Abstract: A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Abstract: A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Abstract: A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side. A thickness of the baseplate is locally reduced in a region of the depression. The power semiconductor module further includes a circuit carrier arranged above the depression on the top side of the baseplate such that the depression is interposed between the circuit carrier and the underside of the baseplate.

Abstract: A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Abstract: A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Abstract: A crash box arrangement includes a hollow member having a first hardness and defining a hollow space in communication with at least one ventilation opening; and a damper having a second hardness which is smaller than the first hardness. The damper has an impulse cavity in communication with the hollow space of the hollow member.

Abstract: A bumper arrangement for an automobile includes a crossbeam with crash boxes and a pedestrian protection element arranged on the crossbeam. The material of the pedestrian protection element has a lower firmness compared to the material of the crossbeam. A deformation element is arranged in the pedestrian protection element. The deformation element can be retracted into the crossbeam in an impact with a pedestrian, so that only the pedestrian protection element produces a damping effect. In a high-intensity crash, the deformation element can be rigidly connected with the crossbeam and thus lengthen the available deformation path of the crash box along the deformation element.

Abstract: A bumper of a motor vehicle includes a cross member which is disposed transversely to a side rail of a motor vehicle frame and movable from a standby position in a direction of the motor vehicle. Placed between the cross member and the side rail is a crash box. A coupler maintains a distance between the cross member and the crash box, when the cross member assumes the standby position, and a strut extends at an inclination between the cross member and the crash box to connect the cross member to the crash box. The strut is supported upon the cross member by a linear guide and supported upon the crash box by a swivel joint.

Abstract: A bumper of a motor vehicle includes a cross member which is disposed transversely to a side rail of a motor vehicle frame and movable from a standby position in a direction of the motor vehicle. Placed between the cross member and the side rail is a crash box. A coupler maintains a distance between the cross member and the crash box, when the cross member assumes the standby position, and a strut extends at an inclination between the cross member and the crash box to connect the cross member to the crash box. The strut is supported upon the cross member by a linear guide and supported upon the crash box by a swivel joint.