Abstract: The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).

Abstract: An IC card mechanism includes an IC card for insertion into a receiving space of an electronic device; a contact which is brought into contact with an external contact of the card when the card is inserted; a card pusher which is advanced, when the card is inserted, in an insertion direction of the card by being pushed by a front end face of the card, thereby accumulating resilient ejecting force; and a lock for locking, when the card is inserted, the card pusher in an advanced position and unlocking, when the card is pushed again in the direction of insertion of the card, the card pusher so that the card pusher is retracted by the resilient force and such that the card pusher, when retracting, pushes the front face of the card in a direction opposite to the insertion direction of the card, thereby allowing ejection of the card.