Patents by Inventor Toshiaki Ozasa

Toshiaki Ozasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic electronic component and method of producing the same
    Publication number: 20010002505
    Abstract: The present invention provides an electronic component provided with the terminal electrode having a three layer structure comprising a first layer, a second layer and a third layer successively formed on each end face of the main electronic component, the second layer being a porous structure to advantageously absorb the stress caused by expansion and shrinkage of the wiring board, thereby preventing the main electronic component from suffering the stress, and the non-porous first layer maintaining good electrical continuity with the inner electrode while the non-porous third layer serving for preventing permeation of the solder liquid along with maintaining good electrical continuity to the outside, thereby preventing the ceramic component from being mechanically damaged due to expansion and shrinkage applied from the wiring board when the ceramic electronic component is packaged on the wiring board.
    Type: Application
    Filed: December 11, 2000
    Publication date: June 7, 2001
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Toshiaki Ozasa
  • Ceramic electronic component having terminal electrode that includes a second porous layer
    Patent number: 6219220
    Abstract: The present invention provides an electronic component provided with the terminal electrode having a three layer structure comprising a first layer, a second layer and a third layer successively formed on each end face of the main electronic component, the second layer being a porous structure to advantageously absorb the stress caused by expansion and shrinkage of the wiring board, thereby preventing the main electronic component from suffering the stress, and the non-porous first layer maintaining good electrical continuity with the inner electrode while the non-porous third layer serving for preventing permeation of the solder liquid along with maintaining good electrical continuity to the outside, thereby preventing the ceramic component from being mechanically damaged due to expansion and shrinkage applied from the wiring board when the ceramic electronic component is packaged on the wiring board.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: April 17, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Toshiaki Ozasa