Abstract: Disclosed herein is a semiconductor chip that includes: a plurality of penetration electrodes each penetrating between main and back surfaces of the semiconductor chip, the penetration electrodes including a plurality of first penetration electrodes, a second penetration electrode and a third penetration electrode; and a wiring configured to intersect with a plurality of regions, each of the regions being defined as a region between corresponding two of the first penetration electrodes, one end of the wiring being coupled to the second penetration electrode, the other end of the wiring being coupled to the third penetration electrode.

Abstract: The present invention is applicable to a semiconductor device having a plurality of chips being stacked with a TSV structure in which adjacent ones of the chips are connected to each other via a plurality of through electrodes. Each of the chips includes a plurality of TSV array portions provided so as to correspond to a plurality of channels. The TSV array portions include a TSV array portion that contributes to an input and an output depending upon the number of the chips being stacked, and a pass-through TSV array portion that is not connected to an input/output circuit.

Abstract: Disclosed herein is a device that includes a first semiconductor chip. The first semiconductor chip includes a first data storage area storing data, a first refresh circuit repeating a first refresh operation on the first data storage area to make the first data storage area retain the data, a first terminal supplied with a first control signal from outside of the first semiconductor chip, and a first control circuit coupled between the first terminal and the first refresh circuit to control a repetition cycle of the first refresh operation in response to the first control signal.

Abstract: An electromagnetic fuel injection valve includes: a valve element which closes a fuel passage by coming into contact with a valve seat and opens the fuel passage by going away from the valve seat; an electromagnet which includes a coil and a magnetic core formed as a drive portion for driving the valve element; a movable element which is held by the valve element in a state where the movable element is displaceable in the direction of a drive force of the valve element relative to the valve element; a first biasing portion for biasing the valve element in the direction opposite to the direction of a drive force generated by the drive portion; a second biasing portion for biasing the movable element in the direction of the drive force with a biasing force smaller than the biasing force generated by the first biasing portion; and a restricting portion for restricting the displacement of the movable element in the direction of the drive force relative to the valve element.

Abstract: A device includes a plurality of memory cells, an error detection circuit configured to detect at least one memory cell storing error data and a refresh control circuit including a register configured to store an error address corresponding to the at least one memory cell storing error data. The refresh control circuit is configured to control a refresh cycle of the error address.

Abstract: There is provided a rotor of a rotating electrical machine including a pair of field core bodies that are provided so as to enclose the field coil via the insulation bobbin around which the field coil is wound, in which a claw-shaped magnetic pole extending from an outer circumferential section of the field core body in an axial direction is provided on the field core body. The insulation bobbin has a plurality of flange sections extending from the base section of the claw-shaped magnetic pole along an inner surface of the claw-shaped magnetic pole of the field core body, and a plurality of thin portions are formed in the root section of the flange section at intervals in a circumferential direction.

Abstract: A device includes first and second semiconductor chips. The first semiconductor chip includes an edge defining a periphery of the first semiconductor chip. The second semiconductor chip is greater in size than the first semiconductor chip. The second semiconductor chip is stacked over the first semiconductor chip so that the second semiconductor chip hangs over from the edge of the first semiconductor chip. The second semiconductor chip includes a plurality of wiring patterns including a first wiring pattern that positions over the edge of the first semiconductor chip, an insulating film which covers the wiring patterns and which includes on or more holes that expose one or more the wiring patterns, and one or more bump electrodes formed on the one or more the wiring patterns. Remaining one or ones of the wiring patterns is kept covered by the insulating layer and includes the first wiring pattern.

Abstract: A device includes a semiconductor substrate, a first penetrating electrode penetrating through the semiconductor substrate, a first test pad, and a first tri-state buffer coupled between the first penetrating electrode and the first test pad. The first tri-state buffer receives a buffer control signal at a control terminal thereof. The device further includes a buffer control circuit supplying the buffer control signal to the first tri-state buffer.

Abstract: To include first and second data input/output terminals allocated to first and second memory circuit units, respectively, and an address terminal allocated in common to these memory circuit units. When a first chip selection signal is activated, the first memory circuit unit performs a read operation or a write operation via the first data input/output terminal based on an address signal regardless of an operation of the second memory circuit unit. When a second chip selection signal is activated, the second memory circuit unit performs a read operation or a write operation via the second data input/output terminal based on the address signal regardless of an operation of the first memory circuit unit. With this configuration, a wasteful data transfer can be prevented, and the effective data transfer rate can be increased.

Abstract: The present invention is applicable to a semiconductor device having a plurality of chips being stacked with a TSV structure in which adjacent ones of the chips are connected to each other via a plurality of through electrodes. Each of the chips includes a plurality of TSV array portions provided so as to correspond to a plurality of channels. The TSV array portions include a TSV array portion that contributes to an input and an output depending upon the number of the chips being stacked, and a pass-through TSV array portion that is not connected to an input/output circuit.

