Abstract: An information processing apparatus comprising at least one processor, wherein the at least one processor is configured to: acquire a plurality of pieces of element information related to an image; generate a plan which defines a description order of elements corresponding to the plurality of pieces of element information in a sentence in which the elements are described; and generate the sentence based on the plan.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; by referring to a storage unit that stores a parameter data set related to a transport condition for each substrate type, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined type of the substrate to process the substrate, and, after automatically determining the type of the substrate, and before transporting the substrate stored in the substrate storage container, performing mapping based on conditions set in the parameter data set to detect an abnormality of the substrate stored in the substrate storage container.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; by referring to a storage unit that stores a parameter data set related to a transport condition for each substrate type, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined type of the substrate to process the substrate, and, after automatically determining the type of the substrate, and before transporting the substrate stored in the substrate storage container, performing mapping based on conditions set in the parameter data set to detect an abnormality of the substrate stored in the substrate storage container.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A container material sealing and containing a latent heat storage material is arranged in a ceiling blow chamber box. Then, an air conditioning system of radiation type in which the metal panel is cooled or warmed by using as an auxiliary heat source the latent heat storage material having been cooled or warmed by heat storage achieved by cooling or warming the latent heat storage material with cool or warm air generated by a heat pump air-conditioner and then coolness or warmth is radiated from the metal panel into a room and an air conditioning system of convection type in which cool or warm air generated by the heat pump air-conditioner is blown into the room are provided and then the two air conditioning systems are used simultaneously or alternatively any one alone of the air conditioning systems is used so that air conditioning of the room is performed.

Abstract: An image input module adjusting device includes a board moving mechanism configured to movably hold a board in directions crossing each other; a board moving restriction mechanism configured to restrict movement of the board; an engaging member moving mechanism configured to move an engaging member engaged with a position adjusting component provided on the board; a control part configured to drive the engaging member moving mechanism while allowing the board moving restriction mechanism to move the board, to move and thereby the engaging member is engaged with the position adjusting component and the board is moved to an adjusting original position; a lens position adjusting mechanism configured to perform the position adjusting of the lens; and a focus adjusting mechanism configured to perform the focus adjusting of the lens relative to the image input sensor while the movement of the board is restricted.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: In a contactor contact piece members can be arranged at a fine pitch, and a contact can be made surely by a small contact pressure. The contact piece members electrically connect an electronic part to an external circuit. The contact piece member is formed of an electrically conductive material in a generally spherical shape. A molecular density of a central part of the contact piece member is lower than a molecular density of a part near a surface. The electrically conductive material may include at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.

Abstract: A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.

Abstract: A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath.

Abstract: An image input module adjusting device includes a board moving mechanism configured to movably hold a board in directions crossing each other; a board moving restriction mechanism configured to restrict movement of the board; an engaging member moving mechanism configured to move an engaging member engaged with a position adjusting component provided on the board; a control part configured to drive the engaging member moving mechanism while allowing the board moving restriction mechanism to move the board, to move and thereby the engaging member is engaged with the position adjusting component and the board is moved to an adjusting original position; a lens position adjusting mechanism configured to perform the position adjusting of the lens; and a focus adjusting mechanism configured to perform the focus adjusting of the lens relative to the image input sensor while the movement of the board is restricted.

Abstract: A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.

Abstract: An electrical connecting method has the step of bringing a contact member connected to an electric circuit into contact with a terminal of an electronic part. A desired processing is performed by feeding current to the terminal via the contact member. The contact member is then separated from the terminal. When the contact member is brought into contact with the terminal, energy is applied to the contact member or the terminal in order to locally soften a portion of the terminal contacting the contact member. Thereafter, the desired processing is performed, in the state that the contacting portion of the terminal with the contact member is softened so as to reduce the contact resistance and so as to increase the subsequent separatability of the contact member from the terminal.

Abstract: In a contactor contact piece members can be arranged at a fine pitch, and a contact can be made surely by a small contact pressure. The contact piece members electrically connect an electronic part to an external circuit. The contact piece member is formed of an electrically conductive material in a generally spherical shape. A molecular density of a central part of the contact piece member is lower than a molecular density of a part near a surface. The electrically conductive material may include at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.

Abstract: A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Abstract: A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Abstract: A toner supply roller comprises a metallic core shaft and an electrically conductive elastic layer formed to surround the outer surface of the shaft. The conductive elastic layer is formed of open-cell polyurethane foam. The polyurethane foam is impregnated with an electrically conductive polymer and a binder.