight of the variable impedance composition, a semi-conductive power in an amount from 30% to 90% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 3% to 50% of the weight of the variable impedance composition. According to one embodiment of the present invention, the variable impedance material presents a high resistance at a low applied voltage and a low resistance at a high applied voltage. As the variable impedance material is positioned in a gap between two conductors of an over-voltage protection device, the over-voltage protection device as a whole presents a high resistance to a low voltage applied across the gap and a low resistance to a high voltage applied across the gap.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 10, 2009
    Applicant: POLYTRONICS TECHNOLOGY CORPORATION
    Inventors: Pao Hsuan Chen, David Shau Chew Wang, Ching Han Yu, Tong Cheng Tsai
  • Publication number: 20080100981
    Abstract: An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.
    Type: Application
    Filed: September 19, 2007
    Publication date: May 1, 2008
    Inventors: Pao Hsuan CHEN, Ching Han Yu, Tong Cheng Tsai
  • Publication number: 20050047041
    Abstract: An over-current protection device includes a first electrode layer, a second electrode layer and a polymeric current-sensitive layer sandwiched between the first and second electrode layers. The polymeric current-sensitive layer comprises 2-4% silicate flakes by weight, which is a nano-material of a thickness approximately 1 nanometer (nm) and a diameter between 100-500 nm.
    Type: Application
    Filed: June 28, 2004
    Publication date: March 3, 2005
    Inventors: Yun-Ching Ma, Tong-Cheng Tsai
  • Publication number: 20040227611
    Abstract: An over-current protection apparatus with high voltage endurance comprises a first electrode layer, a second electrode layer and a ceramic current-sensitive layer, where both the first and second electrode layers are continuous and uniform to enhance electrical and thermal conductivities thereof. The ceramic current-sensitive layer is sandwiched between the first and second electrode layers, and is essentially composed of basic matrix, dopants, conductors and sintering material. The resistance of the over-current protection apparatus with high voltage endurance is less than 10 ohms before being tripped, and the resistance-jumping ratio is less than 1.3.
    Type: Application
    Filed: January 16, 2004
    Publication date: November 18, 2004
    Inventors: Edward F. Chu, Yun-Ching Ma, Tong-Cheng Tsai