Abstract: An electronic component includes: a variable capacitance element; a substrate that has the variable capacitance element; a connection pattern that is electrically connected to the variable capacitance element; and a sealing member that has permittivity lower than that of the substrate and has insulation resistance higher than that of the substrate. At least a part of the connection pattern is disposed on an outer surface of the sealing member.

Abstract: A method for manufacturing a semiconductor device includes: preparing a first substrate; forming a metal film having a Ti layer as the most outermost surface on one surface of the first substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a first pad portion; preparing a second substrate; forming on one surface of the second substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a second pad portion; vacuum annealing the first substrate and the second substrate to remove an oxide film formed on the Ti layer in the first pad portion and the second pad portion; and bonding the first pad portion and the second pad portion together.

Abstract: A method for manufacturing a semiconductor device includes: preparing a first substrate; forming a metal film having a Ti layer as the most outermost surface on one surface of the first substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a first pad portion; preparing a second substrate; forming on one surface of the second substrate a metal film having a Ti layer as the outermost surface; patterning the metal film to form a second pad portion; vacuum annealing the first substrate and the second substrate to remove an oxide film formed on the Ti layer in the first pad portion and the second pad portion; and bonding the first pad portion and the second pad portion together.

Abstract: An optical lens device forms a condenser lens having a first lens of a positive focal length and a second lens of a negative focal length. The first and second lenses are stacked with their optical axis aligned. The first lens has a lens section, edge section and glass member having a linear expansion coefficient smaller than that of the lens section and the edge section to suppress shape change of the first lens due to temperature change of the first lens. The second lens, which is stacked with the first lens, is used for offsetting a change of the positive focal length generated in the first lens when the temperature varies. The glass member having a small linear expansion coefficient suppresses that shape change of the first lens which is not compensated by the second lens.

Abstract: A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.

Abstract: An optical lens device forms a condenser lens having a first lens of a positive focal length and a second lens of a negative focal length. The first and second lenses are stacked with their optical axis aligned. The first lens has a lens section, edge section and glass member having a linear expansion coefficient smaller than that of the lens section and the edge section to suppress shape change of the first lens due to temperature change of the first lens. The second lens, which is stacked with the first lens, is used for offsetting a change of the positive focal length generated in the first lens when the temperature varies. The glass member having a small linear expansion coefficient suppresses that shape change of the first lens which is not compensated by the second lens.

Abstract: A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.

Abstract: In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.

Abstract: A fuel resistance package includes a member to be sealed, which is used in a fuel atmosphere including an aromatic compound or ethanol, and a sealing member, which seals the member to be sealed so that the member to be sealed is protected from fuel in the fuel atmosphere. The sealing member is made of resin containing glycidyl amine-based epoxy resin having a glass-transition temperature of 180° C. or more and a dielectric constant of 3.5 or less as epoxy resin, an amine-based hardener that ring-opens epoxy groups of the epoxy resin to harden the epoxy resin, and filler made of silica.

Abstract: In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.