Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.

Abstract: A driving assistance device includes: an imaging unit; a projection unit that projects an image based on image information from the imaging unit toward a projection surface; and an adjustment unit that is configured to form image information that an image sensor of the imaging unit acquires to be adjusted image information that is adjusted for the projection surface, wherein the adjustment unit includes an optical correction structure that causes the image sensor to acquire the adjusted image information by optical correction.

Abstract: A solid-state imaging device includes n first photoelectric conversion elements configured to photoelectrically convert incident light, n first reading circuits configured to output corresponding first pixel signals, m second photoelectric conversion elements configured to photoelectrically convert incident light, m second reading circuits configured to sequentially output corresponding second pixel signals, and a reading control circuit, wherein each of the second reading circuits includes a detection circuit configured to output an event signal when a change in a second charge signal is detected and a pixel signal generation circuit configured to add address information to an event signal, and the reading control circuit causes the first pixel signal to be output by determining a reading region corresponding to address information, and n and m are natural numbers greater than or equal to 2.

Abstract: A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.

Abstract: A solid-state imaging device includes a first semiconductor substrate to which light is incident; a second semiconductor substrate stacked to the first semiconductor substrate; n first photoelectric conversion devices periodically arranged in the first semiconductor substrate and generating first electric charge signals; n first reading circuits arranged in correspondence with the n first photoelectric conversion devices in the first semiconductor substrate, respectively, each of the n first reading circuits accumulating the first electric charge signal outputting a signal voltage corresponding to the accumulated first electric charge signal as a first pixel signal; a driving circuit sequentially outputting the first pixel signal; m second photoelectric conversion devices periodically arranged in one of the first/second semiconductor substrates and generating second electric charge signals; and m second reading circuits sequentially outputting a second pixel signal, wherein m and n are natural numbers equal t

Abstract: A solid-state imaging device includes a plurality of pixels in which photoelectric conversion units that generate signal charges are arranged in a matrix, a plurality of first charge accumulation circuits that hold the signal charges and output the signal charges as a first pixel signal, a plurality of charge transfer circuits that transfer the signal charges to the first charge accumulation circuit, and a plurality of second charge accumulation circuits that hold signal charges based on the signal charges generated by the photoelectric conversion units and output the signal charges as a second pixel signal in which the number of pixels is reduced to a predetermined number, and the charge transfer circuit transfers the signal charges in the same exposure period to the second charge accumulation circuit when transferring the signal charges of the same exposure to the first charge accumulation circuit.

Abstract: A solid-state imaging device includes a first semiconductor substrate including a pixel array unit, a second semiconductor substrate stacked on a surface of a side opposite to a side on which light is incident in the first semiconductor substrate and on which a pixel control circuit and a reading circuit are arranged, and a plurality of connection electrodes configured to electrically connect pixel control signal lines between the first semiconductor substrate and the second semiconductor substrate, wherein the connection electrodes electrically connect pixel control signal lines within a pixel immediate region which overlaps a region where the pixel array unit is arranged in the first semiconductor substrate, and the pixel control circuit is arranged along an edge of the pixels in either one of a row direction and a column direction arranged in the pixel array unit in the pixel immediate region.

Abstract: A solid-state imaging device includes n first photoelectric conversion elements configured to photoelectrically convert incident light, n first reading circuits configured to output corresponding first pixel signals, m second photoelectric conversion elements configured to photoelectrically convert incident light, m second reading circuits configured to sequentially output corresponding second pixel signals, and a reading control circuit, wherein each of the second reading circuits includes a detection circuit configured to output an event signal when a change in a second charge signal is detected and a pixel signal generation circuit configured to add address information to an event signal, and the reading control circuit causes the first pixel signal to be output by determining a reading region corresponding to address information, and n and m are natural numbers greater than or equal to 2.

Abstract: A solid-state imaging device includes a first semiconductor substrate to which light is incident; a second semiconductor substrate stacked to the first semiconductor substrate; n first photoelectric conversion devices periodically arranged in the first semiconductor substrate and generating first electric charge signals; n first reading circuits arranged in correspondence with the n first photoelectric conversion devices in the first semiconductor substrate, respectively, each of the n first reading circuits accumulating the first electric charge signal outputting a signal voltage corresponding to the accumulated first electric charge signal as a first pixel signal; a driving circuit sequentially outputting the first pixel signal; m second photoelectric conversion devices periodically arranged in one of the first/second semiconductor substrates and generating second electric charge signals; and m second reading circuits sequentially outputting a second pixel signal, wherein m and n are natural numbers equal t

Abstract: A solid-state image pickup device includes: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups corresponding to each of a plurality of predetermined rows; and a second substrate including a pixel load current source corresponding to a vertical signal line to which the plurality of pixels disposed in the same column within the groups are connected, a column circuit that performs a predetermined process on a pixel signal which is output from the pixel to a corresponding vertical signal line, and a pixel for correction that outputs a pixel signal for correction for correcting the corresponding column circuit to the vertical signal line to which the corresponding column circuit is connected, for each column of the pixels belonging to the group.

