Abstract: An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.

Abstract: The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrate 17 and a second substrate 14 are disposed to face a first main surface 13a of the first substrate 13 and connected to the first main surface 13a of the first substrate 13. With this structure, no internal line or side surface line is necessary, and the structure of the first substrate 13 can be simplified. The length of the line can be decreased to decrease the resistance of the line, and good electrical characteristics can be achieved at low energy consumption. The strains in the semiconductor substrate 17 can also be reduced.

Abstract: An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided.

Abstract: An optical apparatus includes an element substrate on whose surface an optical element is provided; a wiring board disposed so as to face the optical element; a sealing member and a conductive member provided between the element substrate and the wiring board. The sealing member surrounds and hermetically seals the optical element. The conductive member electrically connects the optical element and the wiring board. The wiring board has a light-transmitting area transmitting light to the optical element.

Abstract: The present invention relates to a microelectromechanical device having a simple structure in which strains of the semiconductor substrate can be reduced. Both a semiconductor substrate 17 and a second substrate 14 are disposed to face a first main surface 13a of the first substrate 13 and connected to the first main surface 13a of the first substrate 13. With this structure, no internal line or side surface line is necessary, and the structure of the first substrate 13 can be simplified. The length of the line can be decreased to decrease the resistance of the line, and good electrical characteristics can be achieved at low energy consumption. The strains in the semiconductor substrate 17 can also be reduced.

Abstract: An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided.

Abstract: A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a <001> axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.

Abstract: There is provided a process for preparing a composite material of an oxide crystal film and a substrate by forming a Y123 type oxide crystal film from a solution phase on a substrate using a liquid phase method, wherein problems such as cracking of the oxide crystal film, separation of the oxide crystal film from the substrate, and development of a reaction layer between the substrate and the solution can be minimized. The solvent for forming the solution phase uses either a BaO—CuO—BaF2 system or a BaO—CuO—Ag—BaF2 system, and when the substrate with a seed crystal film bonded to the surface is brought in contact with the solution to form (grow) the oxide crystal film on the substrate, the temperature of the solution is controlled to a temperature of no more than 850° C.

Abstract: In a ZIF connector having first and second connectors, the first connector includes an operating member rotatably held by a first insulator portion holding first contacts arranged adjacent to one another in a predetermined direction. The second connector includes a floating member held by a second insulator portion to be rotatable and slidable in the predetermined direction. The floating member has a first and a second surface which face the first contacts and the operating member, respectively, in a mutually fitted state of the first and the second connectors. Second contacts have one parts held by the first surface and arranged adjacent to one another in the predetermined direction. The floating member is rotated in a first rotating direction to bring the second contacts into contact with the first contacts when the operating member is rotated in the mutually fitted state.

Abstract: A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a <001> axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.

Abstract: In a connector comprising a housing (11) and a contact (21) held by the housing, the contact is brought into contact with a connection object under a pressing force obtained by operating an operating member (61). An elastic member (71) elastically deformable is interposed between the contact and the operating member. The operating member has a first cam surface (63a) for applying the pressing force to the contact with elastic deformation of the elastic member and a second cam surface (63b) for releasing the pressing force. An insulating actuator (51) cooperating with the contact may be interposed between the contact and the elastic member. The elastic member may be a leaf spring member held by the actuator.

Abstract: In a ZIF connector having first and second connectors, the first connector includes an operating member rotatably held by a first insulator portion holding first contacts arranged adjacent to one another in a predetermined direction. The second connector includes a floating member held by a second insulator portion to be rotatable and slidable in the predetermined direction. The floating member has a first and a second surface which face the first contacts and the operating member, respectively, in a mutually fitted state of the first and the second connectors. Second contacts have one parts held by the first surface and arranged adjacent to one another in the predetermined direction. The floating member is rotated in a first rotating direction to bring the second contacts into contact with the first contacts when the operating member is rotated in the mutually fitted state.

Abstract: In a connector comprising a housing (11) and a contact (21) held by the housing, the contact is brought into contact with a connection object under a pressing force obtained by operating an operating member (61). An elastic member (71) elastically deformable is interposed between the contact and the operating member. The operating member has a first cam surface (63a) for applying the pressing force to the contact with elastic deformation of the elastic member and a second cam surface (63b) for releasing the pressing force. An insulating actuator (51) cooperating with the contact may be interposed between the contact and the elastic member. The elastic member may be a leaf spring member held by the actuator.

Abstract: There is provided a process for preparing a composite material of an oxide crystal film and a substrate by forming a Y123 type oxide crystal film from a solution phase on a substrate using a liquid phase method, wherein problems such as cracking of the oxide crystal film, separation of the oxide crystal film from the substrate, and development of a reaction layer between the substrate and the solution can be minimized. The solvent for forming the solution phase uses either a BaO—CuO—BaF2 system or a BaO—CuO—Ag—BaF2 system, and when the substrate with a seed crystal film bonded to the surface is brought in contact with the solution to form (grow) the oxide crystal film on the substrate, the temperature of the solution is controlled to a temperature of no more than 850° C.

Abstract: There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces.

Abstract: There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces.

Abstract: There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces.

Abstract: There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces.

Abstract: A connector engaging/disengaging mechanism comprises a frame member (3) and connector carriers (7) for engaging and disengaging first connector (40) mounted on a printed circuit board (5) fixed onto the frame (3) and second connectors (30) held on said connector carriers (7). The frame member is provided with guide grooves (11) in which the connector carriers (7) are received to be slidable in an engaging direction (A) and a disengaging direction (B). Each of the connector carriers (7) has connector holding portions for holding the second connectors and an operating portion (15) for moving the connector carrier to engage and disengage the second connectors (30) to and from the first connector (40). When the operating portion (15) is manually operated to move the connector carrier in the engaging direction, the second connectors (30) are connected with the first connectors (40).

Abstract: A thermally conductive compound which comprises 15 to 60 volume % of thermoplastic carrier resin consisting of a copolymer of a plasticizer with ethylene or of a polymer of the plasticizer, polyethylene and the copolymer, 40 to 85 volume % of thermally conductive filler particles dispersed in the carrier resin, and 0.5 to 5 weight % (for the filler particles) of a dispersing agent having (a) hydrophilic group(s) and (a) hydrophobic group(s). The thermally conductive compound has a high thermal conductivity and a plasticity in the range of temperatures of −40 to 50° C.