Abstract: A punch unit is used in a powder press molding device that includes a die plate including a cavity in which a compacted powder pellet can be formed, the powder press molding device including a ram moving in a direction approaching the die plate and in a direction away from the die plate. The punch unit includes a punch inserted into the cavity of the die plate when the ram approaches the die plate, and a supporting portion supporting the punch reciprocatably, the punch unit being movable along a plane intersecting with the moving direction of the ram in a state where the punch is removed from the cavity. The punch unit is capable of shortening a distance in which the ram moves, and a cycle time can be shortened.

Abstract: A punch unit is used in a powder press molding device that includes a die plate including a cavity in which a compacted powder pellet can be formed, the powder press molding device including a ram moving in a direction approaching the die plate and in a direction away from the die plate. The punch unit includes a punch inserted into the cavity of the die plate when the ram approaches the die plate, and a supporting portion supporting the punch reciprocatably, the punch unit being movable along a plane intersecting with the moving direction of the ram in a state where the punch is removed from the cavity. The punch unit is capable of shortening a distance in which the ram moves, and a cycle time can be shortened.

Abstract: A printing plate delivery system for a multi-stage printing press, in which a plurality of printing stages are arranged in vertical direction, comprises a vertical transporting device having a carrier movable in vertical direction between a loading position where a printing plate set along the height direction of the printing press being loaded and a printing plate transfer positions at the corresponding height positions to the printing stages for transferring the printing plate, and receiving device provided corresponding to each of the printing stages and cooperated with the vertical transporting device for receiving the printing plate from the carrier at the corresponding transfer position.

Abstract: An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for electrical connection with associated ones of the conductors and with an external circuit, respectively. Fabrication of the IC chip package is made through the steps of placing the inner lead sites into intimate contact on distal ends of the corresponding conductors, and applying ultrasonic vibrations to contacting surfaces between the inner lead sites and the conductors so as to effect diffusion bonding therebetween.

Abstract: A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.