Patents by Inventor Toshihiko Mutsuji
Toshihiko Mutsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11259415Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.Type: GrantFiled: January 21, 2021Date of Patent: February 22, 2022Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hideki Nakamura, Takashi Nauchi, Toshihiko Mutsuji, Ryoichi Suzuki
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Publication number: 20210144863Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.Type: ApplicationFiled: January 21, 2021Publication date: May 13, 2021Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Hideki NAKAMURA, Takashi NAUCHI, Toshihiko MUTSUJI, Ryoichi SUZUKI
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Patent number: 10932372Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.Type: GrantFiled: December 15, 2016Date of Patent: February 23, 2021Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hideki Nakamura, Takashi Nauchi, Toshihiko Mutsuji, Ryoichi Suzuki
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Patent number: 10632492Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.Type: GrantFiled: January 13, 2016Date of Patent: April 28, 2020Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Nauchi, Hideki Nakamura, Toshihiko Mutsuji, Kazuya Kitazawa
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Publication number: 20180376600Abstract: In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.Type: ApplicationFiled: December 15, 2016Publication date: December 27, 2018Applicant: Senju Metal Industry Co., Ltd.Inventors: Hideki NAKAMURA, Takashi NAUCHI, Toshihiko MUTSUJI, Ryoichi SUZUKI
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Patent number: 10026639Abstract: The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG. 1.Type: GrantFiled: July 25, 2013Date of Patent: July 17, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Toshihiko Mutsuji, Kaname Nagata
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Publication number: 20180021803Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.Type: ApplicationFiled: January 13, 2016Publication date: January 25, 2018Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi NAUCHI, Hideki NAKAMURA, Toshihiko MUTSUJI, Kazuya KITAZAWA
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Publication number: 20150179496Abstract: The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in FIG. 1.Type: ApplicationFiled: July 25, 2013Publication date: June 25, 2015Applicant: Senju Metal lndustry Co., Ltd.Inventors: Toshihiko Mutsuji, Kaname Nagata
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Patent number: 8899402Abstract: A positioning jig has a circular part with a diameter that is identical with a diameter of a semiconductor wafer and knock-pins for connecting a periphery of base plate around an opening in a base plate of a conveying tool for a semiconductor wafer. These knock-pins are respectively provided in four blades protruded from predetermined positions of the circular portion at least three directions. When adjusting the projection positions of supporting plates, the knock-pins are fitted into the opening of the base plate of the conveying tool for the semiconductor wafer. The supporting plates moves so that the knock-pins come into contact with an outer edge of the circular part of the prepared positioning jig. The adjusted supporting plates are then fixed on the base plate. The semiconductor wafer is mounted on the adjusted and fixed supporting plates so that the semiconductor wafer is positioned.Type: GrantFiled: October 30, 2013Date of Patent: December 2, 2014Assignee: Senju Metal Industry Co., Ltd.Inventor: Toshihiko Mutsuji
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Publication number: 20140116847Abstract: A positioning jig has a circular part with a diameter that is identical with a diameter of a semiconductor wafer and knock-pins for connecting a periphery of base plate around an opening in a base plate of a conveying tool for a semiconductor wafer. These knock-pins are respectively provided in four blades protruded from predetermined positions of the circular portion at least three directions. When adjusting the projection positions of supporting plates, the knock-pins are fitted into the opening of the base plate of the conveying tool for the semiconductor wafer. The supporting plates moves so that the knock-pins come into contact with an outer edge of the circular part of the prepared positioning jig. The adjusted supporting plates are then fixed on the base plate. The semiconductor wafer is mounted on the adjusted and fixed supporting plates so that the semiconductor wafer is positioned.Type: ApplicationFiled: October 30, 2013Publication date: May 1, 2014Applicant: Senju Metal lndustry Co., Ltd.Inventor: Toshihiko MUTSUJI
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Patent number: 8186563Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.Type: GrantFiled: January 26, 2010Date of Patent: May 29, 2012Assignee: Senju Metal Industry Co., Ltd.Inventors: Takashi Sugihara, Takashi Usuba, Hirokazu Ichikawa, Toshihiko Mutsuji
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Publication number: 20110278348Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.Type: ApplicationFiled: January 26, 2010Publication date: November 17, 2011Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Sugihara, Takashi Usuba, Hirokazu Ichikawa, Toshihiko Mutsuji
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Patent number: 7914595Abstract: In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.Type: GrantFiled: February 6, 2006Date of Patent: March 29, 2011Assignee: Senju Metal Industry Co., Ltd.Inventors: Hideki Nakamura, Tsutomu Hiyama, Toshihiko Mutsuji
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Publication number: 20090282973Abstract: In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.Type: ApplicationFiled: February 6, 2006Publication date: November 19, 2009Inventors: Hideki Nakamura, Tsutomu Hiyama, Toshihiko Mutsuji