Abstract: A solar cell module includes: a plurality of photovoltaic cells including a layered body in which a first electrode layer, a power generation layer, and a second electrode layer are layered in series, the photovoltaic cells being electrically connected with each other in series; a scribe line separating the photovoltaic cells that are adjacent to each other in the photovoltaic cells; a scribe hole that is formed so as to penetrate through the power generation layer and the second electrode layer; and a bypass pathway that is formed of a shunt region, the shunt region being generated at a periphery of the scribe hole.

Abstract: A method for cleaning a photovoltaic module, the photovoltaic module having a first electrode layer formed on an insulating substrate, a photovoltaic layer, and a second electrode layer. The laminate is electrically divided between a power generating region and peripheral regions by means of grooves. The power generating region is divided into a plurality of photovoltaic cells by means of laser-scribed grooves. At least some of the photovoltaic cells are connected electrically in series with one another. The cleaning method includes a process for transporting the photovoltaic module immersed in a cleaning fluid, while being kept in a horizontal position with the laminate upward as it is transported, and applying ultrasonic vibration to the cleaning fluid, thereby removing particles in the scribed grooves.

Abstract: An apparatus for manufacturing a semiconductor device by forming a thin film on a substrate, comprises a cleaning process section for cleaning the substrate using a cleaning solution and a drying process section for jetting compressed gas onto the cleaned substrate, thereby removing the cleaning solution on the substrate, wherein the cleaning process section includes a nozzle body for jetting the cleaning solution onto the substrate under high pressure.

Abstract: A plurality of solder bumps are arranged in a row at regular pitch in a lead wire soldering region of a solar battery. A soldering apparatus for soldering a lead wire to the lead wire soldering region via the solder bumps comprises a lead wire feeding section for feeding out the lead wire. An end of the lead wire in the lead wire feeding section is chucked and the lead wire is laid over all length of the row of solder bumps. The soldering apparatus further comprises a soldering unit for soldering the lead wire onto the solder bump. The soldering unit has a lead wire holding member for holding the lead wire on a solder bump and a soldering iron. The soldering apparatus repeats an operation for welding the lead wire to the solder bump by means of the soldering iron, while the lead wire is held by the lead wire holding member.