Abstract: A connector is disclosed that includes a housing and a module assembly disposed inside the housing. The module assembly includes a semiconductor element, a light receiving element, a light emitting element, a positioning plate in which a positioning hole is formed, a three-dimensional optical path component mounted on the positioning plate, and a printed circuit board on which the semiconductor element and the positioning plate are mounted. The three-dimensional optical path component includes a positioning pin and a projection. The light receiving element and the light emitting element are mounted on the positioning plate. The three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts an upper face of the positioning plate.

Abstract: A disclosed card connector includes a housing main unit including a card insertion slot through which a card is inserted into the housing main unit in a predetermined direction; a slider attached to the housing main unit in such a manner as to be slidable along the predetermined direction, wherein the card inserted into the housing main unit is ejected by moving together with the slider as a spring force moves the slider from a position away from the card insertion slot toward the card insertion slot; and a slider braking unit configured to apply a braking force to the slider in such a manner that the braking force increases as the slider moves toward the card insertion slot.

Abstract: A disclosed card connector includes a housing main unit including a card insertion slot through which a card is inserted into the housing main unit in a predetermined direction; a slider attached to the housing main unit in such a manner as to be slidable along the predetermined direction, wherein the card inserted into the housing main unit is ejected by moving together with the slider as a spring force moves the slider from a position away from the card insertion slot toward the card insertion slot; and a slider braking unit configured to apply a braking force to the slider in such a manner that the braking force increases as the slider moves toward the card insertion slot.

Abstract: A semiconductor device mounting socket is disclosed that is fixed to a motherboard and is used for mounting a surface mounted semiconductor device on the motherboard. The semiconductor device mounting socket includes a bracket that is fixed to the motherboard and a pad pitch converting member that is arranged within the bracket. The pad pitch converting member includes an upper face on which semiconductor device side pads are arranged at a first pitch corresponding to the pitch of pads of the surface mounted semiconductor device, and a lower face on which motherboard side pads that are electrically connected to the semiconductor device side pads are arranged at a second pitch that is different from the first pitch. The surface mounted semiconductor device is arranged above the pad pitch converting member within the bracket.

Abstract: An antenna apparatus is disclosed that includes an element member made of sheet metal, a ground member made of sheet metal, and a connection part that is integrally formed with the element member and the ground member.

Abstract: An antenna apparatus is disclosed that includes a synthetic resin case having an antenna element accommodating portion and a ground element accommodating portion, an antenna element made of punched sheet metal that is accommodated within the antenna element accommodating portion, a ground element made of punched sheet metal that is accommodated within the ground element accommodating portion and aligned with the antenna element, a surface mount coaxial connector that is mounted over an interface between the antenna element and the ground element, and a cover that covers the antenna element and the ground element.

Abstract: A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.

Abstract: A disclosed antenna apparatus includes: a punched out antenna element made of a sheet metal; a punched out ground element made of a sheet metal, the ground element facing the antenna element; and a surface mount type coaxial connector mounted across the antenna element and the ground element.

Abstract: An optical waveguide member including a first cladding section, a second cladding section joined to the first cladding section, and core sections formed between the first and second cladding sections. The first cladding section includes a major portion including a first surface and an opposite second surface, and an auxiliary portion formed along one side edge and including a reflecting surface. The core sections includes a first set of core sections formed along a plurality of grooves provided on the first surface of the first cladding section, and a second set of core sections formed along a plurality of grooves provided on the second surface of the first cladding section. Both of light propagating through the first set of core sections and light propagating through the second set of core sections are reflected at right angle by the reflecting surface and propagate through the auxiliary portion of the first cladding section.

Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Abstract: A cable connector type transceiver module is disclosed. Pads for wire soldering are disposed near a card edge connecting section of the tip of a printed circuit board on the printed circuit board. Pairs of wires of a cable for balanced transmission are extended in the direction of the card edge connecting section over a control IC package. Signal wires at the tips of insulation covered signal wires of the pairs of wires are soldered to the pads for wire soldering at the position near the card edge connecting section rather than near the control IC package.

Abstract: A semiconductor device mounting socket is disclosed that is fixed to a motherboard and is used for mounting a surface mounted semiconductor device on the motherboard. The semiconductor device mounting socket includes a bracket that is fixed to the motherboard and a pad pitch converting member that is arranged within the bracket. The pad pitch converting member includes an upper face on which semiconductor device side pads are arranged at a first pitch corresponding to the pitch of pads of the surface mounted semiconductor device, and a lower face on which motherboard side pads that are electrically connected to the semiconductor device side pads are arranged at a second pitch that is different from the first pitch. The surface mounted semiconductor device is arranged above the pad pitch converting member within the bracket.

Abstract: A connector is disclosed that includes a housing and a module assembly disposed inside the housing. The module assembly includes a semiconductor element, a light receiving element, a light emitting element, a positioning plate in which a positioning hole is formed, a three-dimensional optical path component mounted on the positioning plate, and a printed circuit board on which the semiconductor element and the positioning plate are mounted. The three-dimensional optical path component includes a positioning pin and a projection. The light receiving element and the light emitting element are mounted on the positioning plate. The three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts an upper face of the positioning plate.

Abstract: A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.

Abstract: A transceiver module for mounting to an information processing apparatus is disclosed. The transceiver module includes a housing including a cover part provided at a front side of the transceiver module, a data transmission/reception part mounted to the housing, the data transmission/reception part, a connector installed in the cover part of the housing, and a latch mechanism including an engagement pawl part engaged with the housing, the engagement pawl part including a first cam part, a spring member urging from the housing and abutting the engagement pawl part in a first width direction of the transceiver module, and a pull sleeve having a second cam part for pressing against the first cam part when the pull sleeve is pulled in a longitudinal direction of the transceiver module.

Abstract: The present invention provides a contact module, a connector, and a method of producing the contact module. The contact module includes a base and a plurality of contacts. Each of the contacts is bent at both ends in one direction. In a section view of each of the contacts, an insulating film, a barrier film, a plating base film, and a plating film are formed on a sheet in this order. The base that bridges the contacts has only the insulating film laminated on the sheet. The plating film has contact points at the bent parts, and a circuit pattern that is interposed between the contact points. The circuit pattern functions as a signal line.

Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Abstract: A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

Abstract: The present invention provides a contact module, a connector, and a method of producing the contact module. The contact module includes a base and a plurality of contacts. Each of the contacts is bent at both ends in one direction. In a section view of each of the contacts, an insulating film, a barrier film, a plating base film, and a plating film are formed on a sheet in this order. The base that bridges the contacts has only the insulating film laminated on the sheet. The plating film has contact points at the bent parts, and a circuit pattern that is interposed between the contact points. The circuit pattern functions as a signal line.

Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.