Abstract: A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.

Abstract: A solid-state imaging device includes a pixel signal processing unit including a plurality of pixels; a plurality of first charge storage circuits which are configured to hold the first signal charges generated by the photoelectric conversion units and output first signal voltages as first pixel signals; and a plurality of second charge storage circuits which are configured to hold second signal charges and output second signal voltages, and a differential analog/digital conversion unit includes: a plurality of first differential calculation units; a plurality of first analog/digital conversion units which are configured to perform analog/digital conversion to the first differential pixel signals and output digital values indicating magnitudes of the first differential pixel signals; and a plurality of second analog/digital conversion units which are configured to perform analog/digital conversion to the second pixel signal and output digital values indicating magnitudes of the second pixel signals.

Abstract: An occupant protection system includes: arm rests that are disposed on first and second width direction sides of a seat back and are rotatable between a substantially vertical storage position and a substantially horizontal use position; slide members that are slidable along the arm rests and have belt guides; a retractor that takes up webbing of a belt; and an electronic control unit that, (i) in a state before an occupant is seated in a vehicle seat, causes the arm rests to be held in the storage position and causes the slide members to slide in the seat upward direction above the head of the occupant, and that, (ii) when the occupant is seated, causes the arm rests to rotate to the use position, causes the slide members to slide toward base sides of the arm rests, and causes the webbing to be taken up by the retractor.

Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.

Abstract: Disclosed is a method for producing a plastisol acrylic polymer which can have a satisfactory adhesion property even when the heating time is short and the heating temperature is low, and which has excellent storage stability. The method comprises (1) a step of polymerizing an acrylic monomer mixture (a) to produce a polymer (A) and (2) a step of polymerizing an acrylic monomer mixture (b) in a dispersion containing the polymer (A), wherein a monomer having a hydroxy group is contained in the acrylic monomer mixture (a), a monomer having an acetoacetyl group or a block isocyanate group is contained in the acrylic monomer mixture (b), and the dissolution parameter (SA) for the polymer (A) and the dissolution parameter (SB) for a polymer (B) produced by the polymerization of the acrylic monomer mixture (b) are different from each other.

Abstract: An object is to provide glioma treatment and testing methods, and a method for delivering a desired substance to a glioma, all of which target a molecule specifically expressed in a glioma, as well as drugs and so forth used in these methods. It has been found out that targeting Eva1 or Ceacam1 enables glioma treatment and testing, and delivering of a desired substance to a glioma.

Abstract: A tow prepreg, made by impregnating a reinforcing fiber bundle with a matrix resin composition that comprises component (A): epoxy resin, component (B): epoxy resin curing agent, and component (C?): pre-gelatinizing agent with a minimum viscosity temperature of 110° C. or lower, wherein, the temperature of minimum viscosity is determined to be the temperature obtained at the minimum viscosity that appears on the highest temperature side when a sample is prepared by adding and dispersing homogeneously 10 parts by mass of the component (C?) to 100 parts by mass of bisphenol-A epoxy resin with an epoxy equivalent weight of 190±6 g/eq, and by dissolving 10 parts by mass of a boron trichloride-octylamine complex into the mixture, and when the viscosity of the sample is measured by increasing the temperature at a rate of 2° C./min.

Abstract: A groove extends in a vehicle longitudinal direction in a roof side garnish positioned on a terminal portion of a ceiling portion. As a result, a curved surface appears to be divided into a curved surface on a center side of the ceiling portion and a curved surface on a terminal portion side of the ceiling portion. Consequently, an illusion in which the ceiling portion appears as though it were divided into the center side and the terminal side of the ceiling portion. As a result, the cabin space appears spacious, so an occupant is able to feel less closed in.

Abstract: An occupant protection system includes: arm rests that are disposed on first and second width direction sides of a seat back and are rotatable between a substantially vertical storage position and a substantially horizontal use position; slide members that are slidable along the arm rests and have belt guides; a retractor that takes up webbing of a belt; and an electronic control unit that, (i) in a state before an occupant is seated in a vehicle seat, causes the arm rests to be held in the storage position and causes the slide members to slide in the seat upward direction above the head of the occupant, and that, (ii) when the occupant is seated, causes the arm rests to rotate to the use position, causes the slide members to slide toward base sides of the arm rests, and causes the webbing to be taken up by the retractor.

Abstract: A solid-state image pickup device includes: a first substrate which has a pixel part divided into a plurality of groups obtained by dividing a plurality of pixels arranged in a two-dimensional matrix into groups corresponding to each of a plurality of predetermined rows; and a second substrate including a pixel load current source corresponding to a vertical signal line to which the plurality of pixels disposed in the same column within the groups are connected, a column circuit that performs a predetermined process on a pixel signal which is output from the pixel to a corresponding vertical signal line, and a pixel for correction that outputs a pixel signal for correction for correcting the corresponding column circuit to the vertical signal line to which the corresponding column circuit is connected, for each column of the pixels belonging to the group.