Abstract: A production method for a semiconductor film according to the present invention includes: step (a) of forming a first film 103 supported by a substrate 101; step (b) of forming a second film 102 being supported by the substrate and having a lower thermal conductivity than that of the first film 103; step (c) of depositing a semiconductor film 104 in an amorphous state above the first film 103 and the second film 102; and step (d) of irradiating portions of the semiconductor film 104 that are located above the first film 103 and the second film 102 with an energy beam of the same intensity, thereby crystallize the portion of the semiconductor film 104 that is located above the second film 102 and leaving the portion of the semiconductor film 104 that is located above the first film 103 in the amorphous state.

Abstract: The present invention relates to a food packaging bag comprising a water-resistant perforated sheet part which composes of at least a part of an outer layer of the bag, a moisture permeable waterproof film which is laminated by bonding in part to an inside of the perforated sheet part as an inner layer to form a moisture permeable waterproof part, and a waterproof sheet part which composes of the rest of the outer layer part. Further, when, if desired, an absorbent sheet layer is provided on at least a part of the inside of the waterproof sheet part, the functions of the moisture permeable waterproof film such as moisture permeability are scarcely impaired when the packed food is heat-cooked, and the moisture permeable waterproof film weak in strength is seldom broken by scraping distribution or bursting during cooking with heat.

Abstract: vertical power MOSFET which comprises a semiconductive substrate of a first conductivity type serving as drain, an impurity region of a second conductivity type on a part of the surface of the semiconductive substrate, an impurity region of a first conductivity type formed on a part of the surface of the second conductivity type impurity region and serving as source, and a surface portion of a second conductivity type semiconductive substrate between source and drain serving as a channel portion with a gate electrode thereon through an insulating film, so that voltage is applied to the gate electrode to control channel current between source and drain, wherein the first conductivity type semiconductive substrate comprises a low resistivity layer and a high resistivity layer epitaxially formed on the low resistivity layer, and at an interface between the low resistivity layer and the high resistivity layer is provided a convexed portion which projects at least to the high resistivity layer side.

Abstract: A semiconductor device is disclosed which comprises a normally-off first MOSFET, a normally-off second MOSFET connected between the gate and source of the first MOSFET, a diode connected between the gate and source of the second MOSFET, a resistor and an optoelectric transducer array, both of which are connected in parallel with each other between the gate and drain of the second MOSFET, wherein all of the components are formed on a single semiconductor chip.

Abstract: An optically driven semiconductor device is disclosed which comprises a semiconductor substrate, a plurality of vertical field effect transistors formed on the substrate, and a plurality of optoelectric transducers formed on an insulating film above the respective transistors, wherein the transistors have the substrate in common as a drain. Also disclosed is an optically driven semiconductor device which comprises a semiconductor substrate, a vertical field effect transistor formed on the substrate and a solar cell formed on an insulating film above the substrate, wherein the solar cell is formed with a polycrystalline silicon layer or monocrystalline silicon layer grown by the chemical vapor deposition method. Moreover, there are disclosed optically coupled semiconductor relay devices using these optically driven semiconductor devices.

Abstract: A semiconductor device is disclosed which comprises a normally-off first MOSFET, a normally-off second MOSFET connected between the gate and source of the first MOSFET, a diode connected between the gate and source of the second MOSFET, a resistor and an optoelectric transducer array, both of which are connected in parallel with each other between the gate and drain of the second MOSFET, wherein all of the components are formed on a single semiconductor chip.

Abstract: Improvements in a method for performing a monocrystallizing operation through the application of energy beams upon a non-monocrystalline thin-film of non-crystalline or polycrystalline material formed on a non-crystalline insulating film. The resulting superior monocrystalline thin-film has a crystal direction coinciding with that of the monocrystalline silicon base-plate and is formed on the insulating film even if the insulating film is as thick as 4 .mu.m. The thin-film is sufficiently covered between the active layers of a three-dimensional circuit element on the monocrystalline silicon base plate.