Abstract: According to one embodiment, the semiconductor memory device includes a memory element, a reference resistance element, a read circuit, and a first circuit. The memory element is enabled to take a first resistance value and a second resistance value. The reference resistance element configured to have a resistance value between the first resistance value and the second resistance value. The read circuit is configured to determine data read from the memory element based on a current flowing through the memory element and a current flowing through the reference resistance element. The first circuit is configured to suppress the currents flowing through the memory element and the reference resistance element in response to determination of data read from the memory element.

Abstract: A determination circuit of one embodiment includes first and second inverter circuits, a first transistor which turns on when receiving an asserted first signal, and a first capacity component including a first end which receives an inversion signal of the first signal. The second inverter circuit includes an input coupled to an output of the first inverter circuit, and includes an output coupled to an input of the first inverter circuit. The first node is coupled to a first potential node, the first transistor is coupled between the second node and a second potential node having a lower potential than a potential of the first potential node, and a second end of the first capacity component is coupled to the second node.

Abstract: A semiconductor memory device according to an embodiment includes first and second storages that enable writing and reading of data. The first decoding line and the third decoding line are electrically connected to each other. The first bit line and the third bit line are electrically connected to each other.

Abstract: A semiconductor memory device according to an embodiment includes first and second storages that enable writing and reading of data. The first decoding line and the third decoding line are electrically connected to each other. The first bit line and the third bit line are electrically connected to each other.

Abstract: A semiconductor memory device according to an embodiment includes a memory cell array including memory cells each formed from a transistor formed over an active area of a well and disposed at intersections of a word line and a bit line group, the memory cell having different connection states including a state in which a source or a drain of the transistor is not electrically connected to any one of bit lines belonging to the bit line group and states in which the source or the drain is electrically connected only to a specific one of the bit lines, and an active area serving as a gate of the transistor being continuously formed in arrangement areas of the bit lines of the bit line group and spaces between the bit lines.

Abstract: A semiconductor memory device according to an embodiment includes a memory cell array including memory cells each formed from a transistor formed over an active area of a well and disposed at intersections of a word line and a bit line group, the memory cell having different connection states including a state in which a source or a drain of the transistor is not electrically connected to any one of bit lines belonging to the bit line group and states in which the source or the drain is electrically connected only to a specific one of the bit lines, and an active area serving as a gate of the transistor being continuously formed in arrangement areas of the bit lines of the bit line group and spaces between the bit lines.