Patents by Inventor Toru TOKIMATSU

Toru TOKIMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection apparatus and substrate transfer method
    Patent number: 11567416
    Abstract: An inspection apparatus includes: first and second stage parts on which a housing container housing substrates is mounted; first and second inspection parts having an imaging unit imaging the substrate; a first transfer region provided with a first transfer mechanism performing a first operation of transferring the substrate between the first stage part and the first inspection part; and a second transfer region provided with a second transfer mechanism performing a second operation of transferring the substrate between the second stage part and the second inspection part. In plan view, the first and second stage part are at positions not overlapping with each other, the first and second inspection part are at positions not overlapping with each other, and the first and second transfer region are at positions different from each other so as to perform the first and second operation in parallel.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: January 31, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Toru Tokimatsu, Takuya Tani, Takashi Murakami
  • INSPECTION APPARATUS AND SUBSTRATE TRANSFER METHOD
    Publication number: 20220011676
    Abstract: An inspection apparatus includes: first and second stage parts on which a housing container housing substrates is mounted; first and second inspection parts having an imaging unit imaging the substrate; a first transfer region provided with a first transfer mechanism performing a first operation of transferring the substrate between the first stage part and the first inspection part; and a second transfer region provided with a second transfer mechanism performing a second operation of transferring the substrate between the second stage part and the second inspection part. In plan view, the first and second stage part are at positions not overlapping with each other, the first and second inspection part are at positions not overlapping with each other, and the first and second transfer region are at positions different from each other so as to perform the first and second operation in parallel.
    Type: Application
    Filed: June 29, 2021
    Publication date: January 13, 2022
    Inventors: Toru TOKIMATSU, Takuya Tani, Takashi Murakami