Patents by Inventor Toshihiko Fujii
Toshihiko Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240119525Abstract: An information providing server according to the present invention outputs a screen on which referenced customer buy/sell pattern time-series data (4-2) indicating, in a time-series manner, a buy/sell pattern, computed for each stock, of a plurality of referenced customers satisfying a reference standard, based on past investment product transaction data of the plurality of referenced customers, and a price chart (4-1) indicating a time-series change in price of an investment product are displayed side by side.Type: ApplicationFiled: November 9, 2021Publication date: April 11, 2024Applicant: NEC CorporationInventor: Toshihiko Fujii
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Publication number: 20240078699Abstract: An image processing apparatus (10) according to the present invention includes: a user area determination unit (11) that determines, from an image to be processed, a user area being an area where a user of an operation terminal is present; and a user switching detection unit (12) that detects, based on an image of the user area, that the user of the operation terminal is switched.Type: ApplicationFiled: December 15, 2021Publication date: March 7, 2024Applicant: NEC CorporationInventor: Toshihiko Fujii
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Publication number: 20230187818Abstract: A device for a vehicle comprising: a base; a case that forms an accommodation area for accommodating an electronic device, together with the base; and a base pad attached to the base and having an opening portion, wherein the base has a vent for ventilation between the accommodation area and the opening portion.Type: ApplicationFiled: May 12, 2021Publication date: June 15, 2023Applicant: YOKOWO CO., LTD.Inventors: Shota KONDO, Toshihiko FUJII
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Patent number: 11417947Abstract: An antenna device for a vehicle includes a camera that facilitates assembly. The antenna device for a vehicle includes: an antenna case that has a housing space formed therein; an antenna base that is covered with the antenna case from above to form the housing space; an antenna element that is held by the antenna base and housed in the housing space; and a camera that is housed in the housing space The antenna base has a wall portion extending upward. The camera is fixed to the wall portion.Type: GrantFiled: April 11, 2019Date of Patent: August 16, 2022Assignee: YOKOWO CO., LTD.Inventors: Kentaro Hayashi, Toshihiko Fujii
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Publication number: 20220156641Abstract: A first distribution calculation unit 81 calculates a first distribution, which is a distribution of scores obtained by applying each data included in a first group of data to a first model. A second distribution calculation unit 82 calculates a second distribution, which is a distribution of scores obtained by applying each data included in a second group of data to a second model. A transformation unit 83 transforms the second distribution so as to approximate the first distribution. The first group of data and the second group of data are data from the same domain, and a range of scores obtained by applying the data to the first model and a range of scores obtained by applying the data to the second model are identical.Type: ApplicationFiled: March 12, 2020Publication date: May 19, 2022Applicant: NEC CorporationInventor: Toshihiko FUJII
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Publication number: 20210167489Abstract: An antenna device for a vehicle includes a camera that facilitates assembly. The antenna device for a vehicle includes: an antenna case that has a housing space formed therein; an antenna base that is covered with the antenna case from above to form the housing space; an antenna element that is held by the antenna base and housed in the housing space; and a camera that is housed in the housing space The antenna base has a wall portion extending upward. The camera is fixed to the wall portion.Type: ApplicationFiled: April 11, 2019Publication date: June 3, 2021Applicant: YOKOWO CO., LTD.Inventors: Kentaro HAYASHI, Toshihiko FUJII
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Patent number: 10645823Abstract: An electronic device includes: a circuit board; a case within which the circuit board is provided and which has a plurality of first contact parts to contact with the circuit board; a cover which has a plurality of second contact parts to contact with the circuit board; a hook part which is provided to one of the case and the cover; and a receiving part which is provided to other of the case and the cover and which corresponds to the hook part, and the hook part engages with the receiving part, whereby the cover is fitted onto the case and the plurality of first contact parts of the case and the plurality of second contact parts of the cover hold and fix the circuit board interposed therebetween.Type: GrantFiled: February 14, 2019Date of Patent: May 5, 2020Assignee: DENSO TEN LimitedInventors: Nobutaka Watanabe, Yasuaki Takeda, Toshihiko Fujii
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Publication number: 20190313538Abstract: An electronic device includes: a circuit board; a case within which the circuit board is provided and which has a plurality of first contact parts to contact with the circuit board; a cover which has a plurality of second contact parts to contact with the circuit board; a hook part which is provided to one of the case and the cover; and a receiving part which is provided to other of the case and the cover and which corresponds to the hook part, and the hook part engages with the receiving part, whereby the cover is fitted onto the case and the plurality of first contact parts of the case and the plurality of second contact parts of the cover hold and fix the circuit board interposed therebetween.Type: ApplicationFiled: February 14, 2019Publication date: October 10, 2019Applicant: DENSO TEN LimitedInventors: Nobutaka WATANABE, Yasuaki TAKEDA, Toshihiko FUJII
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Patent number: 9821935Abstract: In a state where an engaging tab and a tab receiver are engaged with each other, the engaging tab is elastically deformed and thus a first end of a second portion applies a force to the tab receiver, the force applied toward a first side of a case.Type: GrantFiled: February 24, 2016Date of Patent: November 21, 2017Assignee: FUJITSU TEN LIMITEDInventors: Toshihiko Fujii, Yasuaki Takeda
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Publication number: 20160295724Abstract: In a state where an engaging tab and a tab receiver are engaged with each other, the engaging tab is elastically deformed and thus a first end of a second portion applies a force to the tab receiver, the force applied toward a first side of a case.Type: ApplicationFiled: February 24, 2016Publication date: October 6, 2016Applicant: FUJITSU TEN LIMITEDInventors: Toshihiko FUJII, Yasuaki TAKEDA
