Abstract: A sync separation circuit separates a synchronizing signal from a video signal containing the synchronizing signal. A minimum level detecting section detects a minimum level of a video signal. A sync tip level detecting section detects a sync tip level in the video signal. A pedestal level detecting section detects a pedestal level in the video signal. Based on both the sync tip level detected by the sync tip level detecting section and the pedestal level control by the pedestal level detecting section, a slice level setting section sets a slice level corresponding to an intermediate value between the sync tip level and the pedestal level. The slice level control section sets the slice level based on the minimum level detected by the minimum level detecting section if the slice level set based on the sync tip level and the pedestal level is inappropriate.

Abstract: A contact sensor unit includes: a flexible substrate having a conductive pattern; a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

Abstract: An apparatus for heating an electronic component, the apparatus includes a table on which a printed board is placed, a heating head having a contact surface that comes into contact with the upper surface of a rectangular electronic component mounted on the upper surface of the printed board, a discharge portion that jets heated air; and a first passage that guides the air discharged from the discharge portion to the four vertexes of the electronic component.

Abstract: A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.

Abstract: A transformation matrix used for finding actual loads acting on a tire can be reliably calibrated. Using the calibrated transformation matrix, the translation and moment loads exerted on the tire can be calculated with a high degree of accuracy in a multi-component force measuring spindle unit including two multi-component force measuring sensors on locations spaced-apart from each other along the axis direction of a spindle shaft. The calibration method includes a step of measuring loads exerted on the spindle shaft, a calculation step using a measured load vector including the loads obtained in the measurement step and the transformation matrix applied to the measured load vector, to find an actual load vector including actual loads on the tire. Before the calculation step, a calibration step determines the measured load vector under a plurality of linearly independent test conditions and calibrates the transformation matrix based on the determined measured load vector.

Abstract: An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Abstract: A signal processing circuit includes an auto gain control circuit and amplifies a signal with an amplification ratio determined based on a synchronous signal level having a positive potential with respect to a black level included in a high definition television video signal. In consequence, during the processing of the high definition television video signal, the signal processing is performed with a desired amplification ratio.

Abstract: The present invention provides a master tire for inspecting the accuracy of a tire tester easily and securely. A master tire 100 according to the present invention is equipped with an upper-lower rim member 120, a cylindrical member 110 equivalent to the tread portion of a tire, and leaf spring 130 secured to the cylindrical member 110 and the rim member 120 with bolts 140 and bolts 142. A spindle 21 is secured to the rim member 120 so that the center axis thereof is not displaced. The rim member 120 is vertical to or slightly inclined with respect to the spindle 21. The cylindrical member 110 is made of a metallic material, such as iron or aluminum, or a hard plastic having stable characteristics.

Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Abstract: A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.

Abstract: A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.

Abstract: Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.

Abstract: A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.

Abstract: A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: The present invention provides a master tire for inspecting the accuracy of a tire tester easily and securely. A master tire 100 according to the present invention is equipped with an upper-lower rim member 120, a cylindrical member 110 equivalent to the tread portion of a tire, and leaf spring 130 secured to the cylindrical member 110 and the rim member 120 with bolts 140 and bolts 142. A spindle 21 is secured to the rim member 120 so that the center axis thereof is not displaced. The rim member 120 is vertical to or slightly inclined with respect to the spindle 21. The cylindrical member 110 is made of a metallic material, such as iron or aluminum, or a hard plastic having stable characteristics.

Abstract: The present invention aims to provide a poultry diet that can soften the flesh quality of poultry meat and improve the texture, a method of producing a large amount of meat with improved texture by using the diet, and a breeding method of poultry having flesh quality with good texture, and a flesh quality softening agent for poultry to be used by addition to feed. Astaxanthin is contained in a diet to give a poultry diet for improving texture. The present invention can improve texture by decreasing the shear force of poultry meat by breeding the poultry on the diet.

Abstract: An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).