Patents by Inventor Toshihiko Asada

Toshihiko Asada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire-saw and method for manufacturing the same
    Patent number: 6526960
    Abstract: A wire-saw constituted by a rope-like core wire and a cylindrical coil-like saw-wire body wounded around the core wire, and a large number of abrasive grains firmly fixed to the saw-wire body by metal. Problems of conventional wire-saws, such as unstable working performance, a short tool life, low safety and low reliability, and so on, are solved.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: March 4, 2003
    Assignee: Asaoka Co., Ltd.
    Inventors: Toshihiko Asada, Tadao Ishikawa
  • Wire-saw and method for manufacturing the same
    Publication number: 20010035173
    Abstract: A wire-saw constituted by a rope-like core wire and a cylindrical coil-like saw-wire body wounded around the core wire, and a large number of abrasive grains firmly fixed to the saw-wire body by metal. Problems of conventional wire-saws, such as unstable working performance, a short tool life, low safety and low reliability, and so on, are solved.
    Type: Application
    Filed: February 13, 2001
    Publication date: November 1, 2001
    Inventors: Toshihiko Asada, Tadao Ishikawa
  • Method and apparatus for pulverizing scrapped fiber reinforced thermosetting plastic materials
    Patent number: 5449123
    Abstract: A method and apparatus for pulverizing into fine powder in one step scrapped difficult to crush plastics of fiber reinforced thermosetting plastics by using a rotating diamond wheel having diamond grits of rough grain size of more than 270 mesh on the outer surface, a pushing unit to press plastic materials against the diamond wheel above and a powder collector.
    Type: Grant
    Filed: October 7, 1993
    Date of Patent: September 12, 1995
    Assignees: Asaoka Co., Ltd., Asahi Diamond Industrial Co., Ltd.
    Inventors: Tomitaka Mase, Toshihiko Asada
  • Sound wave attenuation device
    Patent number: 4540063
    Abstract: A sound attenuation device is disclosed which is capable of simultaneously attenuating sound waves of both high and low frequencies bands while leaving other frequencies undisturbed. The device is comprised of an outer shell having inlet and outlet apertures at its opposite ends and containing a pair of sound absorbing plates having a pair of thin sheets of a fabric of substantial air permeability and elasticity disposed therebetween and forming an air chamber between the sheets.
    Type: Grant
    Filed: July 27, 1984
    Date of Patent: September 10, 1985
    Assignee: Park Trading Co., Ltd.
    Inventors: Akira Ochi, Toshihiko Asada