Patents by Inventor Toshihiro Nagaya
Toshihiro Nagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220115302Abstract: A semiconductor device includes: first and second semiconductor elements each having two electrodes respectively disposed on two surfaces; two first terminals respectively connected to the two electrodes of the first semiconductor element and arranged side by side in one direction; two second terminals respectively connected to the two electrodes of the second semiconductor element, and arranged side by side in the one direction to be adjacent to the two first terminals; and a sealing resin portion covering the first and second semiconductor elements and the first and second terminals in a state where facing surfaces of the first and second terminals are exposed from the sealing resin portion. The facing surfaces of the two first terminals have different area ratios, the facing surfaces of the two second terminals have different area ratios, and one of the first terminals is arranged adjacent to both the two second terminals.Type: ApplicationFiled: December 21, 2021Publication date: April 14, 2022Inventors: Akihiro FUKATSU, Noboru NAGASE, Toshihiro NAGAYA
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Patent number: 10109557Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.Type: GrantFiled: December 11, 2015Date of Patent: October 23, 2018Assignee: DENSO CORPORATIONInventors: Tetsuto Yamagishi, Toshihiro Nagaya, Masayuki Takenaka, Shinji Hiramitsu
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Patent number: 9922906Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.Type: GrantFiled: May 21, 2014Date of Patent: March 20, 2018Assignee: DENSO CORPORATIONInventors: Toshihiro Nagaya, Nobuhiko Okada, Hiromasa Hayashi
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Patent number: 9832872Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.Type: GrantFiled: September 14, 2015Date of Patent: November 28, 2017Assignee: DENSO CORPORATIONInventors: Tetsuto Yamagishi, Masayuki Takenaka, Toshihiro Nagaya, Shinji Hiramitsu
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Publication number: 20170330818Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.Type: ApplicationFiled: December 11, 2015Publication date: November 16, 2017Inventors: Tetsuto YAMAGISHI, Toshihiro NAGAYA, Masayuki TAKENAKA, Shinji HIRAMITSU
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Publication number: 20170135210Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.Type: ApplicationFiled: September 14, 2015Publication date: May 11, 2017Inventors: Tetsuto YAMAGISHI, Masayuki TAKENAKA, Toshihiro NAGAYA, Shinji HIRAMITSU
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Publication number: 20140347838Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.Type: ApplicationFiled: May 21, 2014Publication date: November 27, 2014Applicant: DENSO CORPORATIONInventors: Toshihiro NAGAYA, Nobuhiko OKADA, Hiromasa HAYASHI
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Patent number: 8179688Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.Type: GrantFiled: October 19, 2010Date of Patent: May 15, 2012Assignee: DENSO CORPORATIONInventors: Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama, Koji Numazaki, Norihisa Imaizumi
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Publication number: 20110044009Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.Type: ApplicationFiled: October 19, 2010Publication date: February 24, 2011Applicant: DENSO CORPORATIONInventors: Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama, Koji Numazaki, Norihisa Imaizumi
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Patent number: 7843700Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.Type: GrantFiled: April 14, 2005Date of Patent: November 30, 2010Assignee: DENSO CORPORATIONInventors: Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama, Koji Numazaki, Norihisa Imaizumi
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Publication number: 20070075419Abstract: A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electronic chip drives and controls each semiconductor element through the electric circuit. The first to fourth semiconductor elements are arranged to be a stack construction in the resin mold. The first to fourth semiconductor elements provide a H-bridge circuit. Each of the first and second electrodes in each semiconductor element is directly connected to the metallic lead so that heat generated in the semiconductor element is radiated through the metallic lead.Type: ApplicationFiled: September 5, 2006Publication date: April 5, 2007Applicant: DENSO CORPORATIONInventors: Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Yukihiro Maeda, Norihisa Imaizumi, Yasutomi Asai, Yasutomi Asai
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Publication number: 20050231925Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.Type: ApplicationFiled: April 14, 2005Publication date: October 20, 2005Inventors: Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama, Koji Numazaki, Norihisa Imaizumi, Hiromasa Hayashi, Akihiro Fukatsu, Hirokazu Kasuya, Nobumasa Ueda