Abstract: A substrate for mounting a light-emitting element includes a base and a dam part. The base includes a front surface and a back surface that are principal surfaces thereof where the front surface includes a mounting part that is capable of mounting a light-emitting element thereon. The dam part is arranged on a peripheral part of the front surface to surround the mounting part. The front surface is inclined relative to the back surface at a predetermined angle. The dam part is provided with an opening part at a site where the front surface is inclined to decrease a thickness of the base, in the peripheral part of the front surface. A site of the dam part where the opening part is provided is inclined relative to the back surface in a direction of the front surface.

Abstract: A substrate for mounting an electronic component according to an aspect of an embodiment includes a base that is a plate-shaped body, where a first surface of the base is sloped relative to a second surface that is opposed to the first surface, and when the base is bisected into a lower part and a higher part in a slope direction thereof, a thermal conductivity of the lower part is higher than a thermal conductivity of the higher part.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.

Abstract: A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

Abstract: A light source device includes a plurality of light emitting unit portions including a light emitting element, a flashing circuit configured to cause the light emitting element to flash, and a delay circuit configured to control a timing at which the flashing circuit causes the light emitting element to flash. The delay circuit includes a resistor and a capacitor. At least two light emitting unit portions are connected to each other in parallel. At least one of a resistance value of the resistor and a capacitance value of the capacitor differs among the at least two light emitting unit portions connected to each other in parallel.

Abstract: A light-emitting-element housing member includes: a bottom base material having a first surface, and a mounting part on the first surface on which a light emitting element is to be mounted; and a frame member that includes side walls erected on the first surface to surround the mounting part, and an opening that penetrates through one of the side walls. The opening includes an inner edge having a first side and a second side, the first side extends along the first surface and is arranged at a position close to the bottom base material, and the second side extends along the first surface and is arranged at a position far from the bottom base material, and the second side is longer than the first side. An array of the plurality of light-emitting-element housing members, and a light emitting device are also described.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: A lighting device for a vehicle includes a lighting device body that has a light source part and a housing body that supports the light source part, and a ventilation part-adjacent to the lighting device body and through which outside wind passes. The light source part has a light source element part that emits light and a heat release member that releases heat that is generated in the light source element part. The light source element part is inside of the housing body and the heat release member is exposed inside of the ventilation part.

Abstract: A wiring board includes: a base material including, on one side of the base material, a protruding part that protrudes toward an outside, wherein the protruding part has a shape in which a center portion of a principal surface rises from the outer periphery, and a plurality of external connection terminals is arranged on the principal surface. A composite substrate includes: the above-mentioned wiring board and a metallic frame member, wherein the frame member includes an opening whose shape is corresponding to a shape in a plan view of the protruding part, and the frame member is arranged such that the opening surrounds the protruding part to fill a periphery of the protruding part. An electric device includes: an electric element on a right face of the wiring board.

Abstract: A substrate for mounting a light-emitting element includes a base and a dam part. The base includes a front surface and a back surface that are principal surfaces thereof where the front surface includes a mounting part that is capable of mounting a light-emitting element thereon. The dam part is arranged on a peripheral part of the front surface to surround the mounting part. The front surface is inclined relative to the back surface at a predetermined angle. The dam part is provided with an opening part at a site where the front surface is inclined to decrease a thickness of the base, in the peripheral part of the front surface. A site of the dam part where the opening part is provided is inclined relative to the back surface in a direction of the front surface.

Abstract: A substrate for mounting an electronic component according to an aspect of an embodiment includes a base that is a plate-shaped body, where a first surface of the base is sloped relative to a second surface that is opposed to the first surface, and when the base is bisected into a lower part and a higher part in a slope direction thereof, a thermal conductivity of the lower part is higher than a thermal conductivity of the higher part.

Abstract: A light-emitting-element housing member includes: a bottom base material having a first surface, and a mounting part on the first surface on which a light emitting element is to be mounted; and a frame member that includes side walls erected on the first surface to surround the mounting part, and an opening that penetrates through one of the side walls. The opening includes an inner edge having a first side and a second side, the first side extends along the first surface and is arranged at a position close to the bottom base material, and the second side extends along the first surface and is arranged at a position far from the bottom base material, and the second side is longer than the first side. An array of the plurality of light-emitting-element housing members, and a light emitting device are also described.

Abstract: An electrical element mounting package includes a plate-like substrate and at least one base that protrudes from a front surface of the substrate and has a mounting surface on which an electrical element is mounted, wherein the substrate and the base are made of ceramics integrally. The electrical element mounting package includes an element terminal that is provided on the mounting surface of the base, a side conductor that is provided on a side surface of the base and extends in a thickness direction of the base, and a substrate-side via conductor that is provided inside the substrate and extends in a thickness direction of the substrate, wherein the element terminal, the side conductor, and the substrate-side via conductor are connected to one another.

Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10?6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.

Abstract: A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400° C. of not larger than 5×10−6/° C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.