Patents by Inventor Toshihiro Ogihara

Toshihiro Ogihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with metallic protective film
    Patent number: 5923072
    Abstract: A semiconductor device has a metal pattern composed of a material reacting on water and a metal protective film formed between an intrusion path of water and the metal pattern on the surface of a part of the metal pattern. The metal pattern is composed of a refractory metal, a refractory metal compound or aluminum, and the metal protective film is formed of any of gold, platinum, palladium, gold alloy, platinum alloy, palladium alloy and lanthanum hexaboron.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: July 13, 1999
    Assignee: Fujitsu Limited
    Inventors: Jun Wada, Toshihiro Ogihara