Abstract: A first device performs periodic scanning alternately, where a first scanning periodicity is used for a first-type Bluetooth connection, and a second scanning periodicity is used for a second-type Bluetooth connection; the first device receives a first-type data packet from a second device in a first scan window of any first scanning periodicity, where the first-type data packet is used to establish the first-type Bluetooth connection; the first device obtains, based on the first-type data packet, a second connection parameter for establishing the second-type Bluetooth connection to the second device; and the first device establishes the second-type Bluetooth connection to the second device based on the second connection parameter.

Abstract: An ear physiological wearable device, including a main body and a supporting body, is provided. The main body includes an acoustic driving portion, a temperature sensing portion and an optical scanning portion. The acoustic driving portion is adjacent to the temperature sensing portion, and the optical scanning portion is disposed below the acoustic driving portion and the temperature sensing portion. The supporting body is connected to the main body. The acoustic driving portion includes an acoustic outlet, and the temperature sensing portion includes a nozzle. Two ear physiological wearable devices, one of them including an acoustic driving portion with an acoustic end against the user's skull, another including a main body including a temperature sensing portion and an optical scanning portion, are provided. In this way, the audio signal can be transmitted and/or the users' physiological status can be sensed.

Abstract: Reconfigurable 3D interconnect is provided that can be used for digital and RF signals. The reconfigurable 3D interconnect can include an array of vertical interconnect vias (or TSVs) providing a signal path between a first core element of a 3D IC and a second core element of the 3D IC stacked above the first core element. A routing circuit can be used to route a signal from the first core element to the second core element through selected TSVs of the array of TSVs providing the signal path between the first core element and the second core element. The routing circuit allows re-routing of the signal through different selected TSVs during operation, which can provide real time adjustments and capacity optimization of the TSVs passing the particular signal between the elements.

Abstract: Reconfigurable 3D interconnect is provided that can be used for digital and RF signals. The reconfigurable 3D interconnect can include an array of vertical interconnect vias (or TSVs) providing a signal path between a first core element of a 3D IC and a second core element of the 3D IC stacked above the first core element. A routing circuit can be used to route a signal from the first core element to the second core element through selected TSVs of the array of TSVs providing the signal path between the first core element and the second core element. The routing circuit allows re-routing of the signal through different selected TSVs during operation, which can provide real time adjustments and capacity optimization of the TSVs passing the particular signal between the elements.