Abstract: An aggregation station: receives, from each of the base stations, communication path information with each of accommodated user terminals, for each user terminal; in a case where it is determined that the two of the base stations and the two user terminals are arranged on the straight line, generates first information for performing setting such that a transmission beam of any one of the base stations arranged on the straight line is stopped and another of the base stations non-orthogonally superimposes and multiplexes pieces of transmission data for the two respective user terminals with a predetermined power difference or power ratio; and controls the transmission beam of each of the two of the base stations arranged on the straight line on the basis of the first information.

Abstract: A movable body includes an imaging system which acquires an image formed by a terahertz wave, wherein the image is an image obtained by capturing an inspection object inside the movable body.

Abstract: A processing system comprising a first imaging system configured to capture a first image based on a terahertz wave from an inspection target, a second imaging system configured to capture a second image of the inspection target based on an electromagnetic wave of a wavelength different from the terahertz wave, and a processor configured to process the first image and the second image, wherein the processor detects an inspection region based on the second image and processes information of a region of the first image corresponding to the inspection region.

Abstract: An oscillator oscillating a tera hertz wave includes a negative resistive element including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, with a first conductor, a second conductor, and a dielectric disposed between the first conductor and the second conductor constitutes a resonator, wherein the negative resistive element is disposed between the first conductor and the second conductor, and a layer with a higher resistivity than the first semiconductor layer or the second semiconductor layer, or an amorphous layer is disposed between the negative resistive element and the dielectric.

Abstract: An oscillator oscillating a tern hertz wave includes a negative resistive element including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, with a first conductor, a second conductor, and a dielectric disposed between the first conductor and the second conductor constitutes a resonator, wherein the negative resistive element is disposed between the first conductor and the second conductor, and a layer with a higher resistivity than the first semiconductor layer or the second semiconductor layer, or an amorphous layer is disposed between the negative resistive element and the dielectric.

Abstract: A semiconductor apparatus comprising: an element substrate including a plurality of semiconductor devices which detect or oscillate terahertz waves; and an electromagnetic shielding in a mesh form disposed in front of a surface detecting or oscillating the terahertz waves in the element substrate and formed of a conductive material, wherein a line width of the electromagnetic shielding is not more than a wavelength of the terahertz waves.

Abstract: A movable body includes an imaging system which acquires an image formed by a terahertz wave, wherein the image is an image obtained by capturing an inspection object inside the movable body.

Abstract: A camera system is provided. The camera system is arranged to form a part of a monitoring system arranged in a place of a facility where an inspection object lines up. The camera system comprises an imaging system configured to acquire an image formed by a terahertz wave reflected by the inspection object.

Abstract: A processing system comprising a first imaging system configured to capture a first image based on a terahertz wave from an inspection target, a second imaging system configured to capture a second image of the inspection target based on an electromagnetic wave of a wavelength different from the terahertz wave, and a processor configured to process the first image and the second image, wherein the processor detects an inspection region based on the second image and processes information of a region of the first image corresponding to the inspection region.

Abstract: A semiconductor apparatus comprising: an element substrate including a plurality of semiconductor devices which detect or oscillate terahertz waves; and an electromagnetic shielding in a mesh form disposed in front of a surface detecting or oscillating the terahertz waves in the element substrate and formed of a conductive material, wherein a line width of the electromagnetic shielding is not more than a wavelength of the terahertz waves.

Abstract: A probe array in which probes are arranged on a cup-shaped acoustic wave detector at high density. In the probe array, transducers (acoustic wave conversion elements) configured to be capable of conversion between acoustic waves and an electrical signal are provided on a support member (housing).

Abstract: Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member.

Abstract: A liquid ejection head includes a plurality of piezoelectric transducers that are configured to generate energy for respectively ejecting liquid from a plurality of ejection ports and arranged in line so as to constitute a plurality of columns and a common electrode connected to the plurality of piezoelectric transducers. The common electrode is provided with a plurality of first connection areas to which the plurality of piezoelectric transducers are connected commonly in units of columns and a second connection area that connects the plurality of first connection areas to one another. This liquid ejection head further includes a reinforcing wiring laminated on the second connection area and a wiring substrate including a drive wiring that is connected to the reinforcing wiring at at least one connection point and electrically connected to the common electrode via the connection point.

Abstract: Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member.

Abstract: Provided is an element substrate including an orifice for ejecting liquid, a diaphragm for causing the liquid to be ejected through the orifice, a piezoelectric element for deforming the diaphragm, a pressure chamber for applying a pressure due to deformation of the diaphragm to the liquid, and a flow reducing portion communicating with the pressure chamber and having a width that is smaller than that of the pressure chamber. A connecting portion is formed for communication between the pressure chamber and the flow reducing portion. The connecting portion and the pressure chamber communicate with each other without level difference in the width direction, and the connecting portion has a depth that is smaller than a depth of the pressure chamber.

Abstract: A liquid ejection head includes a plurality of piezoelectric transducers that are configured to generate energy for respectively ejecting liquid from a plurality of ejection ports and arranged in line so as to constitute a plurality of columns and a common electrode connected to the plurality of piezoelectric transducers. The common electrode is provided with a plurality of first connection areas to which the plurality of piezoelectric transducers are connected commonly in units of columns and a second connection area that connects the plurality of first connection areas to one another. This liquid ejection head further includes a reinforcing wiring laminated on the second connection area and a wiring substrate including a drive wiring that is connected to the reinforcing wiring at at least one connection point and electrically connected to the common electrode via the connection point.

Abstract: To provide an antistatic film that requires low power consumption and provides satisfactory electric contact, as a measure for preventing an insulating substrate surface having an electronic device formed thereon from being charged. The electronic device includes: an insulating substrate; a conductor; and a resistance film connected with the conductor, the conductor and the resistance film being formed on the insulating substrate, characterized in that the resistance film has a larger thickness in a connection region with the conductor than a thickness in portions other than the connection region.

Abstract: To provide an antistatic film that requires low power consumption and provides satisfactory electric contact, as a measure for preventing an insulating substrate surface having an electronic device formed thereon from being charged. The electronic device includes: an insulating substrate; a conductor; and a resistance film connected with the conductor, the conductor and the resistance film being formed on the insulating substrate, characterized in that the resistance film has a larger thickness in a connection region with the conductor than a thickness in portions other than the connection region.

Abstract: To provide an antistatic film that requires low power consumption and provides satisfactory electric contact, as a measure for preventing an insulating substrate surface having an electronic device formed thereon from being charged. The electronic device includes: an insulating substrate; a conductor; and a resistance film connected with the conductor, the conductor and the resistance film being formed on the insulating substrate, characterized in that the resistance film has a larger thickness in a connection region with the conductor than a thickness in portions other than the connection region.

Abstract: A method of manufacturing an electronic device including a step of giving a droplet 12 of a liquid containing a formation material of a member that constitutes the electronic device to a plurality of portions on a substrate 1 while said substrate 1 and a droplet ejecting portion 7 are moved relatively in an in-surface direction of said substrate 1, wherein the droplet 12 is given while a position on a droplet given surface to which the droplet is given is corrected in accordance with the distribution of distances between the ejecting portion 7 and the droplet 12 given surface on the substrate which occurs when the substrate 1 and the ejecting portion 7 are relatively moved. Thereby forming the member constituting the electronic device accurately at the plural portion on the substrate 1, and thus forming plural electronic device of same charactoristics.