Patents by Inventor Toralf Bork

Toralf Bork has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal flow sensor having streamlined packaging
    Patent number: 7181963
    Abstract: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The first, second and third substrate form a multi-layer body structure having at least one edge extending between a first side of the first substrate and the second side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. The conduit has an inlet opening and an outlet opening that are formed in the at least one edge.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: February 27, 2007
    Assignee: Codman & Shurtleff, Inc
    Inventor: Toralf Bork
  • Thermal flow sensor having an inverted substrate
    Patent number: 7069779
    Abstract: A thermal flow sensor has a first substrate, second substrate and a third substrate, each of which has a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 4, 2006
    Assignee: Codman & Shurtleff, Inc.
    Inventors: Frank Zumkehr, Juergen Burger, Toralf Bork, Alec Ginggen
  • Thermal flow sensor having an inverted substrate
    Publication number: 20060000270
    Abstract: A thermal flow sensor has a first substrate, second substrate and a third substrate, each of which has a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Frank Zumkehr, Juergen Burger, Toralf Bork, Alec Ginggen
  • Thermal flow sensor having streamlined packaging
    Publication number: 20060000271
    Abstract: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The first, second and third substrate form a multi-layer body structure having at least one edge extending between a first side of the first substrate and the second side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. The conduit has an inlet opening and an outlet opening that are formed in the at least one edge.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventor: Toralf Bork