Abstract: The present invention is applicable to a semiconductor device having a plurality of chips being stacked with a TSV structure in which adjacent ones of the chips are connected to each other via a plurality of through electrodes. Each of the chips includes a plurality of TSV array portions provided so as to correspond to a plurality of channels. The TSV array portions include a TSV array portion that contributes to an input and an output depending upon the number of the chips being stacked, and a pass-through TSV array portion that is not connected to an input/output circuit.

Abstract: A method for triggering an adjustment operation in a dynamic random access memory device, the method including receiving a refresh command, generating an execute signal, counting the execute signal to provide a count value, refreshing a memory array based on the count value and triggering the adjustment operation when the count value reaches a predetermined value.

Abstract: A semiconductor device, includes an input buffer, first and second PMOS transistors serially interconnected between a first power supply node and an output node of the input buffer. First and second NMOS transistors are serially interconnected between a second power supply node and the output node of the input buffer. A replica circuit includes a third and fourth PMOS transistors serially interconnected between the first power supply node and an output node of the replica circuit. Third and fourth NMOS transistors are serially interconnected between the second power supply node and the output node of the replica circuit. The input node of the replica circuit is connected to the output node of the replica circuit and a comparison circuit compares a voltage at the output node of the replica circuit to a reference voltage.

Abstract: A method for synchronizing an output clock signal with an input clock signal in a delay locked loop. A first count values decreasing the number of bypassed elements in a differential delay line until an edge of the output clock signal is delayed relative to an edge of the input clock signal or the first count value reaches a first count final value if the first count value reaches the first count final value, a second count value is adjusting to decrease the number of bypassed elements in a single-ended delay line until the edge of the output clock signal is delayed relative to the edge of the input clock signal. A third count value is adjusted to decrease the delay of an interpolator until the edge of the output clock signal is no longer delayed with respect to the edge of the input clock signal.

Abstract: A method for triggering an adjustment operation in a dynamic random access memory device, the method including receiving a refresh command, generating an execute signal, counting the execute signal to provide a count value, refreshing a memory array based on the count value and triggering the adjustment operation when the count value reaches a predetermined value.

Abstract: In a semiconductor device in which semiconductor chips having a number of signal TSVs are stacked, a huge amount of man-hours have been required to perform a continuity test for each of the signal TSVs. According to the present invention, no continuity test is performed directly on signal TSVs. Dummy bumps are arranged in addition to signal TSVs. The dummy bumps of the semiconductor chips are connected through a conduction path that can pass the dummy bumps between the semiconductor chips with one stroke when the semiconductor chips are stacked. A continuity test of the conduction path allows a bonding defect on bonded surfaces of two of the stacked semiconductor chips to be measured and detected.

Abstract: Disclosed heroin is a device that includes a plurality of memory circuits and a refresh control circuit configured to generate a plurality of refresh initiation signals such that one of the refresh initiation signals takes an active level. Each of the memory circuits comprises a memory cell array including a plurality of memory cells, at least one data terminal, a data read/write circuit performing a data read operation to read out read-data from a selected one of the memory cells and supply the read-data to the data terminal and a data write operation to receive write-data from the data terminal and write the write-data into a selected one of the memory cells, and a refresh circuit performing a data refresh operation on selected one or ones of the memory cells of the memory cell array in response to an associated one of the refresh initiation signals taking the active level.

Abstract: A semiconductor device includes a first input buffer adjusting a logic threshold voltage, a first replica circuit, a first reference voltage generating circuit, and a first comparator circuit. The first replica circuit is identical in circuit configuration to the first input buffer. The first replica circuit has an input and an output connected to the input. The first replica circuit generates the logic threshold voltage as an output voltage. The first reference voltage generating circuit generates a first reference voltage. The first comparator circuit compares the logic threshold voltage as an output voltage of the first replica circuit to the first reference voltage to generate a first threshold adjustment signal. The first comparator circuit supplies the first threshold adjustment signal to the first input buffer and the first replica circuit. The first threshold adjustment signal allows the first input buffer to adjust the logic threshold voltage.

Abstract: Disclosed herein is a device that includes a first semiconductor chip. The first semiconductor chip includes a first data storage area storing data, a first refresh circuit repeating a first refresh operation on the first data storage area to make the first data storage area retain the data, a first terminal supplied with a first control signal from outside of the first semiconductor chip, and a first control circuit coupled between the first terminal and the first refresh circuit to control a repetition cycle of the first refresh operation in response to the first control signal.

Abstract: Disclosed herein is a device that includes: external terminals; a first chip including a first control circuit that generates a first control signal; and a second chip stacked with the first chip. The second chip includes: a first test terminal supplied with a first test signal and being free from connecting to any one of the external terminals; a second test terminal supplied with the first test signal and coupled to one of the external terminals without connecting to any one of control circuits of the first chip; a first normal terminal supplied with the first control signal and coupled to another of the external terminals with an intervention of the first control circuit of the first chip; and a first selection circuit including first input node coupled in common to the first and second test terminals and the second input node coupled to the first normal terminal.