Abstract: A circuit for EMC 1 in a power input circuit includes at least two wirings of a high-potential-side wiring 2 and a low-potential-side wiring 3 having different potentials and formed on a circuit board, a cutoff part 6 having one end connected to the high-potential-side wiring 2, a capacitor 10 connected between the other end of the cutoff part 6 and the low-potential-side wiring 3, a cutoff part 7 having one end connected to the high-potential-side wiring 2, a capacitor 20 connected between the other end of the cutoff part 7 and the low-potential-side wiring 3, and a capacitor 30 connected between a connection part 4 where the cutoff part 6 and the capacitor 10 are connected and a connection part 5 where the cutoff part 7 and the capacitor 20 are connected. This can reduce the number of capacitors while preventing a decrease in the capacitance.

Abstract: Leakage of radio-frequency radiation noise radiated from a noise source to the outside is suppressed. An electronic control device 1 includes a printed board 101 having signal grounds 104a, 104b, and 104c, and a frame ground 103a, a housing 100 accommodating the printed board 101, and a connector 105 mounted on the printed board 101. The electronic control device 1 includes a first coupling portion 301 that AC-couples the signal ground 104a with the frame ground 103a and a second coupling portion 301 that electrically couples the frame ground 103a with the housing 100, and the first coupling portion 301 and the second coupling portion 301 are provided between the connector 105 and an electronic circuit 110 on the printed board 101.

Abstract: An electronic control device comprising: a housing having conductivity; a circuit board that is arranged in the housing and has a first electronic component mounted on a mounting surface; an external connection portion that is electrically connected to the circuit board and is connectable to a device outside the housing; and a duplexing member that has conductivity and is arranged between an inner surface of the housing and the mounting surface of the circuit board, in which the duplexing member forms a cutout portion to avoid contact between the duplexing member and the first electronic component, and further forms a partition portion that partitions the external connection portion between the housing and the circuit board.

Abstract: A work determination system includes: a biological signal obtaining unit obtaining a biological signal of a worker from a sensor attached to the worker during work; a feature extraction computation unit computing a feature extraction of the obtained biological signal of the worker; a work determination unit determining a work of the worker on the basis of a comparison result between the computed feature extraction of the biological signal of the worker and learning data generated in advance; and a learning unit generating the learning data, wherein the learning unit generates a musculoskeletal model corresponding to each worker, generates a quasi biological signal by reproducing a work of a determination target with the musculoskeletal model, computes a feature extraction of the quasi biological signal, and generates the learning data by associating, with each worker, the work of the determination target and a feature extraction distribution of the quasi biological signal.

Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.

Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.

Abstract: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.

Abstract: An optical module achieving optical coupling at a low cost and by a simple and convenient process is intended to be provided. For attaining the purpose, a transparent member sealing an optical device and an optical transmission channel are connected as an optical coupling structure. Specifically, optical coupling is achieved in an optical module having an optical device, a first substrate having the optical device mounted thereon, and a second substrate or a transparent resin provided over the first substrate so as to hermetically seal the optical device by connecting an optical transmission channel over the second substrate or the transparent resin at a portion in which light from the optical device is transmitted.

Abstract: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.

Abstract: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.

Abstract: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.

Abstract: A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.

Abstract: A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.

Abstract: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.

Abstract: An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion.

Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

Abstract: In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” ?m, a thickness of the ceramic substrate is set to “b” ?m, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” ?m, a relationship of a?269×c/b+151 is established.

Abstract: There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.

Abstract: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.

Abstract: The present invention provides a semiconductor radioactive ray detector having the excellent energy resolution or time precision, a radioactive detection module, and a nuclear medicine diagnosis apparatus. The semiconductor radioactive ray detector has a structure in which plate-like elements made of cadmium telluride and conductive members are alternately laminated and the plate-like element made of cadmium telluride and the conductive member are adhered to each other with a conductive adhesive agent, and the Young's modulus of the conductive adhesive agent is in the range from 350 MPa to 1000 MPa, while the conductive members are made from a material with the linear expansion coefficient of the conductive members in the range from 5×10?6/° C. to 7×10?6/° C.