Patents by Inventor Toshihiko Akahori
Toshihiko Akahori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7338751Abstract: An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process.Type: GrantFiled: March 29, 2002Date of Patent: March 4, 2008Assignee: Hitachi Chemical Co., Ltd.Inventors: Toshihiko Akahori, Ken Sawabe, Michiko Natori, Tomoaki Aoki, Takuya Kajiwara
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Patent number: 7163644Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: GrantFiled: November 18, 2004Date of Patent: January 16, 2007Assignee: Hitachi Chemical Company, Ltd.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20060197054Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: ApplicationFiled: April 20, 2006Publication date: September 7, 2006Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20060186372Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: ApplicationFiled: April 20, 2006Publication date: August 24, 2006Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20050269295Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: ApplicationFiled: July 11, 2005Publication date: December 8, 2005Applicant: Hitachi Chemical Company Ltd.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20050118820Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: ApplicationFiled: November 18, 2004Publication date: June 2, 2005Applicant: Hitachi Chemical Company Ltd.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Patent number: 6783434Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: GrantFiled: June 19, 2001Date of Patent: August 31, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20040147206Abstract: A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.Type: ApplicationFiled: January 20, 2004Publication date: July 29, 2004Applicant: Hitachi Chemical Company Ltd.Inventors: Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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Publication number: 20040086801Abstract: An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process.Type: ApplicationFiled: September 29, 2003Publication date: May 6, 2004Inventors: Toshihiko Akahori, Ken Sawabe, Michiko Natori, Tomoaki Aoki, Takuya Kajiwara
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Patent number: 6060215Abstract: A photosensitive resin composition comprising (A) a resin having an amide bond, an oxyalkylene group and a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group and (C) a photopolymerization initiator has an alkali developability, good sensitivity and photocurability, an efficient pattern formability by photolithography, a good application workability to a film and is capable of producing cured products having good folding endurance, solder reflow heat resistance, solvent resistance, bondability and nonflammability and suitable for producing a photosensitive element, a photosensitive laminate and a flexible printed circuit board.Type: GrantFiled: March 27, 1998Date of Patent: May 9, 2000Assignee: Hitachi, Ltd.Inventors: Jin Amanokura, Fumihiko Ota, Ritsuko Obata, Toshihiko Akahori, Kenji Suzuki, Hiroshi Nishizawa, Katsunori Tsuchiya, Takao Hirayama, Hiroaki Hirakura
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Patent number: 5827626Abstract: A color filter having excellent optical properties can be produced in high yield using a photo-sensitive composition comprising (a) a resin, (b) one or more pigments, (c) one or more monomers, and (d) a photoinitiator to form a film on a substrate, followed by exposure to light and development using a specific developer containing ##STR1## wherein R.sup.1 is C.sub.1-19 alkyl; and R.sup.2 is C.sub.1-19 alkylene.Type: GrantFiled: March 8, 1996Date of Patent: October 27, 1998Assignee: Hitachi Chemical Co., Ltd.Inventors: Yuji Kobayashi, Shigeo Tachiki, Toshihiko Akahori, Syoichi Sasaki, Kouji Yamazaki, Yoichi Kimura
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Patent number: 5821016Abstract: In a colored image forming material comprising (a) a copolymer containing a carboxyl group, (b) a coloring agent, (c) a monomer containing at least one photopolymerizable unsaturated bond in the molecule, (d) a photoinitiator and, when required, (e) a specific sensitizer, the dispersion stability of pigment and the optical sensitivity can be considerably increased by using a specific copolymer of styrene derivative-maleic acid derivative as component (a) and specific benzoimidazole or benzothiazole as component (e), and a photosensitive element or a color filter with distinguished optical characteristics can be obtained therefrom.Type: GrantFiled: June 28, 1996Date of Patent: October 13, 1998Assignee: Hitachi Chemical Company, Ltd.Inventors: Tsutomu Satoh, Shigeo Tachiki, Yuji Kobayashi, Toshihiko Akahori, Syoichi Sasaki, Kouji Yamazaki, Yoichi Kimura
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Patent number: 5403698Abstract: A negative type photosensitive electrodepositing resin composition comprising (a) a polymer obtained by neutralizing a copolymer of acrylic or methacrylic acid and having an acid number of 20 to 300 with a basic organic compound, (b) a non-water-soluble monomer having two or more photopolymerizable unsaturated bonds in the molecule, (c) a non-water-soluble photoinitiator, and (d) a benzotriazole derivative having one or more carboxyl groups, is effective for giving electrodeposited films with a low voltage or low electric current in a short time, and usable for forming resist patterns with high degree of resolution.Type: GrantFiled: October 11, 1991Date of Patent: April 4, 1995Assignees: Hitachi Chemical Company, Ltd., Dai Nippon Toryo Co., Ltd.Inventors: Sigeo Tachiki, Masahiko Hiro, Toshihiko Akahori, Takuro Kato, Hajime Kakumaru, Yoshitaka Minami, Yuhji Yamazaki, Toshiya Takahashi, Toshihiko Shiotani, Yoshihisa Nagashima
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Patent number: 5279923Abstract: A photosensitive resin composition comprising (a) a compound having a group unstable to acids, (b) a compound generating an acid when exposed to actinic light, and (c) a benzotriazole derivative is suitable for forming a positive type photosensitive anionic electrodeposition coating material and is usable for producing printed circuit boards.Type: GrantFiled: November 27, 1992Date of Patent: January 18, 1994Assignee: Hitachi Chemical Company, Ltd.Inventors: Masahiko Hiro, Toshihiko Akahori, Shigeo Tachiki
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Patent number: 5230984Abstract: A resin composition comprising (A) a copolymer obtained by copolymerizing (a) acrylic acid and/or methacrylic acid, (b) at least one compound having an unstable group against an acid such as t-amyl acrylate, t-amyl methacrylate, etc. and (c) a copolymerizable monomer such as n-butyl acrylate and (B) a photoacid generator is effective for providing an electro-deposition bath good in water dispersion stability and an electrodeposited film having high sensitivity and high resolution.Type: GrantFiled: November 29, 1991Date of Patent: July 27, 1993Assignee: Hitachi Chemical Company, Ltd.Inventors: Shigeo Tachiki, Masahiko Hiro, Toshihiko Akahori, Takuro Kato