Abstract: Provided is a novel spherical polymethylsilsesquioxane particle having an unprecedentedly large specific surface area ratio. The spherical polymethylsilsesquioxane particle includes a particle main body containing at least: a network structure formed by silicon atoms (n) and oxygen atoms (n) bonded to the silicon atoms (n); a methyl group bonded to at least one of the silicon atoms (n); and an alkoxyl group bonded to at least one of the silicon atoms (n), wherein the spherical polymethylsilsesquioxane particle satisfies the following expression (1): Expression (1) S1/S2?8.0, in the expression (1), S1 represents a specific surface area (m2/g) measured by a nitrogen adsorption BET one-point method, S2 represents 6/(?×D50) and a unit thereof is (m2/g), ? represents a particle density (g/m3), and D50 represents a volume-based 50% cumulative diameter (m) measured by a laser diffraction/scattering method.

Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.

Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

Abstract: An interchannel skew adjustment circuit adjusts signal skew between a first channel and a second channel. The circuit includes a phase adjustment circuit configured to receive a signal of the first channel, delay the signal by a discretely variable delay amount, and output a delayed signal; a channel coupling circuit configured to receive the signal output from the phase adjustment circuit and a signal of the second channel, and detect a phase difference between these two signals; and a controller configured to control the delay amount in the phase adjustment circuit based on a result detected by the channel coupling circuit. This interchannel skew adjustment circuit adjusts the interchannel signal skew only at a sender or a receiver, thereby reducing the circuit area and the power consumption.

Abstract: It is an object of the present invention to provide a ferrite carrier core material and a ferrite carrier for an electrophotographic developer, which have an excellent charging property, hardly cause carrier scattering due to cracking and chipping of the core material, and have a prolonged life, and methods for manufacturing these, and an electrophotographic developer using the ferrite carrier. For this object, the ferrite carrier core material and a ferrite carrier for an electrophotographic developer, wherein (1) the ferrite composition contains 0.5 to 2.5% by weight of Sr, and the presence amount of Sr—Fe oxides satisfies a specific conditional expression, (2) the distribution in the number of the shape factor SF-2 is in a specific range, (3) the BET specific surface area is 0.15 to 0.30 m2/g, (4) the average particle diameter D50 is 20 to 35 ?m, and (5) the magnetization is 50 to 65 Am2/kg.

Abstract: A crossflow fan includes a rotary impeller formed by curved blades 42. Each of the blades 42 has an outer peripheral edge 43 close to the centrifugal side of the impeller and an inner peripheral edge 44 close to the rotation axis side of the impeller. A plurality of cutouts 45 are formed in the outer peripheral edge 43 and spaced apart at predetermined intervals. Dimples 48 for changing a boundary layer from a laminar flow to a turbulent flow are formed in a negative pressure surface 4q of each blade 42 in the vicinity of the outer peripheral edge 43 to prevent the gas flowing around the blade 42 from separating from the blade 42.

Abstract: Employment of a carrier core material for an electrophotographic developer containing 0.8 to 5% by weight of Mg, 0.1 to 1.5% by weight of Ti, 60 to 70% by weight of Fe and 0.2 to 2.5% by weight of Sr and having an amount of Sr dissolved with a pH4 standard solution of 80 to 1000 ppm, a carrier using the core material and a process for producing them, and an electrophotographic developer using the carrier.

Abstract: In a signal electric potential conversion circuit, a capacitor has one end receiving an input signal CIN, and the other end connected to a termination node N1. A conversion circuit receives a potential IN of the termination node N1. A connection element is provided between a power supply VDDH and the termination node N1, and an impedance of the connection element is reduced when the potential IN is lower than a first potential. Another connection element is provided between the termination node N1 and a ground power supply, and an impedance of the connection element is reduced when the potential IN is higher than a second potential.

Abstract: A centrifugal fan has a circular main plate driven and rotated by a motor rotary shaft, a plurality of blades fixed to an outer circumferential portion of the main plate and spaced apart at predetermined intervals in a circumferential direction of the main plate, and a side plate attached to ends of the blades opposite to the main plate. An air inlet port is formed at the center of the side plate. The side plate inclines outward in centrifugal directions from the air inlet port and has an arcuate cross section with a predetermined radius of curvature. A dead water region reducing space is formed between the blades and the side plate. The dead water region reducing space forms a smooth flow between the two surfaces of each blade, bringing about desirable blade performance.

Abstract: A porous ferrite core material for an electrophotographic developer, the porous ferrite core material including Mg in a content of 0.3 to 3% by weight, Ti in a content of 0.4 to 3% by weight and Fe in a content of 60 to 70% by weight, and the porous ferrite core material having a pore volume of 0.04 to 0.16 ml/g, a peak pore size of 0.4 to 1.6 ?m, a saturation magnetization of 40 to 80 Am2/kg, a remanent magnetization of less than 7 Am2/kg and a coercive force of less than 43 A/m; a resin-filled ferrite carrier for an electrophotographic developer obtained by filling a resin in the voids of the porous ferrite core material; and an electrophotographic developer using the ferrite carrier.