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Patent number: 9372404Abstract: The invention provides an organic film composition comprises (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. being 40% or more by mass. There can be provided an organic film composition having not only a high dry etching resistance but also an excellent filling-up or flattening characteristics.Type: GrantFiled: April 30, 2013Date of Patent: June 21, 2016Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takeru Watanabe, Seiichiro Tachibana, Toshihiko Fujii, Kazumi Noda, Toshiharu Yano, Takeshi Kinsho
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Patent number: 9230827Abstract: The present invention provides a method for forming a resist under layer film used in a lithography process, comprising: a process for applying a composition for forming a resist under layer film containing an organic compound having an aromatic unit on a substrate; and a process for heat-treating the resist under layer film applied in an atmosphere whose oxygen concentration is 10% or more at 150° C. to 600° C. for 10 to 600 seconds after heat-treating the same in an atmosphere whose oxygen concentration is less than 10% at 50 to 350° C. There can be provided a method for forming a resist under layer film having excellent filling/flattening properties so that unevenness on a substrate can be flattened even in complex processes such as multi-layer resist method and double patterning.Type: GrantFiled: April 15, 2014Date of Patent: January 5, 2016Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shiori Nonaka, Seiichiro Tachibana, Daisuke Kori, Toshihiko Fujii, Tsutomu Ogihara
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Patent number: 9076738Abstract: The invention provides a composition for a resist underlayer film, the composition for a resist underlayer film to form a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. There can be a composition for a resist underlayer film for a multilayer resist film used in lithography, the composition giving a resist underlayer film having excellent high dry etching resistance, capable of suppressing wiggling during substrate etching with high effectiveness, and capable of avoiding a poisoning problem in upperlayer patterning that uses a chemical amplification resist; a process for forming a resist underlayer film; a patterning process; and a fullerene derivative.Type: GrantFiled: July 14, 2011Date of Patent: July 7, 2015Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takeru Watanabe, Toshihiko Fujii, Takeshi Kinsho, Tsutomu Ogihara
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Publication number: 20140335692Abstract: The present invention provides a method for forming a resist under layer film used in a lithography process, comprising: a process for applying a composition for forming a resist under layer film containing an organic compound having an aromatic unit on a substrate; and a process for heat-treating the resist under layer film applied in an atmosphere whose oxygen concentration is 10% or more at 150° C. to 600° C. for 10 to 600 seconds after heat-treating the same in an atmosphere whose oxygen concentration is less than 10% at 50 to 350° C. There can be provided a method for forming a resist under layer film having excellent filling/flattening properties so that unevenness on a substrate can be flattened even in complex processes such as multi-layer resist method and double patterning.Type: ApplicationFiled: April 15, 2014Publication date: November 13, 2014Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shiori NONAKA, Seiichiro TACHIBANA, Daisuke KORI, Toshihiko FUJII, Tsutomu OGIHARA
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Patent number: 8877422Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, namely, an underlayer film having optimum n-value and k-value, excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.Type: GrantFiled: October 7, 2011Date of Patent: November 4, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Ogihara, Daisuke Kori, Yusuke Biyajima, Toshihiko Fujii, Takeru Watanabe, Takeshi Kinsho
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Patent number: 8853031Abstract: There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.Type: GrantFiled: December 7, 2011Date of Patent: October 7, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Ogihara, Daisuke Kori, Yusuke Biyajima, Takeru Watanabe, Toshihiko Fujii, Takeshi Kinsho
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Patent number: 8835092Abstract: There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.Type: GrantFiled: January 27, 2011Date of Patent: September 16, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Takeru Watanabe, Takeshi Kinsho, Tsutomu Ogihara, Katsuya Takemura, Toshihiko Fujii, Daisuke Kori
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Patent number: 8663898Abstract: There is disclosed A resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), one or more kinds of a compound represented by the following general formula (2), and one or more kinds of a compound, represented by the following general formula (3), and/or an equivalent body thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.Type: GrantFiled: December 5, 2011Date of Patent: March 4, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Ogihara, Takeru Watanabe, Yusuke Biyajima, Daisuke Kori, Takeshi Kinsho, Toshihiko Fujii
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Patent number: 8652757Abstract: A method for forming a resist underlayer film of a multilayer resist film having at least three layers used in a lithography, includes a step of coating a composition for resist underlayer film containing a novolak resin represented by the following general formula (1) obtained by treating a compound having a bisnaphthol group on a substrate; and a step of curing the coated composition for the resist underlayer film by a heat treatment at a temperature above 300° C. and 600° C. or lower for 10 to 600 seconds. A method for forming a resist underlayer film, and a patterning process using the method to form a resist underlayer film in a multilayer resist film having at least three layers used in a lithography, gives a resist underlayer film having a lowered reflectance, a high etching resistance, and a high heat and solvent resistances, especially without wiggling during substrate etching.Type: GrantFiled: February 11, 2013Date of Patent: February 18, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Jun Hatakeyama, Toshihiko Fujii, Tsutomu Ogihara
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Patent number: 8603732Abstract: There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.Type: GrantFiled: December 27, 2010Date of Patent: December 10, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Ogihara, Takeru Watanabe, Takeshi Kinsho, Katsuya Takemura, Toshihiko Fujii, Daisuke Kori