Abstract: Noise attenuating devices and methods, precursors and abrasive blasting masks for manufacturing noise attenuating devices are disclosed. An exemplary method disclosed herein includes bonding a facing sheet of the noise attenuating device to a cellular core and then perforating the facing sheet. Perforating the facing sheet may be performed by abrasive blasting using a mask configured to prevent the abrasive blasting of an underlying structure.

Abstract: A plastic insert is configured to provide support of thin wafers in wafer carriers configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the methods of supporting the thin wafers as provided by the insert and the wafer carrier. The inserts, in preferred embodiments, utilize tabs that fit into the side wall recesses and have an interference fit in said recesses to secure the insert in place. In preferred embodiments the inserts have a top surface with a plurality of ribs positioned inwardly from the wafer periphery for supporting the wafers with minimal contact. In preferred embodiments the insert has a lower surface having strengthening structure providing rigidity to the insert.

Abstract: A plastic insert is configured to provide support of thin wafers in wafer carriers configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the methods of supporting the thin wafers as provided by the insert and the wafer carrier. The inserts, in preferred embodiments, utilize tabs that fit into the side wall recesses and have an interference fit in said recesses to secure the insert in place. In preferred embodiments the inserts have a top surface with a plurality of ribs positioned inwardly from the wafer periphery for supporting the wafers with minimal contact. In preferred embodiments the insert has a lower surface having strengthening structure providing rigidity to the insert.

Abstract: A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.

Abstract: A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.

Abstract: A two part hinge for containers and boxes. The first part includes a pair parallel arms which include axially aligned opposing sockets which are configured to rotatingly receive pintle ends. The sockets are provided with radially disposed channels which extend from the sockets to exterior edges of the arms to form a slot for guiding the pintle ends into the sockets. The first hinge part also includes a dual function tab which is generally collaterally aligned with and parallel to the arms of the first part of the hinge. The tab is provided with a camming surface and a retaining surface. The camming surface engages and deflects the center portion of the pintle as it passes thereby, while the retaining surface maintains the pintle ends in the sockets by effectively blocking movement of the center portion of the pintle. The retaining surface of the tab is consistent with the arcuate surfaces of the sockets to form a smooth transition between the socket surfaces and the retaining surface of the tab.